JPH0315654B2 - - Google Patents
Info
- Publication number
- JPH0315654B2 JPH0315654B2 JP58112232A JP11223283A JPH0315654B2 JP H0315654 B2 JPH0315654 B2 JP H0315654B2 JP 58112232 A JP58112232 A JP 58112232A JP 11223283 A JP11223283 A JP 11223283A JP H0315654 B2 JPH0315654 B2 JP H0315654B2
- Authority
- JP
- Japan
- Prior art keywords
- group
- compound
- groups
- epoxy
- curing agent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Epoxy Resins (AREA)
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11223283A JPS604524A (ja) | 1983-06-22 | 1983-06-22 | エポキシ樹脂用潜在性硬化剤 |
DE3382819T DE3382819T2 (de) | 1982-09-21 | 1983-09-15 | Latente Härter für Epoxyharze |
DE3382736T DE3382736T2 (de) | 1982-09-21 | 1983-09-15 | Latente Härter für Epoxyharze. |
EP83305398A EP0104837B1 (en) | 1982-09-21 | 1983-09-15 | Latent curing agents for epoxy resins |
EP93109367A EP0569044B1 (en) | 1982-09-21 | 1983-09-15 | Latent curing agents for epoxy resins |
US06/532,901 US4542202A (en) | 1982-09-21 | 1983-09-16 | Latent curing agents for epoxy resins |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11223283A JPS604524A (ja) | 1983-06-22 | 1983-06-22 | エポキシ樹脂用潜在性硬化剤 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS604524A JPS604524A (ja) | 1985-01-11 |
JPH0315654B2 true JPH0315654B2 (d) | 1991-03-01 |
Family
ID=14581546
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11223283A Granted JPS604524A (ja) | 1982-09-21 | 1983-06-22 | エポキシ樹脂用潜在性硬化剤 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS604524A (d) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS56152992A (en) * | 1980-04-28 | 1981-11-26 | Hitachi Cable Ltd | Tin-lead alloy plated lead wire |
JPS63183920A (ja) * | 1987-01-27 | 1988-07-29 | Somar Corp | 液状エポキシ樹脂組成物およびその製造方法 |
JPS6436672A (en) * | 1987-07-31 | 1989-02-07 | Somar Corp | Epoxy polymer composition for bonding chip part |
JPH03107646A (ja) * | 1989-09-19 | 1991-05-08 | Sumitomo Bakelite Co Ltd | 回転電動子のバランシング用材料 |
JPH03122114A (ja) * | 1989-10-06 | 1991-05-24 | Somar Corp | 硬化剤組成物、その製造方法及び熱硬化性エポキシ樹脂組成物 |
JP4906071B2 (ja) * | 2006-04-28 | 2012-03-28 | 株式会社Adeka | エポキシ樹脂用硬化剤組成物およびそれを含有してなる硬化性エポキシ樹脂組成物 |
US20110220512A1 (en) * | 2010-03-15 | 2011-09-15 | Rohm And Haas Electronic Materials Llc | Plating bath and method |
JP2014185296A (ja) * | 2013-03-25 | 2014-10-02 | Asahi Kasei E-Materials Corp | 液状樹脂組成物及び加工品 |
JP7198644B2 (ja) | 2018-11-27 | 2023-01-04 | 住友化学株式会社 | エポキシ樹脂組成物及びその硬化物 |
US20230212385A1 (en) | 2020-05-27 | 2023-07-06 | Sumitomo Chemical Company, Limited | Epoxy resin composition and cured product thereof |
JP2022175617A (ja) | 2021-05-14 | 2022-11-25 | 住友化学株式会社 | エポキシ樹脂組成物及びその硬化物 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5831733B2 (ja) * | 1982-03-15 | 1983-07-08 | 株式会社日立製作所 | 集積回路装置 |
-
1983
- 1983-06-22 JP JP11223283A patent/JPS604524A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS604524A (ja) | 1985-01-11 |
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