JPH026222B2 - - Google Patents

Info

Publication number
JPH026222B2
JPH026222B2 JP56204072A JP20407281A JPH026222B2 JP H026222 B2 JPH026222 B2 JP H026222B2 JP 56204072 A JP56204072 A JP 56204072A JP 20407281 A JP20407281 A JP 20407281A JP H026222 B2 JPH026222 B2 JP H026222B2
Authority
JP
Japan
Prior art keywords
defect
free layer
oxygen
support substrate
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP56204072A
Other languages
English (en)
Japanese (ja)
Other versions
JPS58103124A (ja
Inventor
Akihiro Shibatomi
Akira Oosawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP20407281A priority Critical patent/JPS58103124A/ja
Publication of JPS58103124A publication Critical patent/JPS58103124A/ja
Publication of JPH026222B2 publication Critical patent/JPH026222B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/322—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to modify their internal properties, e.g. to produce internal imperfections
    • H01L21/3221—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to modify their internal properties, e.g. to produce internal imperfections of silicon bodies, e.g. for gettering

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
JP20407281A 1981-12-16 1981-12-16 半導体装置の製造方法 Granted JPS58103124A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP20407281A JPS58103124A (ja) 1981-12-16 1981-12-16 半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP20407281A JPS58103124A (ja) 1981-12-16 1981-12-16 半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JPS58103124A JPS58103124A (ja) 1983-06-20
JPH026222B2 true JPH026222B2 (enrdf_load_stackoverflow) 1990-02-08

Family

ID=16484295

Family Applications (1)

Application Number Title Priority Date Filing Date
JP20407281A Granted JPS58103124A (ja) 1981-12-16 1981-12-16 半導体装置の製造方法

Country Status (1)

Country Link
JP (1) JPS58103124A (enrdf_load_stackoverflow)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6116532A (ja) * 1984-07-03 1986-01-24 Matsushita Electric Ind Co Ltd 半導体基板およびその製造方法
JPS6194176A (ja) * 1984-10-15 1986-05-13 N T C Densan Service:Kk 帳票発行装置
JPS62181421A (ja) * 1986-02-04 1987-08-08 Mitsubishi Electric Corp シリコンエピタキシヤルウエハの製造方法
US4897368A (en) * 1987-05-21 1990-01-30 Matsushita Electric Industrial Co., Ltd. Method of fabricating a polycidegate employing nitrogen/oxygen implantation
JPH02306622A (ja) * 1989-05-22 1990-12-20 Oki Electric Ind Co Ltd 半導体装置及びその製造方法
JPH11145146A (ja) * 1997-11-10 1999-05-28 Nec Corp 半導体基板及びその製造方法
US6830986B2 (en) 2002-01-24 2004-12-14 Matsushita Electric Industrial Co., Ltd. SOI semiconductor device having gettering layer and method for producing the same
JP2024134795A (ja) * 2023-03-22 2024-10-04 信越半導体株式会社 エピタキシャルウェーハ及びｓｏｉウェーハ並びにそれらの製造方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5787119A (en) * 1980-11-19 1982-05-31 Toshiba Corp Manufacture of semiconductor device

Also Published As

Publication number Publication date
JPS58103124A (ja) 1983-06-20

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