JPH0260240B2 - - Google Patents

Info

Publication number
JPH0260240B2
JPH0260240B2 JP61160771A JP16077186A JPH0260240B2 JP H0260240 B2 JPH0260240 B2 JP H0260240B2 JP 61160771 A JP61160771 A JP 61160771A JP 16077186 A JP16077186 A JP 16077186A JP H0260240 B2 JPH0260240 B2 JP H0260240B2
Authority
JP
Japan
Prior art keywords
copper
current
layer
copper foil
bath
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP61160771A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6317597A (ja
Inventor
Koji Nakatsugawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Furukawa Circuit Foil Co Ltd
Original Assignee
Furukawa Circuit Foil Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Furukawa Circuit Foil Co Ltd filed Critical Furukawa Circuit Foil Co Ltd
Priority to JP16077186A priority Critical patent/JPS6317597A/ja
Publication of JPS6317597A publication Critical patent/JPS6317597A/ja
Publication of JPH0260240B2 publication Critical patent/JPH0260240B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal

Landscapes

  • Manufacturing Of Printed Wiring (AREA)
  • Electroplating Methods And Accessories (AREA)
JP16077186A 1986-07-10 1986-07-10 印刷回路用銅箔及びその製造方法 Granted JPS6317597A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16077186A JPS6317597A (ja) 1986-07-10 1986-07-10 印刷回路用銅箔及びその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16077186A JPS6317597A (ja) 1986-07-10 1986-07-10 印刷回路用銅箔及びその製造方法

Publications (2)

Publication Number Publication Date
JPS6317597A JPS6317597A (ja) 1988-01-25
JPH0260240B2 true JPH0260240B2 (enrdf_load_stackoverflow) 1990-12-14

Family

ID=15722100

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16077186A Granted JPS6317597A (ja) 1986-07-10 1986-07-10 印刷回路用銅箔及びその製造方法

Country Status (1)

Country Link
JP (1) JPS6317597A (enrdf_load_stackoverflow)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5116943B2 (ja) * 2003-02-04 2013-01-09 古河電気工業株式会社 高周波回路用銅箔及びその製造方法
JP2011162860A (ja) * 2010-02-12 2011-08-25 Furukawa Electric Co Ltd:The 表面粗化銅箔とその製造方法及び銅張積層板
US20130071755A1 (en) * 2010-03-01 2013-03-21 Furukawa Electric Co., Ltd. Surface treatment method for copper foil, surface-treated copper foil, and copper foil for negative electrode collector of lithium ion secondary battery
JP4948654B2 (ja) * 2010-03-01 2012-06-06 古河電気工業株式会社 リチウムイオン二次電池の負極集電体用銅箔、その製造方法、及びリチウムイオン二次電池の負極電極、その製造方法
JP4948656B2 (ja) * 2010-03-17 2012-06-06 古河電気工業株式会社 二次電池集電体用穴あき粗化処理銅箔、その製造方法及びリチウムイオン二次電池負極電極
JP5019654B2 (ja) * 2010-03-31 2012-09-05 古河電気工業株式会社 リチウムイオン二次電池の負極集電体用銅（合金）箔、その製造方法、及びリチウムイオン二次電池の負極電極、その製造方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58164797A (ja) * 1982-03-05 1983-09-29 オリン・コ−ポレ−シヨン 結合強さを改良する銅の電気化学的処理

Also Published As

Publication number Publication date
JPS6317597A (ja) 1988-01-25

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