JPH0257018B2 - - Google Patents
Info
- Publication number
- JPH0257018B2 JPH0257018B2 JP59269869A JP26986984A JPH0257018B2 JP H0257018 B2 JPH0257018 B2 JP H0257018B2 JP 59269869 A JP59269869 A JP 59269869A JP 26986984 A JP26986984 A JP 26986984A JP H0257018 B2 JPH0257018 B2 JP H0257018B2
- Authority
- JP
- Japan
- Prior art keywords
- prepreg
- glass
- resin
- fabric base
- nonwoven fabric
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000011521 glass Substances 0.000 claims description 21
- 239000012792 core layer Substances 0.000 claims description 11
- 239000002344 surface layer Substances 0.000 claims description 11
- 239000004744 fabric Substances 0.000 claims description 10
- 239000004745 nonwoven fabric Substances 0.000 claims description 10
- 238000001879 gelation Methods 0.000 claims description 8
- 239000002131 composite material Substances 0.000 claims description 6
- 238000000465 moulding Methods 0.000 claims description 5
- 238000004519 manufacturing process Methods 0.000 claims description 3
- 238000000034 method Methods 0.000 claims 1
- 238000003825 pressing Methods 0.000 claims 1
- 229920005989 resin Polymers 0.000 description 14
- 239000011347 resin Substances 0.000 description 14
- 239000000463 material Substances 0.000 description 12
- 238000001035 drying Methods 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- 239000002966 varnish Substances 0.000 description 2
- 229920003043 Cellulose fiber Polymers 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000007872 degassing Methods 0.000 description 1
- 230000032798 delamination Effects 0.000 description 1
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 1
- XXBDWLFCJWSEKW-UHFFFAOYSA-N dimethylbenzylamine Chemical compound CN(C)CC1=CC=CC=C1 XXBDWLFCJWSEKW-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000499 gel Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/036—Multilayers with layers of different types
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
Landscapes
- Laminated Bodies (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59269869A JPS61146537A (ja) | 1984-12-21 | 1984-12-21 | コンポジツト積層板の製造法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59269869A JPS61146537A (ja) | 1984-12-21 | 1984-12-21 | コンポジツト積層板の製造法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61146537A JPS61146537A (ja) | 1986-07-04 |
| JPH0257018B2 true JPH0257018B2 (fr) | 1990-12-03 |
Family
ID=17478340
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59269869A Granted JPS61146537A (ja) | 1984-12-21 | 1984-12-21 | コンポジツト積層板の製造法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61146537A (fr) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH056315U (ja) * | 1991-07-06 | 1993-01-29 | 巧 岡田 | 測量用の鋲 |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH074915B2 (ja) * | 1990-06-15 | 1995-01-25 | 松下電工株式会社 | 多層配線板の製造方法 |
-
1984
- 1984-12-21 JP JP59269869A patent/JPS61146537A/ja active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH056315U (ja) * | 1991-07-06 | 1993-01-29 | 巧 岡田 | 測量用の鋲 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61146537A (ja) | 1986-07-04 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |