JPH0244793A - 電子回路装置 - Google Patents

電子回路装置

Info

Publication number
JPH0244793A
JPH0244793A JP63196545A JP19654588A JPH0244793A JP H0244793 A JPH0244793 A JP H0244793A JP 63196545 A JP63196545 A JP 63196545A JP 19654588 A JP19654588 A JP 19654588A JP H0244793 A JPH0244793 A JP H0244793A
Authority
JP
Japan
Prior art keywords
reinforcing plate
flexible board
soldering
flexible
bonded
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP63196545A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0519314B2 (pm
Inventor
Takahiro Manabe
真鍋　高広
Yasuto Osada
長田　康人
Toshiyuki Kawaguchi
川口　利幸
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP63196545A priority Critical patent/JPH0244793A/ja
Publication of JPH0244793A publication Critical patent/JPH0244793A/ja
Publication of JPH0519314B2 publication Critical patent/JPH0519314B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof

Landscapes

  • Structure Of Printed Boards (AREA)
JP63196545A 1988-08-05 1988-08-05 電子回路装置 Granted JPH0244793A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP63196545A JPH0244793A (ja) 1988-08-05 1988-08-05 電子回路装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP63196545A JPH0244793A (ja) 1988-08-05 1988-08-05 電子回路装置

Publications (2)

Publication Number Publication Date
JPH0244793A true JPH0244793A (ja) 1990-02-14
JPH0519314B2 JPH0519314B2 (pm) 1993-03-16

Family

ID=16359523

Family Applications (1)

Application Number Title Priority Date Filing Date
JP63196545A Granted JPH0244793A (ja) 1988-08-05 1988-08-05 電子回路装置

Country Status (1)

Country Link
JP (1) JPH0244793A (pm)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008263122A (ja) * 2007-04-13 2008-10-30 Oki Electric Ind Co Ltd 光モジュール装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008263122A (ja) * 2007-04-13 2008-10-30 Oki Electric Ind Co Ltd 光モジュール装置

Also Published As

Publication number Publication date
JPH0519314B2 (pm) 1993-03-16

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