JPH0244793A - 電子回路装置 - Google Patents
電子回路装置Info
- Publication number
- JPH0244793A JPH0244793A JP19654588A JP19654588A JPH0244793A JP H0244793 A JPH0244793 A JP H0244793A JP 19654588 A JP19654588 A JP 19654588A JP 19654588 A JP19654588 A JP 19654588A JP H0244793 A JPH0244793 A JP H0244793A
- Authority
- JP
- Japan
- Prior art keywords
- reinforcing plate
- flexible board
- soldering
- flexible
- bonded
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
Landscapes
- Structure Of Printed Boards (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19654588A JPH0244793A (ja) | 1988-08-05 | 1988-08-05 | 電子回路装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19654588A JPH0244793A (ja) | 1988-08-05 | 1988-08-05 | 電子回路装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0244793A true JPH0244793A (ja) | 1990-02-14 |
JPH0519314B2 JPH0519314B2 (enrdf_load_stackoverflow) | 1993-03-16 |
Family
ID=16359523
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP19654588A Granted JPH0244793A (ja) | 1988-08-05 | 1988-08-05 | 電子回路装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0244793A (enrdf_load_stackoverflow) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008263122A (ja) * | 2007-04-13 | 2008-10-30 | Oki Electric Ind Co Ltd | 光モジュール装置 |
-
1988
- 1988-08-05 JP JP19654588A patent/JPH0244793A/ja active Granted
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008263122A (ja) * | 2007-04-13 | 2008-10-30 | Oki Electric Ind Co Ltd | 光モジュール装置 |
Also Published As
Publication number | Publication date |
---|---|
JPH0519314B2 (enrdf_load_stackoverflow) | 1993-03-16 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20080316 Year of fee payment: 15 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20090316 Year of fee payment: 16 |
|
EXPY | Cancellation because of completion of term | ||
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20090316 Year of fee payment: 16 |