JPH0234685A - 被覆された炭化ケイ素研摩粒子 - Google Patents

被覆された炭化ケイ素研摩粒子

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Publication number
JPH0234685A
JPH0234685A JP1150339A JP15033989A JPH0234685A JP H0234685 A JPH0234685 A JP H0234685A JP 1150339 A JP1150339 A JP 1150339A JP 15033989 A JP15033989 A JP 15033989A JP H0234685 A JPH0234685 A JP H0234685A
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JP
Japan
Prior art keywords
abrasive
abrasive particles
silicon carbide
metal oxide
hydrophilic metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1150339A
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English (en)
Inventor
Reiner Kunz
ライナー　クンツ
Rainer Dietrich
ライナー　ディートリッヒ
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lonza AG
Original Assignee
Lonza AG
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Filing date
Publication date
Application filed by Lonza AG filed Critical Lonza AG
Publication of JPH0234685A publication Critical patent/JPH0234685A/ja
Pending legal-status Critical Current

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Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【発明の詳細な説明】 本発明は、炭化ケイ素を主材とする表面被１ｊＪＯ工を
施した研摩粒子、およびその合成樹脂またはセラミック
スで結合した研摩板（砥石）への使用に関する。
炭化ケイ素は最も重要な研摩剤の一つであり、とくに硬
くて脆い材料の研摩と切断に用いられる。
この炭化ケイ素は、おだやかな研摩材および下地つきの
研摩材として好適であり、砥石または切断ディスクに使
用される。　研摩性と、とくにその摩滅度すなわち研摩
体の有効寿命は、研摩体自体の特性はもちろんでおるが
、多くはその製造技術および接合剤による研摩粒子の結
合の強さに依存する。　とくに合成樹脂で固めた研摩材
では、−般に接合剤中の炭化ケイ素粒子の結合強度が、
その研摩性と摩滅度を決定する。　そのため、きわめて
滑らかな表面をもつ炭化ケイ素の結合強度を改良すべく
、多くの試みがなされている。
最もよく用いられる方法は、粒子に釉薬をかけるセラミ
ックス被覆法である。　このような方法は、たとえばア
メリカ特許第１，９１０，４４４号明細書に記載されて
いる。　また、たとえばアメリカ特許第２．５２７．０
４４＠明細書に開示されているように、研摩粒子を下地
にして粒状の溶融性物質で被覆し、けば立たせる方法も
ある。
しかし、このような方法はいずれも多くの欠点を抱えて
いる。　これらは焼成または焼結などの多くの工程を要
し、多大の時間とエネルギーを必要とする。　ざらに、
焼結により凝集塊が生成するから、フルイ分けや機械的
な粉砕をしなければならず、それによって均一な被覆が
一部損われる。
このように一定の粒子径の中に凝集塊ができるから、こ
の方法はもはや採用できない。
セラミックスで固めた研摩体の場合には、セラミックス
で被覆した研摩体はあまり意味がない。
その理由は、１１５０〜１４００℃での研摩体の焼成に
よって被覆中の接合剤が再び溶融し、被覆された細粒（
たとえばＦｅ２０３）とともにセラミックス物質内に入
り込み、そこでわずられしい変化、たとえば細孔の形成
や変色が起こるからである。　研摩体の使用に際し、と
くに乾燥研摩の際には、接合剤が発熱により軟化し、研
摩粒子がはじけるおそれがある。
本発明の課題は、上記のような欠点がなく、合成樹脂ま
たはセラミックスを用いて結合した研摩体の結合力が改
善された、炭化ケイ素を主材とする表面被覆を施した研
摩粒子を提供することにある。
意外なことに、上記の課題は、本発明に従って、研摩粒
子を接合剤を使わないで高分散性の親水性金属酸化物で
被覆することにより解決される。
炭化ケイ素研摩粒子は、その粒子径がＦＥＰＡ規格によ
るマクロおよびミクロの山域にわたって分布している。
　高分散性の親水性金属酸化物としては、たとえばエア
ロジル（ＡｅｒＯ３ｉｌＲ＞のような二酸化ケイ素、酸
化アルミニウムまたは二酸化チタンを、それぞれ単独で
、または混合して用いる。　この高分散性の親水性金属
酸化物は、研摩粒子に対して重量で０．０１〜５％、好
ましくは０．１〜１．０％被覆する。　高分散性の親水
性金属酸化物の一次粒子径（ｄ５０値）は、１〜５ＱＱ
ｎｍ１好ましくは５〜５０ｎｍであって、その比表面積
（ＢＥＴ法ニヨル）ハ、５〜５００ｍ／ｇ、好ましくは
５０〜４００尻／ｇである。
研摩粒子に高分散性の親水性金属酸化物を被覆するには
、研摩粒子を、上記金属酸化物と乾燥状態で混合するか
、あるいは上記金属酸化物を蒸発可能な液体に懸濁させ
た液と混合して乾燥すればよい。
蒸発可能な液体としては、通常、水が用いられるが、極
性または無極性の他の液体、たとえば低級アルコール、
ケトン、エステル、エーテルまたは炭化水素、これらの
混合液などを用いることもできる。
混合は乾燥状態で行なうのが好ましい。　混合機として
は、回転ドラムミキサー、二重円錐ミキサーなどの自由
落下ミキサーや、シャベルミキサ、パドルミキサーのよ
うな回転混合手段を備えたミキサーが好適である。
本発明による研摩粒子は、たとえば砥石または切断ディ
スクのような、合成樹脂またはセラミックスで固めた研
摩体の製造に適している。
本発明の態様として、研摩粒子を他の研摩粒子たとえば
ダイアモンド粒子または等軸晶窒化ホウ素から成る研摩
粒子と組み合せて、研摩体を製造するのに使用すること
ができる。　このように、本発明による炭化ケイ素系研
摩粒子は、研摩体の研摩領域における基材粒子としてだ
けでなく、複合母材の強化および放熱にも用いることが
できる。
以下、実施例により本発明およびその効果を具体的に説
明する。
実施例１ 一定量の炭化ケイ素「カーボブラン （Ｃａｒｂｏｇｒａｎ）　ＲデュンケルＦ２４」。（ロ
ング・ウエルケ　（３ｍｂ）−１，ヴフルトシュート）
をとり、これを二つに分けて、その一方を本発明に従っ
て、０．５重量％の親水性Ａ、１１２０３（−次粒子径
ｄ　５０＝　２０　ｎｍ、比表面積（ＢＥＴ）＝１００
±１５７Ｉｉ／ｇ）とともに、浮遊ミキサーで乾燥混合
した。　この試料を用いて、一定条件の下に切断ディス
クを製作した。
原料（粒子７３重量％、充填材（クリオライト）１３重
量％、フェノール樹脂の粉末および液体１４重量％）に
流動性のフェノール樹脂を加えて均一な半ペースト状と
し、二つ割の金型で２００　Ｋｓ／ａＡの圧力で加圧成
形した。　切断ディスクの外側のけば立ちを除去するた
め、常法に従って１９０℃の炉で処理した。
研摩性の試験は、市販の研削装置を用いて、断面８０Ｘ
６０ｓの、振動圧縮工法によるコンクリートバーの研摩
を行なって確めた。　ここでは各切断ディスクにつき５
回の切断試験を行ない、その研摩性を示すものとして切
断ディスクの直径の減少量（履）を測定した。
結果を第１表に示す。
第 表 順相（クリオライト）８重量％、フェノール樹脂の粉末
および液体１４重量％。
その結果を第２表に示す。
第　　　２　　　表 実施例２ 実施例１と同様に切断ディスクを製作して、その試験を
行なった。
切断ディスクの組成：研摩粒子７８重量％、充市販の炭
化ケイ素「カーボブラン」Ｒ（ゴットハルト　ウエルケ
、ボデイオ；粒径０．４〜ｉｍ＞を四つに分けた。　そ
のうちの一つには標準粒子による処理を行なわない。　
他の三つについては、本発明に従って、それぞれ ａ）　親水性Ａ、１２２０３０．５重量％（ｄ５０＝２
Ｑｎｍ、比表面積（ＢＥＴ＞＝１００±１５ＴＩｉ／ｇ
） ｂ）　親水性Ｔ！　０２０．５重量％（ｄ５０＝２１ｎ
ｍ、比表面積（ＳＥＴ＞＝５０±１！Ｍ／９）Ｃ）　親
水性５１０２０．５重量％（ｄ　５０＝　７　ｎｍ。
比表面積（ＢＥＴ）＝３８０±３０ゴ／１を浮遊ミキサ
ーで混合し、被覆処理を行なった。
そのほかは、実施例１と同様に処理した。
その結果の平均値を第３表に示す。
第 表 市販の炭化ケイ素「カーボブランＪＲＦ２４゜ロング・
リミテッド、ヴアルトシュート）をとり、これを二分し
、その一方を従来例に従ってセラミックスを用いて被覆
した。
配合組成： １５０Ｋｙ　　　　炭化ケイ素Ｆ２４ ９００　ｃｍ　　　　ナトリウム水ガラス（タイプ３７
／４０．）７ン・ベージ　ラント　　　Ｃｏ、、　　ｄ
２０＝　　１　　、　３　５　　ｇ／ｃｍ３　）１００
００ｍ３水 １６００ｙ　　　Ｍ化鉄「パイフエロツクス」（Ｂａｙ
ｆｅｒｒｏｘ）Ｒ１８０，（バーｉ’工／Ｌｚ＞８００
ｇ　　　釉薬フリット （タイプＡ　８９６２　Ｄ　、ライムボルト　ラント　
シュトリック） 釉薬フリットを水および水ガラスと均一に混ぜて、懸濁
液を調製した。　研摩粒子を回転ドラムミキサーを使っ
て上記懸濁液で湿らせ、上記酸化鉄を４回にわけて添加
し、混合物を１０〜１５分間ミキサーで均一に混合した
。　このようにして酸化鉄と接合剤で表面被覆したもの
を、ロータリーキルン中７４０℃で処理し、平均滞留時
間１０〜１５分間で焼成した。
切断ディスクの製作および試験は、実施例１と同様に行
なった。
その結果を第４表に示す（平均値）。
第 表

Claims (8)

    【特許請求の範囲】
  1. （１）研摩粒子に対して重量比で０．０１〜５５％の二
    酸化ケイ素、酸化アルミニウムおよび二酸化チタンから
    なる群から選んだ高分散性の親水性金属酸化物を用いて
    、接合剤を用いず、かつ溶融しないで被覆したことを特
    徴とする炭化ケイ素を主材とする研摩粒子。
  2. （２）研摩粒子が重量比で０．１〜１％の高分散性の親
    水性金属酸化物で被覆されている請求項１の研摩粒子。
  3. （３）高分散性の親水性金属酸化物の一次粒子の粒径が
    ｄ＿５＿０値で１〜５００ｎｍであつて、比表面積が５
    〜５００ｍ＾２／ｇ（ＢＥＴ法）である請求項１または
    ２の研摩粒子。
  4. （４）高分散性の親水性金属酸化物の一次粒子の粒子径
    がｄ＿５＿０値で５〜５０ｎｍであつて、比表面積が５
    ０〜４００ｍ＾２／ｇである請求項１または２の研摩粒
    子。
  5. （５）炭化ケイ素を乾燥状態で、高分散性の親水性金属
    酸化物と混合して被覆することを特徴とする請求項１の
    研摩粒子の製造方法。
  6. （６）炭化ケイ素を、蒸発可能な液体に高分散性の親水
    性金属酸化物を懸濁させた液と混合したのち、乾燥して
    被覆することを特徴とする請求項１の研摩粒子の製造方
    法。
  7. （７）合成樹脂で結合した研摩体の製造に際して請求項
    １の研摩粒子を用いることを特徴とする研摩体の製造方
    法。
  8. （８）セラミックスで結合した研摩体の製造に際して請
    求項１の研摩粒子を用いることを特徴とする研摩体の製
    造方法。
JP1150339A 1988-06-17 1989-06-13 被覆された炭化ケイ素研摩粒子 Pending JPH0234685A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CH2356/88A CH675250A5 (ja) 1988-06-17 1988-06-17
CH2356/88-0 1988-06-17

Publications (1)

Publication Number Publication Date
JPH0234685A true JPH0234685A (ja) 1990-02-05

Family

ID=4231876

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1150339A Pending JPH0234685A (ja) 1988-06-17 1989-06-13 被覆された炭化ケイ素研摩粒子

Country Status (11)

Country Link
US (1) US5009675A (ja)
EP (1) EP0346832B1 (ja)
JP (1) JPH0234685A (ja)
AT (1) ATE81116T1 (ja)
BR (1) BR8902916A (ja)
CH (1) CH675250A5 (ja)
DE (1) DE58902354D1 (ja)
ES (1) ES2035440T3 (ja)
NO (1) NO892434L (ja)
PT (1) PT90894B (ja)
SU (1) SU1722231A3 (ja)

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CH675250A5 (ja) 1990-09-14
EP0346832B1 (de) 1992-09-30
US5009675A (en) 1991-04-23
ATE81116T1 (de) 1992-10-15
SU1722231A3 (ru) 1992-03-23
NO892434D0 (no) 1989-06-13
EP0346832A2 (de) 1989-12-20
EP0346832A3 (de) 1991-03-27
NO892434L (no) 1989-12-18
BR8902916A (pt) 1990-02-06
ES2035440T3 (es) 1993-04-16
PT90894B (pt) 1995-01-31
DE58902354D1 (de) 1992-11-05
PT90894A (pt) 1989-12-29

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