JPH0234181B2 - - Google Patents
Info
- Publication number
- JPH0234181B2 JPH0234181B2 JP56069651A JP6965181A JPH0234181B2 JP H0234181 B2 JPH0234181 B2 JP H0234181B2 JP 56069651 A JP56069651 A JP 56069651A JP 6965181 A JP6965181 A JP 6965181A JP H0234181 B2 JPH0234181 B2 JP H0234181B2
- Authority
- JP
- Japan
- Prior art keywords
- group
- molding material
- molding
- formula
- epoxy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
- H01L23/296—Organo-silicon compounds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56069651A JPS57184242A (en) | 1981-05-08 | 1981-05-08 | Molding material for sealing electronic part |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56069651A JPS57184242A (en) | 1981-05-08 | 1981-05-08 | Molding material for sealing electronic part |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS57184242A JPS57184242A (en) | 1982-11-12 |
| JPH0234181B2 true JPH0234181B2 (enrdf_load_html_response) | 1990-08-01 |
Family
ID=13408952
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP56069651A Granted JPS57184242A (en) | 1981-05-08 | 1981-05-08 | Molding material for sealing electronic part |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS57184242A (enrdf_load_html_response) |
Families Citing this family (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59129252A (ja) * | 1983-01-14 | 1984-07-25 | Matsushita Electric Works Ltd | エポキシ樹脂成形材料 |
| US4719255A (en) * | 1984-08-23 | 1988-01-12 | Kabushiki Kaisha Toshiba | Epoxy resin composition for encapsulation of semi-conductor device |
| JPS6166712A (ja) * | 1984-09-11 | 1986-04-05 | Mitsubishi Electric Corp | 半導体封止用エポキシ樹脂組成物 |
| JPS61127723A (ja) * | 1984-11-27 | 1986-06-16 | Sumitomo Bakelite Co Ltd | 発光または受光素子成形体 |
| JPS61183314A (ja) * | 1985-02-12 | 1986-08-16 | Sumitomo Bakelite Co Ltd | エポキシ樹脂組成物 |
| JPH0782960B2 (ja) * | 1987-04-03 | 1995-09-06 | 松下電器産業株式会社 | 金属化フイルムコンデンサ |
| US4847154A (en) * | 1987-05-29 | 1989-07-11 | Basf Corporation | Thermosetting resin systems containing secondary amine-terminated siloxane modifiers |
| JPH0610247B2 (ja) * | 1987-09-07 | 1994-02-09 | 住友ベークライト株式会社 | 液状エポキシ樹脂組成物 |
| JP2660012B2 (ja) * | 1988-09-13 | 1997-10-08 | 株式会社東芝 | ゴム変性フェノール樹脂、エポキシ樹脂組成物及び樹脂封止型半導体装置 |
| JPH0776257B2 (ja) * | 1988-09-29 | 1995-08-16 | 日東電工株式会社 | 半導体装置 |
| JP2859640B2 (ja) * | 1989-05-19 | 1999-02-17 | 日東電工株式会社 | 半導体装置 |
| JPH05175259A (ja) * | 1991-12-25 | 1993-07-13 | Sumitomo Bakelite Co Ltd | 半導体封止用エポキシ樹脂組成物のタブレットの製造方法 |
| JP2002322343A (ja) * | 2001-04-24 | 2002-11-08 | Hitachi Chem Co Ltd | 熱硬化性樹脂組成物及びその製造方法 |
| JP4539118B2 (ja) * | 2004-02-27 | 2010-09-08 | 住友ベークライト株式会社 | エポキシ樹脂組成物及び半導体装置 |
| JP2011144386A (ja) * | 2011-03-18 | 2011-07-28 | Hitachi Chem Co Ltd | 熱硬化性樹脂組成物及びその製造方法 |
| JP2012031431A (ja) * | 2011-11-04 | 2012-02-16 | Hitachi Chem Co Ltd | 熱硬化性樹脂組成物及びその製造方法 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5710621A (en) * | 1980-06-24 | 1982-01-20 | Toshiba Corp | Catalyst for polymerizing epoxy compound |
-
1981
- 1981-05-08 JP JP56069651A patent/JPS57184242A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS57184242A (en) | 1982-11-12 |
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