JPH0234174B2 - - Google Patents

Info

Publication number
JPH0234174B2
JPH0234174B2 JP61009358A JP935886A JPH0234174B2 JP H0234174 B2 JPH0234174 B2 JP H0234174B2 JP 61009358 A JP61009358 A JP 61009358A JP 935886 A JP935886 A JP 935886A JP H0234174 B2 JPH0234174 B2 JP H0234174B2
Authority
JP
Japan
Prior art keywords
push
electronic component
middle guide
needle
electronic components
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP61009358A
Other languages
English (en)
Japanese (ja)
Other versions
JPS62166536A (ja
Inventor
Ryuichi Komatsu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanyo Electric Co Ltd
Original Assignee
Sanyo Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanyo Electric Co Ltd filed Critical Sanyo Electric Co Ltd
Priority to JP61009358A priority Critical patent/JPS62166536A/ja
Publication of JPS62166536A publication Critical patent/JPS62166536A/ja
Publication of JPH0234174B2 publication Critical patent/JPH0234174B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7412—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support the auxiliary support including means facilitating the separation of a device or wafer from the auxiliary support
    • H10P72/7414—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support the auxiliary support including means facilitating the separation of a device or wafer from the auxiliary support the auxiliary support including means facilitating the selective separation of some of a plurality of devices from the auxiliary support
JP61009358A 1986-01-20 1986-01-20 電子部品の突き上げ装置 Granted JPS62166536A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP61009358A JPS62166536A (ja) 1986-01-20 1986-01-20 電子部品の突き上げ装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61009358A JPS62166536A (ja) 1986-01-20 1986-01-20 電子部品の突き上げ装置

Publications (2)

Publication Number Publication Date
JPS62166536A JPS62166536A (ja) 1987-07-23
JPH0234174B2 true JPH0234174B2 (enExample) 1990-08-01

Family

ID=11718247

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61009358A Granted JPS62166536A (ja) 1986-01-20 1986-01-20 電子部品の突き上げ装置

Country Status (1)

Country Link
JP (1) JPS62166536A (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0376139A (ja) * 1989-08-18 1991-04-02 Nec Corp 半導体素子突上げ方法
JPH04137043U (ja) * 1991-06-12 1992-12-21 山形日本電気株式会社 半導体ダイボンデイング装置のダイ突き上げ機構
JPH0837395A (ja) * 1994-07-21 1996-02-06 Matsushita Electric Ind Co Ltd 半導体チップ供給装置および供給方法
JP3498877B2 (ja) * 1995-12-05 2004-02-23 株式会社東芝 半導体製造装置および半導体装置の製造方法
JP3441879B2 (ja) * 1996-03-29 2003-09-02 日本碍子株式会社 チップ剥離装置
JP3976541B2 (ja) * 2001-10-23 2007-09-19 富士通株式会社 半導体チップの剥離方法及び装置

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50136359U (enExample) * 1974-04-27 1975-11-10
JPS5410664A (en) * 1977-06-24 1979-01-26 Mitsubishi Electric Corp Semiconductor pellet removing device

Also Published As

Publication number Publication date
JPS62166536A (ja) 1987-07-23

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