JPS62166536A - 電子部品の突き上げ装置 - Google Patents

電子部品の突き上げ装置

Info

Publication number
JPS62166536A
JPS62166536A JP61009358A JP935886A JPS62166536A JP S62166536 A JPS62166536 A JP S62166536A JP 61009358 A JP61009358 A JP 61009358A JP 935886 A JP935886 A JP 935886A JP S62166536 A JPS62166536 A JP S62166536A
Authority
JP
Japan
Prior art keywords
collet
moved
attracting
component
electronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP61009358A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0234174B2 (enExample
Inventor
Ryuichi Komatsu
龍一 小松
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanyo Electric Co Ltd
Original Assignee
Sanyo Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanyo Electric Co Ltd filed Critical Sanyo Electric Co Ltd
Priority to JP61009358A priority Critical patent/JPS62166536A/ja
Publication of JPS62166536A publication Critical patent/JPS62166536A/ja
Publication of JPH0234174B2 publication Critical patent/JPH0234174B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7412—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support the auxiliary support including means facilitating the separation of a device or wafer from the auxiliary support
    • H10P72/7414—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support the auxiliary support including means facilitating the separation of a device or wafer from the auxiliary support the auxiliary support including means facilitating the selective separation of some of a plurality of devices from the auxiliary support
JP61009358A 1986-01-20 1986-01-20 電子部品の突き上げ装置 Granted JPS62166536A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP61009358A JPS62166536A (ja) 1986-01-20 1986-01-20 電子部品の突き上げ装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61009358A JPS62166536A (ja) 1986-01-20 1986-01-20 電子部品の突き上げ装置

Publications (2)

Publication Number Publication Date
JPS62166536A true JPS62166536A (ja) 1987-07-23
JPH0234174B2 JPH0234174B2 (enExample) 1990-08-01

Family

ID=11718247

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61009358A Granted JPS62166536A (ja) 1986-01-20 1986-01-20 電子部品の突き上げ装置

Country Status (1)

Country Link
JP (1) JPS62166536A (enExample)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0376139A (ja) * 1989-08-18 1991-04-02 Nec Corp 半導体素子突上げ方法
JPH04137043U (ja) * 1991-06-12 1992-12-21 山形日本電気株式会社 半導体ダイボンデイング装置のダイ突き上げ機構
US5589029A (en) * 1994-07-21 1996-12-31 Matsushita Electric Industrial Co., Ltd. Semiconductor chip-supply method and apparatus
US6201306B1 (en) * 1995-12-05 2001-03-13 Kabushiki Kaisha Toshiba Push-up pin of a semiconductor element pushing-up device, and a method for separating
US6464444B1 (en) * 1996-03-29 2002-10-15 Ngk Insulators, Ltd. Apparatus for peeling off chips using a plurality of first and second protrusions
US6824643B2 (en) * 2001-10-23 2004-11-30 Fujitsu Limited Method and device of peeling semiconductor device using annular contact members

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50136359U (enExample) * 1974-04-27 1975-11-10
JPS5410664A (en) * 1977-06-24 1979-01-26 Mitsubishi Electric Corp Semiconductor pellet removing device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50136359U (enExample) * 1974-04-27 1975-11-10
JPS5410664A (en) * 1977-06-24 1979-01-26 Mitsubishi Electric Corp Semiconductor pellet removing device

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0376139A (ja) * 1989-08-18 1991-04-02 Nec Corp 半導体素子突上げ方法
JPH04137043U (ja) * 1991-06-12 1992-12-21 山形日本電気株式会社 半導体ダイボンデイング装置のダイ突き上げ機構
US5589029A (en) * 1994-07-21 1996-12-31 Matsushita Electric Industrial Co., Ltd. Semiconductor chip-supply method and apparatus
US6201306B1 (en) * 1995-12-05 2001-03-13 Kabushiki Kaisha Toshiba Push-up pin of a semiconductor element pushing-up device, and a method for separating
US6555418B2 (en) 1995-12-05 2003-04-29 Kabushiki Kaisha Toshiba Method for separating a semiconductor element in a semiconductor element pushing-up device
US6464444B1 (en) * 1996-03-29 2002-10-15 Ngk Insulators, Ltd. Apparatus for peeling off chips using a plurality of first and second protrusions
US6824643B2 (en) * 2001-10-23 2004-11-30 Fujitsu Limited Method and device of peeling semiconductor device using annular contact members

Also Published As

Publication number Publication date
JPH0234174B2 (enExample) 1990-08-01

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