JPH0229732Y2 - - Google Patents
Info
- Publication number
- JPH0229732Y2 JPH0229732Y2 JP1984169574U JP16957484U JPH0229732Y2 JP H0229732 Y2 JPH0229732 Y2 JP H0229732Y2 JP 1984169574 U JP1984169574 U JP 1984169574U JP 16957484 U JP16957484 U JP 16957484U JP H0229732 Y2 JPH0229732 Y2 JP H0229732Y2
- Authority
- JP
- Japan
- Prior art keywords
- tetrafluoroethylene resin
- layer
- porous tetrafluoroethylene
- porous
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000010410 layer Substances 0.000 claims description 52
- 229920005989 resin Polymers 0.000 claims description 48
- 239000011347 resin Substances 0.000 claims description 48
- BFKJFAAPBSQJPD-UHFFFAOYSA-N tetrafluoroethene Chemical group FC(F)=C(F)F BFKJFAAPBSQJPD-UHFFFAOYSA-N 0.000 claims description 43
- 239000012790 adhesive layer Substances 0.000 claims description 15
- 239000000155 melt Substances 0.000 claims description 8
- 238000002844 melting Methods 0.000 claims description 6
- 230000008018 melting Effects 0.000 claims description 6
- 230000005540 biological transmission Effects 0.000 description 8
- 230000000694 effects Effects 0.000 description 8
- 239000000463 material Substances 0.000 description 6
- 238000010292 electrical insulation Methods 0.000 description 5
- 229920006026 co-polymeric resin Polymers 0.000 description 4
- 238000009413 insulation Methods 0.000 description 4
- 229920001721 polyimide Polymers 0.000 description 3
- 239000009719 polyimide resin Substances 0.000 description 3
- -1 polytetrafluoroethylene-hexafluoropropylene Polymers 0.000 description 3
- 239000011148 porous material Substances 0.000 description 3
- BQCIDUSAKPWEOX-UHFFFAOYSA-N 1,1-Difluoroethene Chemical compound FC(F)=C BQCIDUSAKPWEOX-UHFFFAOYSA-N 0.000 description 2
- UUAGAQFQZIEFAH-UHFFFAOYSA-N chlorotrifluoroethylene Chemical group FC(F)=C(F)Cl UUAGAQFQZIEFAH-UHFFFAOYSA-N 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 230000002542 deteriorative effect Effects 0.000 description 2
- 229920000840 ethylene tetrafluoroethylene copolymer Polymers 0.000 description 2
- 229920001225 polyester resin Polymers 0.000 description 2
- 239000004645 polyester resin Substances 0.000 description 2
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 2
- 239000004810 polytetrafluoroethylene Substances 0.000 description 2
- 230000003014 reinforcing effect Effects 0.000 description 2
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000002826 coolant Substances 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- HCDGVLDPFQMKDK-UHFFFAOYSA-N hexafluoropropylene Chemical group FC(F)=C(F)C(F)(F)F HCDGVLDPFQMKDK-UHFFFAOYSA-N 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000013508 migration Methods 0.000 description 1
- 230000005012 migration Effects 0.000 description 1
- 229920006122 polyamide resin Polymers 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984169574U JPH0229732Y2 (fr) | 1984-11-08 | 1984-11-08 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984169574U JPH0229732Y2 (fr) | 1984-11-08 | 1984-11-08 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6183913U JPS6183913U (fr) | 1986-06-03 |
| JPH0229732Y2 true JPH0229732Y2 (fr) | 1990-08-09 |
Family
ID=30727298
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1984169574U Expired JPH0229732Y2 (fr) | 1984-11-08 | 1984-11-08 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0229732Y2 (fr) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07105577B2 (ja) * | 1986-06-02 | 1995-11-13 | ジヤパンゴアテツクス株式会社 | プリント配線基板の製造法 |
| JPH0712652B2 (ja) * | 1986-08-15 | 1995-02-15 | 松下電工株式会社 | 積層板の製法 |
| JPH0740628B2 (ja) * | 1986-08-29 | 1995-05-01 | 日立化成工業株式会社 | 高周波回路用基板 |
| JPH07123177B2 (ja) * | 1986-08-29 | 1995-12-25 | 日立化成工業株式会社 | 高周波回路用基板の製造法 |
| JPH047168Y2 (fr) * | 1987-05-15 | 1992-02-26 | ||
| JP4545682B2 (ja) * | 2005-12-05 | 2010-09-15 | 株式会社潤工社 | 弗素樹脂積層基板 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60214941A (ja) * | 1984-04-10 | 1985-10-28 | 株式会社 潤工社 | プリント基板 |
-
1984
- 1984-11-08 JP JP1984169574U patent/JPH0229732Y2/ja not_active Expired
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60214941A (ja) * | 1984-04-10 | 1985-10-28 | 株式会社 潤工社 | プリント基板 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6183913U (fr) | 1986-06-03 |
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