JPH0229732Y2 - - Google Patents
Info
- Publication number
- JPH0229732Y2 JPH0229732Y2 JP1984169574U JP16957484U JPH0229732Y2 JP H0229732 Y2 JPH0229732 Y2 JP H0229732Y2 JP 1984169574 U JP1984169574 U JP 1984169574U JP 16957484 U JP16957484 U JP 16957484U JP H0229732 Y2 JPH0229732 Y2 JP H0229732Y2
- Authority
- JP
- Japan
- Prior art keywords
- tetrafluoroethylene resin
- layer
- porous tetrafluoroethylene
- porous
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000010410 layer Substances 0.000 claims description 52
- 229920005989 resin Polymers 0.000 claims description 48
- 239000011347 resin Substances 0.000 claims description 48
- BFKJFAAPBSQJPD-UHFFFAOYSA-N tetrafluoroethene Chemical group FC(F)=C(F)F BFKJFAAPBSQJPD-UHFFFAOYSA-N 0.000 claims description 43
- 239000012790 adhesive layer Substances 0.000 claims description 15
- 239000000155 melt Substances 0.000 claims description 8
- 238000002844 melting Methods 0.000 claims description 6
- 230000008018 melting Effects 0.000 claims description 6
- 230000005540 biological transmission Effects 0.000 description 8
- 230000000694 effects Effects 0.000 description 8
- 239000000463 material Substances 0.000 description 6
- 238000010292 electrical insulation Methods 0.000 description 5
- 229920006026 co-polymeric resin Polymers 0.000 description 4
- 238000009413 insulation Methods 0.000 description 4
- 229920001721 polyimide Polymers 0.000 description 3
- 239000009719 polyimide resin Substances 0.000 description 3
- -1 polytetrafluoroethylene-hexafluoropropylene Polymers 0.000 description 3
- 239000011148 porous material Substances 0.000 description 3
- BQCIDUSAKPWEOX-UHFFFAOYSA-N 1,1-Difluoroethene Chemical compound FC(F)=C BQCIDUSAKPWEOX-UHFFFAOYSA-N 0.000 description 2
- UUAGAQFQZIEFAH-UHFFFAOYSA-N chlorotrifluoroethylene Chemical group FC(F)=C(F)Cl UUAGAQFQZIEFAH-UHFFFAOYSA-N 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 230000002542 deteriorative effect Effects 0.000 description 2
- 229920000840 ethylene tetrafluoroethylene copolymer Polymers 0.000 description 2
- 229920001225 polyester resin Polymers 0.000 description 2
- 239000004645 polyester resin Substances 0.000 description 2
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 2
- 239000004810 polytetrafluoroethylene Substances 0.000 description 2
- 230000003014 reinforcing effect Effects 0.000 description 2
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000002826 coolant Substances 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- HCDGVLDPFQMKDK-UHFFFAOYSA-N hexafluoropropylene Chemical group FC(F)=C(F)C(F)(F)F HCDGVLDPFQMKDK-UHFFFAOYSA-N 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000013508 migration Methods 0.000 description 1
- 230000005012 migration Effects 0.000 description 1
- 229920006122 polyamide resin Polymers 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
Description
【考案の詳細な説明】
〔産業上の利用分野〕
この考案は、マイクロ波、ミリ波の高周波用に
用いられるプリント基板に関する。[Detailed Description of the Invention] [Industrial Application Field] This invention relates to a printed circuit board used for high frequency waves such as microwaves and millimeter waves.
この種高周波用のプリント基板として四弗化エ
チレン樹脂にガラス繊維を混入したものが用いら
れているが、10ギガヘルツで用いた場合信号伝搬
遅延時間は約5.2ns／ｍであり、誘電体損失は約
0.002と大きな値であり好ましくはない。
This type of high-frequency printed circuit board is made of tetrafluoroethylene resin mixed with glass fiber, but when used at 10 gigahertz, the signal propagation delay time is approximately 5.2 ns/m, and the dielectric loss is about
This is a large value of 0.002, which is not desirable.
また、プリント基板としてはその製造取り扱い
上、回路形成上或いは機器取り付け上、腰のある
フレキシブル性をそなえていることが望ましい。
そのための材料としてはポリイミド樹脂フイル
ム、ポリイミド樹脂フイルム、ポリエステル樹脂
フイルム等が好適であるが、それらの電気特性、
特に誘電体損失はポリイミド樹脂フイルムを用い
た場合0.04、ポリアミド樹脂フイルムを用いた場
合0.05、ポリエステル樹脂フイルムを用いた場合
は0.045（以上それぞれ１メガヘルツにおいて）と
いずれも大きな値があり、その上周波数依存性も
高いので、高周波用としては使用に耐えないもの
であつた。 Further, it is desirable that the printed circuit board has sufficient flexibility in terms of manufacturing and handling, circuit formation, and equipment installation.
Suitable materials for this purpose include polyimide resin films, polyimide resin films, and polyester resin films, but their electrical properties,
In particular, the dielectric loss has a large value of 0.04 when using a polyimide resin film, 0.05 when using a polyamide resin film, and 0.045 when using a polyester resin film (all at 1 MHz), and in addition, It was also highly dependent, making it unusable for high frequency applications.
そこで考案者は、鋭意研究した所、導電回路層
に沿つて多孔質四弗化エチレン樹脂層を配したプ
リント基板とすれば、伝送特性が向上し、更に導
電回路層と多孔質四弗化エチレン樹脂層とを多孔
質四弗化エチレン樹脂よりも融点の低い他の弗素
樹脂材よりなる溶融接着層によつて結合するよう
にすれば、絶縁抵抗が高くなり、マイグレーシヨ
ン等の絶縁劣化が阻止できるなど、電気絶縁性能
が向上することをつきとめた。
After intensive research, the inventor found that if a printed circuit board was made with a porous tetrafluoroethylene resin layer arranged along the conductive circuit layer, the transmission characteristics would be improved, and that the conductive circuit layer and porous tetrafluoroethylene If the resin layer is bonded with a molten adhesive layer made of another fluororesin material with a lower melting point than porous tetrafluoroethylene resin, the insulation resistance will be increased and insulation deterioration such as migration will be prevented. It was found that the electrical insulation performance was improved.
即ちこの考案が解決しようとする点は、電気絶
縁性能を低下させることなく、高周波伝送特性を
向上させたプリント基板を提供することにある。 That is, the problem to be solved by this invention is to provide a printed circuit board with improved high frequency transmission characteristics without deteriorating electrical insulation performance.
上記問題点を解決するためこの考案によれば、
導電回路層と、この導電回路層にそつて設けられ
る多孔質四弗化エチレン樹脂層と、前記導電回路
層と前記多孔質四弗化エチレン樹脂層との間に設
けられ、前記多孔質四弗化エチレン樹脂よりも融
点の低い弗素樹脂よりなる溶融接着層とを備える
プリント基板を構成する。
According to this idea to solve the above problems,
a conductive circuit layer, a porous tetrafluoroethylene resin layer provided along the conductive circuit layer, and a porous tetrafluoroethylene resin layer provided between the conductive circuit layer and the porous tetrafluoroethylene resin layer; A printed circuit board is provided with a melt adhesive layer made of a fluororesin having a melting point lower than that of an ethylene resin.
この構成において、多孔質四弗化エチレン樹脂
層は未焼成、半焼成、焼成等の連続気孔性発泡多
孔質四弗化エチレン樹脂材、或いは延伸多孔質四
弗化エチレン樹脂材等を用いることができ、特
に、延伸多孔質四弗化エチレン樹脂シート、該シ
ートに多数の貫通孔を設けたもの、延伸多孔質四
弗化エチレン樹脂線条体をもつて織つた布状体等
が好適に用いられる。 In this configuration, the porous tetrafluoroethylene resin layer may be made of an open-cell foamed porous tetrafluoroethylene resin material such as unfired, semi-fired, or fired, or a stretched porous tetrafluoroethylene resin material. In particular, stretched porous tetrafluoroethylene resin sheets, sheets provided with a large number of through holes, cloth-like bodies woven with stretched porous tetrafluoroethylene resin filaments, etc. are preferably used. It will be done.
また、溶融接着層を形成する弗素樹脂として
は、四弗化エチレンーパ−フロロアルキルビニル
エーテル共重合樹脂（PFA）、四弗化エチレン−
六弗化プロピレン共重合樹脂（FEP）、四弗化エ
チレン−エチレン共重合樹脂（ETFE）、三弗化
塩化エチレン樹脂（CTFE）、二弗化ビニリデン
（VdF）等が用いられる。 In addition, examples of the fluororesin forming the melt adhesive layer include tetrafluoroethylene-perfluoroalkyl vinyl ether copolymer resin (PFA), tetrafluoroethylene-perfluoroalkyl vinyl ether copolymer resin (PFA),
Hexafluoropropylene copolymer resin (FEP), tetrafluoroethylene-ethylene copolymer resin (ETFE), trifluorochloroethylene resin (CTFE), vinylidene difluoride (VdF), etc. are used.
この考案によれば、導電回路層と、この導電回
路層にそつて設けられる多孔質四弗化エチレン樹
脂層と、前記導電回路層と前記多孔質四弗化エチ
レン樹脂層との間に設けられ、前記多孔質四弗化
エチレン樹脂よりも融点の低い弗素樹脂よりなる
溶融接着層とを備えるプリント基板が構成される
ものであるから、主誘電体を形成する多孔質四弗
化エチレン樹脂は物理的、化学的に安定でかつ誘
電率が低く、高周波伝送特性が良好で安定な基板
が堤供でき、更に多孔質であるので冷却効果も優
れたものとなる。またこの考案によれば、導電回
路層と主誘電体である多孔質四弗化エチレン樹脂
層とを結合する溶融接着層は主誘電体である多孔
質四弗化エチレン樹脂よりも誘点の低い他の弗素
樹脂で形成されるので、該多孔質四弗化エチレン
樹脂層を害することなく良好に導電回路層と結合
し、更に両者間に在つて多孔質四弗化エチレン樹
脂層の電気絶縁的弱点を良く補つて、電気絶縁性
能も良好なものとする。即ち、電気絶縁性能と高
周波伝送特性とを満足させたプリント基板が提供
できる。
According to this invention, a conductive circuit layer, a porous tetrafluoroethylene resin layer provided along the conductive circuit layer, and a porous tetrafluoroethylene resin layer provided between the conductive circuit layer and the porous tetrafluoroethylene resin layer. , and a melt adhesive layer made of a fluororesin having a melting point lower than that of the porous tetrafluoroethylene resin. Therefore, the porous tetrafluoroethylene resin forming the main dielectric is physically It is possible to provide a stable substrate that is physically and chemically stable, has a low dielectric constant, and has good high frequency transmission characteristics.Furthermore, since it is porous, it has an excellent cooling effect. Furthermore, according to this invention, the molten adhesive layer that connects the conductive circuit layer and the porous tetrafluoroethylene resin layer that is the main dielectric has a lower attraction point than the porous tetrafluoroethylene resin that is the main dielectric. Since it is made of other fluororesin, it can be well bonded to the conductive circuit layer without damaging the porous tetrafluoroethylene resin layer, and furthermore, the porous tetrafluoroethylene resin layer is electrically insulating because it is present between the two. To compensate for weaknesses and provide good electrical insulation performance. That is, a printed circuit board that satisfies electrical insulation performance and high frequency transmission characteristics can be provided.
〔実施例〕
第１図はこの考案によるプリント基板１の断面
図に示す。この実施例によるプリント基板１の主
誘電体を形成する多孔質四弗化エチレン樹脂層２
は、例えば特公昭51−18991号公報に記載の方法
によつて得られた延伸多孔質四弗化エチレン樹脂
シートからなり、四弗化エチレン−六弗化プロピ
レン共重合樹脂（FEP）からなる溶融接着層３
を介して導電回路層４に沿つて接着されている。[Embodiment] FIG. 1 is a sectional view of a printed circuit board 1 according to this invention. Porous tetrafluoroethylene resin layer 2 forming the main dielectric of the printed circuit board 1 according to this embodiment
is made of a stretched porous tetrafluoroethylene resin sheet obtained by the method described in, for example, Japanese Patent Publication No. 51-18991, and is made of a molten polytetrafluoroethylene-hexafluoropropylene copolymer resin (FEP). Adhesive layer 3
It is bonded along the conductive circuit layer 4 via the conductive circuit layer 4.
ここで、溶融接着層３は多孔質四弗化エチレン
樹脂よりも十分融点の低い弗素樹脂からなるの
で、多孔質四弗化エチレン樹脂層２を害すること
なく良好に接着する。更にこの溶融接着層３は、
導電回路層４と多孔質四弗化エチレン樹脂層２と
の間を完全に無孔の状態で結合するので、絶縁補
強層をも形成する。 Here, since the melt adhesive layer 3 is made of a fluororesin having a sufficiently lower melting point than the porous tetrafluoroethylene resin, it adheres well without damaging the porous tetrafluoroethylene resin layer 2. Furthermore, this melt adhesive layer 3 is
Since the conductive circuit layer 4 and the porous tetrafluoroethylene resin layer 2 are bonded in a completely non-porous state, an insulating reinforcing layer is also formed.
従つてこの考案によるプリント基板は、多孔質
四弗化エチレン樹脂層２からなる高周波伝送特性
発揮素子を絶縁性能附与素子である溶融接着層３
によつて導電回路層４に沿つて接着した機能的な
ものとなる。 Therefore, the printed circuit board according to this invention has a high-frequency transmission characteristic exhibiting element made of a porous tetrafluoroethylene resin layer 2 and a molten adhesive layer 3 which is an element imparting insulation performance.
This results in a functional adhesive bonded along the conductive circuit layer 4.
第２図はこの考案による他の実施例を示す。こ
の実施例のプリント基板５は、多数の貫通孔６を
設けた延伸多孔質四弗化エチレン樹脂シートから
なる多孔質四弗化エチレン樹脂層７の両面に溶融
接着層８を介して導電回路層９，９が設けられて
いる。この実施例のプリント基板５は第１図にす
プリント基板１と同様な効果が得られ、高周波伝
送特性は一段と向上する。 FIG. 2 shows another embodiment of this invention. The printed circuit board 5 of this embodiment has a conductive circuit layer 7 on both sides of a porous polytetrafluoroethylene resin layer 7 made of a stretched porous polytetrafluoroethylene resin sheet with a large number of through holes 6, with a molten adhesive layer 8 interposed therebetween. 9,9 are provided. The printed circuit board 5 of this embodiment has the same effects as the printed circuit board 1 shown in FIG. 1, and the high frequency transmission characteristics are further improved.
第３図はこの考案による更に異なる実施例を示
す。この実施例によるプリント基板１０の場合、
多孔質四弗化エチレン樹脂層１１は、延伸多孔質
四弗化エチレン樹脂線条体をもつて織つた布状体
からなり、その両面に溶融接着層１２によつて導
電回路層１３が接着されている。 FIG. 3 shows a further different embodiment of this invention. In the case of the printed circuit board 10 according to this embodiment,
The porous tetrafluoroethylene resin layer 11 is made of a cloth-like body woven with stretched porous tetrafluoroethylene resin filaments, and a conductive circuit layer 13 is adhered to both sides of the cloth by a melt adhesive layer 12. ing.
この場合も前記と同様な効果が得られる。 In this case as well, the same effects as described above can be obtained.
この考案によれば、導電回路層と、この導電回
路層にそつて設けられる多孔質四弗化エチレン樹
脂層と、前記導電回路層と前記多孔質四弗化エチ
レン樹脂層との間に設けられ、前記多孔質四弗化
エチレン樹脂よりも融点の低い弗素樹脂よりなる
溶融接着層とを備えるプリント基板を構成するこ
とにより、(1)信号伝搬遅延時間が4.1〜3.6ns／ｍ
とかなり速い。(2)誘電体損失が10-4以下と小さ
い。(3)比誘電率が小さいので、特性インピーダン
ス一定とすれば、従来より導体幅を広くでき、か
つ誘電体損失も小さいので信号の減衰が小かい。
(4)多孔質材であるので該誘電体が温度変化により
膨張収縮する可能性が極めて小さく、安定性が高
い。(5)多孔質材であるので該誘電体内にヘリウム
ガス等の冷媒が侵入でき、冷却効果を増加でき
る。(6)物理的、化学的に安定な素材であるので信
頼性の高い製品となる。(7)誘電体損失が小さく、
ミリ波用誘電体として適した材料であるので、プ
リント基板の端面ないしは断面から直接誘電体線
路に連結でき、伝送路の単純化になる。(8)溶融接
着層が絶縁補強層となるので、多孔質誘電体を用
いたにもかかわらず、電気絶縁性能の低下なしに
高周波伝送特性を向上できる。等の諸効果が得ら
れる。
According to this invention, a conductive circuit layer, a porous tetrafluoroethylene resin layer provided along the conductive circuit layer, and a porous tetrafluoroethylene resin layer provided between the conductive circuit layer and the porous tetrafluoroethylene resin layer. By configuring a printed circuit board including a molten adhesive layer made of a fluororesin having a melting point lower than that of the porous tetrafluoroethylene resin, (1) the signal propagation delay time is 4.1 to 3.6 ns/m;
It's quite fast. (2) Low dielectric loss of 10 -4 or less. (3) Since the relative dielectric constant is small, if the characteristic impedance is constant, the conductor width can be made wider than before, and the dielectric loss is also small, so signal attenuation is small.
(4) Since it is a porous material, the possibility that the dielectric material expands and contracts due to temperature changes is extremely small and is highly stable. (5) Since it is a porous material, a coolant such as helium gas can penetrate into the dielectric, increasing the cooling effect. (6) The material is physically and chemically stable, making it a highly reliable product. (7) Low dielectric loss;
Since it is a material suitable as a dielectric for millimeter waves, it can be directly connected to the dielectric line from the end face or cross section of the printed circuit board, simplifying the transmission line. (8) Since the melt adhesive layer serves as an insulation reinforcing layer, high frequency transmission characteristics can be improved without deteriorating electrical insulation performance, even though a porous dielectric is used. Various effects such as these can be obtained.
尚、この考案は上記実施例に限定されるもので
はなく、例えば多孔質四弗化エチレン樹脂層とし
て連続気孔性の発泡多孔質四弗化エチレン樹脂を
用いるなど、この考案の思想の範囲内で種々変更
実施しても同様の効果が得られる。 Note that this invention is not limited to the above-mentioned embodiments, and may be modified within the scope of the idea of this invention, such as using a foamed porous tetrafluoroethylene resin with open pores as the porous tetrafluoroethylene resin layer. Similar effects can be obtained even if various changes are made.
第１図、第２図及び第３図はそれぞれこの考案
による異なる実施例を示すプリント基板の断面図
である。
１，５，１０：プリント基板、２，７，１１：
多孔質四弗化エチレン樹脂層、３，８，１２：溶
融接着層、４，９，１３：導電回路層、６：貫通
孔。
1, 2, and 3 are sectional views of printed circuit boards showing different embodiments of this invention, respectively. 1, 5, 10: Printed circuit board, 2, 7, 11:
Porous tetrafluoroethylene resin layer, 3, 8, 12: melt adhesive layer, 4, 9, 13: conductive circuit layer, 6: through hole.
Claims (1)
られる多孔質四弗化エチレン樹脂層と、前記導
電回路層と前記多孔質四弗化エチレン樹脂層と
の間に設けられ、前記多孔質四弗化エチレン樹
脂よりも融点の低い弗素樹脂よりなる溶融接着
層とを備えるプリント基板。 ２ 実用新案登録請求の範囲第１項に記載のプリ
ント基板において、前記多孔質四弗化エチレン
樹脂層は延伸多孔質四弗化エチレン樹脂シート
からなることを特徴とするプリント基板。 ３ 実用新案登録請求の範囲第１項に記載のプリ
ント基板において、前記多孔質四弗化エチレン
樹脂層は延伸多孔質四弗化エチレン樹脂シート
に多数の貫通孔を設けたものからなることを特
徴とするプリント基板。[Claims for Utility Model Registration] 1. A conductive circuit layer, a porous tetrafluoroethylene resin layer provided along the conductive circuit layer, and between the conductive circuit layer and the porous tetrafluoroethylene resin layer. and a melt adhesive layer made of a fluororesin having a melting point lower than that of the porous tetrafluoroethylene resin. 2 Utility Model Registration The printed circuit board according to claim 1, wherein the porous tetrafluoroethylene resin layer is made of a stretched porous tetrafluoroethylene resin sheet. 3 Utility Model Registration Scope of Claims The printed circuit board according to claim 1, characterized in that the porous tetrafluoroethylene resin layer is made of a stretched porous tetrafluoroethylene resin sheet with a large number of through holes. printed circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984169574U JPH0229732Y2 (en) | 1984-11-08 | 1984-11-08 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984169574U JPH0229732Y2 (en) | 1984-11-08 | 1984-11-08 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6183913U JPS6183913U (en) | 1986-06-03 |
| JPH0229732Y2 true JPH0229732Y2 (en) | 1990-08-09 |
Family
ID=30727298
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1984169574U Expired JPH0229732Y2 (en) | 1984-11-08 | 1984-11-08 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0229732Y2 (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07105577B2 (en) * | 1986-06-02 | 1995-11-13 | ジヤパンゴアテツクス株式会社 | Printed wiring board manufacturing method |
| JPH0712652B2 (en) * | 1986-08-15 | 1995-02-15 | 松下電工株式会社 | Manufacturing method of laminated board |
| JPH0740628B2 (en) * | 1986-08-29 | 1995-05-01 | 日立化成工業株式会社 | Substrate for high frequency circuit |
| JPH07123177B2 (en) * | 1986-08-29 | 1995-12-25 | 日立化成工業株式会社 | High frequency circuit board manufacturing method |
| JPH047168Y2 (en) * | 1987-05-15 | 1992-02-26 | ||
| JP4545682B2 (en) * | 2005-12-05 | 2010-09-15 | 株式会社潤工社 | Fluorine resin laminated substrate |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60214941A (en) * | 1984-04-10 | 1985-10-28 | 株式会社 潤工社 | Printed substrate |
-
1984
- 1984-11-08 JP JP1984169574U patent/JPH0229732Y2/ja not_active Expired
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60214941A (en) * | 1984-04-10 | 1985-10-28 | 株式会社 潤工社 | Printed substrate |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6183913U (en) | 1986-06-03 |
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