JPH0228623B2 - - Google Patents
Info
- Publication number
- JPH0228623B2 JPH0228623B2 JP59172346A JP17234684A JPH0228623B2 JP H0228623 B2 JPH0228623 B2 JP H0228623B2 JP 59172346 A JP59172346 A JP 59172346A JP 17234684 A JP17234684 A JP 17234684A JP H0228623 B2 JPH0228623 B2 JP H0228623B2
- Authority
- JP
- Japan
- Prior art keywords
- resin
- adhesive tape
- lead frame
- parts
- adhesive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000002390 adhesive tape Substances 0.000 claims description 28
- 229920005989 resin Polymers 0.000 claims description 16
- 239000011347 resin Substances 0.000 claims description 16
- 239000004065 semiconductor Substances 0.000 claims description 14
- 239000005011 phenolic resin Substances 0.000 claims description 13
- 239000012790 adhesive layer Substances 0.000 claims description 9
- 229920001577 copolymer Polymers 0.000 claims description 4
- 239000003822 epoxy resin Substances 0.000 claims description 4
- 229920000647 polyepoxide Polymers 0.000 claims description 4
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 claims description 3
- 125000005396 acrylic acid ester group Chemical group 0.000 claims description 2
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 claims description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 10
- 229920001568 phenolic resin Polymers 0.000 description 9
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 6
- 239000000203 mixture Substances 0.000 description 6
- 229920001721 polyimide Polymers 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 229920003223 poly(pyromellitimide-1,4-diphenyl ether) Polymers 0.000 description 4
- 229920006350 polyacrylonitrile resin Polymers 0.000 description 3
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 2
- 229920002125 Sokalan® Polymers 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000178 monomer Substances 0.000 description 2
- 239000004584 polyacrylic acid Substances 0.000 description 2
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- NTXGQCSETZTARF-UHFFFAOYSA-N buta-1,3-diene;prop-2-enenitrile Chemical compound C=CC=C.C=CC#N NTXGQCSETZTARF-UHFFFAOYSA-N 0.000 description 1
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 229920006026 co-polymeric resin Polymers 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- 229920001485 poly(butyl acrylate) polymer Polymers 0.000 description 1
- 239000011134 resol-type phenolic resin Substances 0.000 description 1
- 229920003987 resole Polymers 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- KAKZBPTYRLMSJV-UHFFFAOYSA-N vinyl-ethylene Natural products C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Adhesive Tapes (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17234684A JPS6151076A (ja) | 1984-08-21 | 1984-08-21 | 接着テ−プ |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17234684A JPS6151076A (ja) | 1984-08-21 | 1984-08-21 | 接着テ−プ |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6151076A JPS6151076A (ja) | 1986-03-13 |
| JPH0228623B2 true JPH0228623B2 (de) | 1990-06-25 |
Family
ID=15940202
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17234684A Granted JPS6151076A (ja) | 1984-08-21 | 1984-08-21 | 接着テ−プ |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6151076A (de) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE68922812T2 (de) * | 1988-09-29 | 1995-12-07 | Tomoegawa Paper Mfg Co Ltd | Klebebänder. |
| JPH0668100B2 (ja) * | 1988-09-29 | 1994-08-31 | 株式会社巴川製紙所 | 電子部品用接着テープ |
| JP2511299B2 (ja) * | 1988-11-15 | 1996-06-26 | 株式会社 巴川製紙所 | 電子部品用接着テ―プ |
| KR100530517B1 (ko) * | 1998-02-17 | 2006-04-21 | 주식회사 새 한 | 전자부품용 접착테이프 |
| KR100409082B1 (ko) * | 2001-05-08 | 2003-12-11 | 주식회사 엘지화학 | 테이프용 접착제 조성물 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5745787A (en) * | 1980-08-30 | 1982-03-15 | Kobe Steel Ltd | Recording and reproducing method for magnetic video record and reproduce |
| JPS5754397A (ja) * | 1980-09-19 | 1982-03-31 | Nissei Electric | Denshibuhinnoteepinguhoho |
| JPS5946679A (ja) * | 1982-09-09 | 1984-03-16 | 三菱電機株式会社 | 液晶表示素子の製造方法 |
| JPS6134085A (ja) * | 1984-07-26 | 1986-02-18 | Hitachi Chem Co Ltd | フイルム状接合部材 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55108725U (de) * | 1979-01-24 | 1980-07-30 | ||
| JPS55175300U (de) * | 1979-06-01 | 1980-12-16 |
-
1984
- 1984-08-21 JP JP17234684A patent/JPS6151076A/ja active Granted
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5745787A (en) * | 1980-08-30 | 1982-03-15 | Kobe Steel Ltd | Recording and reproducing method for magnetic video record and reproduce |
| JPS5754397A (ja) * | 1980-09-19 | 1982-03-31 | Nissei Electric | Denshibuhinnoteepinguhoho |
| JPS5946679A (ja) * | 1982-09-09 | 1984-03-16 | 三菱電機株式会社 | 液晶表示素子の製造方法 |
| JPS6134085A (ja) * | 1984-07-26 | 1986-02-18 | Hitachi Chem Co Ltd | フイルム状接合部材 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6151076A (ja) | 1986-03-13 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4147669A (en) | Conductive adhesive for providing electrical and thermal conductivity | |
| US7262514B2 (en) | Epoxy resin composition for semiconductor encapsulation, semiconductor device using the same, and process for producing semiconductor device | |
| US5824182A (en) | Adhesive tapes | |
| JPS634701B2 (de) | ||
| JP4642173B2 (ja) | フィルム状接着剤用組成物 | |
| KR960002767B1 (ko) | 다이 결합용 접착 테이프 | |
| JP4994743B2 (ja) | フィルム状接着剤及びそれを使用する半導体パッケージの製造方法 | |
| KR0184612B1 (ko) | 전자 부품용 접착 테이프 | |
| JP3947296B2 (ja) | シート状封止材料およびそれを用いた半導体装置の製法 | |
| CN101627465A (zh) | 用于半导体的粘合膜和使用该粘合膜的半导体器件 | |
| EP0571649A1 (de) | Unterstützungsfilm zum Schneiden und Befestigen von Halbleiterplättchen und dessen Verwendung in einem Verfahren zur Chipherstellung | |
| JPH0228623B2 (de) | ||
| US3609624A (en) | Strain gage and method of bonding the gage to a member under test | |
| JP2001345349A (ja) | 接続材料及び接続構造体 | |
| JPH08291278A (ja) | ホットメルト接着剤組成物及び接着性フィルム | |
| JP4044349B2 (ja) | 薄型フィルム状接着剤 | |
| JP2612498B2 (ja) | 樹脂封止型半導体装置用接着テ−プ | |
| JP3060452B2 (ja) | 異方性導電接着フィルム | |
| JPH02252779A (ja) | 熱硬化性接着テープ | |
| JP2000154360A (ja) | 接着剤、接着部材、接着部材を備えた半導体搭載用配線基板及びこれを用いた半導体装置 | |
| JPH03192178A (ja) | ダイボンディング用接着シート | |
| JP3326372B2 (ja) | 電子部品用接着剤および電子部品用接着テープ | |
| JP2904536B2 (ja) | 半導体装置用接着剤組成物 | |
| JPS6049635A (ja) | チップのマウント方法 | |
| JPH02133483A (ja) | 電子部品用接着テープ |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |