KR960002767B1 - 다이 결합용 접착 테이프 - Google Patents

다이 결합용 접착 테이프 Download PDF

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KR960002767B1
KR960002767B1 KR1019870009633A KR870009633A KR960002767B1 KR 960002767 B1 KR960002767 B1 KR 960002767B1 KR 1019870009633 A KR1019870009633 A KR 1019870009633A KR 870009633 A KR870009633 A KR 870009633A KR 960002767 B1 KR960002767 B1 KR 960002767B1
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epoxy resin
adhesive tape
adhesive
die bonding
resin
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KR1019870009633A
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KR890003024A (ko
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유끼노리 사꾸모또
야쯔시 고시무라
히로시 마쯔시따
마사끼 쯔시마
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가부시끼가이샤 도모에가와 세이시쇼
이노우에 다까오
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Abstract

내용 없음.

Description

다이 결합용 접착 테이프
제1도는 본 발명에 따른 접착 테이프의 구조에 대한 일례를 나타내는 확대 단면도를 도시한 것이고;
제2도는 본 발명에 따른 접착 테이프의 일례를 나타내는 투시도를 도시하는 것이며;
제3도는 본 발명에 따른 접착 테이프를 사용한 결합 단계를 나타내는 개요도를 도시한 것이다.
본 발명은 기질 또는 납틀에 반도체 부재를 부착시키는데 사용되는 다이 결합용 접착 테이프에 관한 것이다.
트랜지스터 등과 같은 반도체 장치의 분야에서는 패키지에 반도체 칩을 혼입시키기 위한 다양한 결합방법이 개발되어 왔고 실제로 사용되어 왔다.
이들 방법중에서, 다이 결합이라 불리는 기술은 패키지에 대한 칩의 기계적 보호, 전기적 연결, 열분산 등을 보증할 목적으로 기질의 일정한 위치에 반도체 칩을 접착시키는 것으로, 하기한 방법으로 실제수행된다.
(a) 공융결정 합금법 : 약 400℃로 가열시키면서 Si칩의 후면에 대해 Si칩이 부착된 도체 표면으로서 Au 표면을 문질러 합금화를 수행함으로써 Au-Si 공융 결정에 의해 연결하는 방법. 그러나 이 방법은 금을 사용하므로 매우 비경제적이다.
(b) 수지 접착법 : 에폭시 수지 등과 같은 열경화성 수지로 후면처리에 도입된 칩을 Ag, Au, SiO2, MgO 등과 같은 충진제를 함유하는 점성 접착제로 결합시키는 방법, 그러나, 이 방법에서는 비록 취부 작업(mounting work)은 주위온도에서 수행될 수 있을지라도 수지의 경화시간이 너무 오래 소요된다. 또한 상기 방법은 점성 접착제의 일정량이 산정되어야 하며 접착제가 끈적끈적한 상태를 제공하므로 점성 접착제의 가공성이 열등하다는 결점을 갖는다. 또한 이러한 점성 접착제는 접착제의 보관도중에 침전을 야기시킴으로써 온 분말이 분리되는 문제점을 갖는다.
본 발명은 통상적 기술에서의 상기 문제점들을 해결하기 위해서 이루어졌다.
본 발명의 목적은 충진제와, 에폭시 수지 및 폴리에스테르 수지로 이루어진 결합제로 주로 구성되는 접착층이 박리 필름(release film)상에 적층되어 있는 구조를 갖는, 릴상에 감긴 연속 테이프로 이루어지는 다이 결합용 접착 테이프를 제공하는데 있다.
본 발명에서 접착층에 사용된 결합제가 에폭시 수지, 및 폴리에스테르 수지로 이루어진 경우에, 수득되는 접착 테이프는 내열성 및 접착 강도 뿐만 아니라 유연성도 우수하고, 반도체 장치로서의 성능을 감소시키기 쉬운 분해 기체를 발생시키지 않으며, 또한 신뢰도가 우수하다.
본 발명에 따른 접착 테이프에서, 제1도에 도시된 바대로 연속 테이프(13)는 열경화성 수지로 구성된 결합제및 충진제로 주로 이루어지는 접착층(11)과 박리 필름(12)으로 이루어져 있고, 제2도에 도시된 바대로 연속 테이프(13)는 릴(14)상에 감겨져 있다.
본 발명의 결합제에 사용되는 수지의 예는 다음과 같이 상세히 기술된다.
에폭시 수지 :
1) 비스페놀 A형 에폭시 수지
상기 수지는 하기 일반식의 가장 일반적인 에폭시 수지로서, 4,4'-디옥시디페닐프로판(비스페놀 A)과 에피클로로히드린과의 축합반응으로 생성된다. 이 경우에 에피클로로 히드린의 몰수가 감소하면 -OH 그룹을 갖는 에폭시 수지가 수득된다.
Figure kpo00001
이러한 종류의 에폭시 수지는 Yuka Shell Epoxy Co., Ltd.에 의해 제조된 에피코테R(Epikote
Figure kpo00002
) 1001, Tohto Kasei Col., Ltd.에 의해 제조된 에포토토R(Epotohto
Figure kpo00003
) YD-014 등으로 공지되어 있고, 접착강도는 높으나 내열성은 조금 열등하다.
2) 노볼락형 에폭시 수지
상기 수지는 페놀성 하이드록실 그룹과 에피클로로히드린과의 반응으로 형성된 에폭시 수지로서, 하기의 수지들을 포함한다 :
페놀 노볼락 글리시딜 에테르,
o-크레졸 노볼락 글리시딜 에테르,
m-크레졸 노볼락 글리시딜 에테르,
o-크레졸 노볼락 글리시딜 에테르의 화학구조는 다음과 같다.
Figure kpo00004
상기 노볼락형 에폭시 수지의 내열성은 상기 비스페놀 A형 에폭시 수지보다 더 높으나(더 높은 가교결합도) 접착력에 있어서 약간 열등하다.
따라서 노볼락형 에폭시 수지와 비스페놀 A형 에폭시 수지의 혼합 시스템이 가장 바람직하다.
그러나 본 발명의 에폭시 수지는 물론 상기한 에폭시 수지로 제한되는 것은 아니다.
폴리에스테르 수지 :
본 발명에서 폴리에스테르 수지는, 에폭시 수지의 단일 사용으로는 유연성의 결여에 기인하여 테이프가 형성될 수 없으나 폴리에스테르와 에폭시 수지를 배합함으로써 테이프가 형성될 수 있으므로 폴리에스테르 수지와 에폭시 수지를 배합한다.
에폭시 수지를 유연하게 만들어 테이프를 형성시킬 수 있게 하는 물질로는 폴리에스테르 수지 이외에도 아크릴계 수지, 나일론-기재 수지, 우레탄-기재 수지, 고무-기재 수지 등을 언급할 수 있다.
그러나 폴리에스테르 수지 이외의 상기 수지들은 용융 점도가 너무 높아, IC칩 부하시의 결합에 요구되는 IC칩 표면 및 납틀과의 습윤성이 불량하므로, 따라서 안정한 방식으로 다이 결합을 수행할 수 없다.
한편, 폴리에스테르 수지는 상기한 바와같은 문제점을 제공하지 않으므로 적절히 사용된다.
본 발명에 사용될 수 있는 폴리에스테르 수지로는 포화 또는 불포화 폴리에스테르 수지, 지방족 또는 방향족 폴리에스테르 수지 및 직쇄 또는 측쇄 폴리에스테르 수지와 같은 폴리에스테르 수지중 어느 것이라도 사용될 수 있다.
본 발명에서 가장 바람직한 폴리에스테르 수지는 DSC에 의한 유리전이온도(Tg)가 30℃ 이하인 것이다. 예를들어 분자량이 200,000 내지 250,000인 바일론R(Vylon
Figure kpo00005
) 300(Toyobo Co., Ltd.에 의해 제조된 직쇄 포화 지방족 폴리에스테르 수지)은 유리전이온도(Tg)가 6℃이고 용융점도가 낮으며 접착이 오랫동안 유지되므로 본 발명에 바람직하게 사용된다.
그러나 에폭시 수지에 대한 폴리에스테르 수지의 배합량이 너무 큰 경우에는 점성이 커지므로, 접착 테이프상에 반도체 칩을 부하하는 단계에서 문제가 발생할 수 있다. 또한 접착 테이프의 내열성이 저하하고 접착 테이프의 내가수분해성이 열등하므로, 반도체 장치로서의 신뢰도가 강하하게 된다. 따라서 본 발명에서 폴리에스테르 수지의 양은 에폭시 수지 100중량부를 기준하여 20 내지 100중량부인 것이 바람직하다.
본 발명의 접착 테이프를 사용하여 반도체 부재를 결합시키는 방법은 제3도에 예시되어 있다.
접착 테이프(22)는 릴(23)에서 풀려있고, 그의 접착부분(25)(테이프내에 형성됨)은 박리 필름(24)을 벗겨냄으로써 노출시키며, 접착부분(25)은 일정길이로 절단하거나 펀칭하고 이처럼 절단되거나 펀칭된 부분을 80 내지 120℃의 온도에서 납률(21)의 중앙부분과 밀착 접촉시킨다.
이어서 IC칩(26)을 접착 부분(25)상에 두고, 조립품을 120 내지 150℃에서 결합하도록 가열시킨 후 유지시킨다.
이어서 접착제를 250℃에서 60초간 경화시킴으로써 반도체 부재를 납틀(21)상에 쉽게 부착시킬 수 있다.
본 발명은 하기 실시예로 추가로 예시된다.
[실시예 1]
Figure kpo00006
상기 성분들의 혼합물을 혼합기에서 혼련하고, 리버스(reverse)를 피복기를 사용하여 실리콘-처리된 38㎛-두께의 폴리에틸렌 테레프탈레이트 필름상에 피복시킨 후, 건조시켜 경화되지 않거나 반경화된 상태의 두께가 20㎛인 접착층을 형성시키고, 상기 수득된 접착 테이프를 아크릴계 수지로 제조된 릴상에 감아 본 발명의 다이 결합용 접착 테이프를 제공한다.
[실시예 2]
Figure kpo00007
상기 성분들의 혼합물을 혼합기에서 혼련하고, 리버스를 피복기를 사용하여 50㎛두께의 플루오포카본 수지 필름상에 피복시킨 후, 건조시켜 두께가 20㎛인 접작층을 형성시킨다. 상기 수득된 접착 테이프를 폴리카보네이트로 제조된 릴상에 감아 본 발명의 다이 결합용 접착 테이프를 제공한다.
[실시예 3]
50중량부의 Al2O3를 50중량부의 은 분말 대신에 사용하는 것을 제외하고는 실시예 2에서와 같은 공정에 따라서, 본 발명의 다이 결합용 접착 테이프를 수득한다.
실시예1,2 및 3에서 수득된 다이 결합용 접착 테이프의 각각의 상기한 IC칩 부하 방법으로 부하될 수 있고, 신뢰도가 높은 테이프 부취를 가능케 한다.
[실시예 4]
5중량부의 직쇄 포화 방향족 포화 폴리에스테르 수지(Toyobo Co., Ltd.에 의해 제조된 바일론R590, Tg : 15℃)를 5중량부의 직쇄 포화 지방족 포화 폴리에스테르 수지(바일론R300) 대신에 사용한 것을 제외하고는 실시예 1에서와 같은 공정에 따라서, 본 발명의 다이 결합용 접착 테이프를 수득한다.
[비교실시예]
직쇄 포화 지방족 폴리에스테르 수지를 사용하지 않고 실시예 1의 접착 조성물을 사용하여 접착층이 형성되는 것을 제외하고는 실시예 1에서와 같은 방법에 의해 비교용 접착 테이프를 제조하려고 시도했으나, 접착 조성물은 유연성 결여로 테이프 상태를 형성할 수 없었다.
또한 한쪽 상에 박리 필름을 갖는 접착 테이프는 박리 필름이 접착 테이프를 감을 때 접착층이 서로 엉겨 붙는 것을 방지하는 기능을 가지므로 목적한 어느 한쪽 상에 박리 필름을 가질 수 있으나, 박리 필름을 접착층의 바깥쪽에 배치시켜 감긴 접착 테이프의 안쪽에 오염이 발생하는 것을 방지하는 것이 유리하다. 또한 물론 박리 필름은 접착 테이프의 양쪽에 붙일 수도 있다.
상기한 바대로, 본 발명에 따라서 반도체 부재의 결합은 접착 테이프의 매우 용이한 취급 특성에 의해 우수한 가공성 및 고신뢰도로 달성될 수 있다.
본 발명은 그의 특정 실시양태로 상세히 기술되었지만, 본 분야의 전문가에게 본 발명의 취지 및 범주를 벗어남이 없이 다양한 변화 및 변형을 이룰 수 있다는 것은 명백하다.

Claims (4)

  1. 충진제와, 에폭시 수지 및 폴리에스테르 수지로 이루어진 결합제로 주로 구성되는 접착층이 박리 필름상에 적층되어 있는 구조를 갖는, 릴상에 감긴 연속 테이프로 이루어짐을 특징으로 하는 다이 결합용 접착 테이프.
  2. 제1항에 있어서, 에폭시 수지가 노볼락형 에폭시 수지 및 비스페놀 A형 에폭시 수지의 혼합물인 다이 결합용 접착 테이프.
  3. 제1항에 있어서, 폴리에스테르 수지의 유리 전이온도가 30℃ 이하인 다이 결합용 접착 테이프.
  4. 제1항에 있어서, 결합제증의 폴리에스테르의 비율이 에폭시 수지 100중량부를 기준하여 20 내지 100 중량부인 다이결합용 접착 테이프.
KR1019870009633A 1987-07-15 1987-09-01 다이 결합용 접착 테이프 KR960002767B1 (ko)

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JPH0628269B2 (ja) 1994-04-13
JPS6419735A (en) 1989-01-23
KR890003024A (ko) 1989-04-12

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