KR890003024A - 다이 결합용 접착 테이프 - Google Patents

다이 결합용 접착 테이프 Download PDF

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KR890003024A
KR890003024A KR870009633A KR870009633A KR890003024A KR 890003024 A KR890003024 A KR 890003024A KR 870009633 A KR870009633 A KR 870009633A KR 870009633 A KR870009633 A KR 870009633A KR 890003024 A KR890003024 A KR 890003024A
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South Korea
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adhesive tape
die bonding
epoxy resin
polyester
parts
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KR870009633A
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KR960002767B1 (ko
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유끼노리 사꾸모또
아쯔시 고시무라
히로시 마쯔시따
마사끼 쯔시마
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이노우에 다까오
가부시끼가이샤 도모에가와 세이시쇼
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Publication of KR890003024A publication Critical patent/KR890003024A/ko
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Publication of KR960002767B1 publication Critical patent/KR960002767B1/ko

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    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
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Abstract

내용없음

Description

다이 결합용 접착 테이프
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제 1도는 본 발명에 따른 접착 테이프의 구조에 대한 일례를 나타내는 확대 단면도. 제 2도는 본 발명에 따른 접착 테이프의 일례를 나타내는 투시도. 제 3도는 본 발명에 따른 접착 테이프를 사용한 결합단계를 나타내는 개요도.

Claims (4)

  1. 충진제와, 에폭시 수지 및 폴리에스테르 수지로 이루어진 결합제로 주로 구성되는 접착층이 개봉 필름상에 접층되어 있는 구조를 갖는, 릴상에 감긴 연속적 테이프로 이루어짐을 특징으로 하는 다이 결합용 접착 테이프.
  2. 제 1항에 있어서, 에폭시 수지가 노볼락형 에폭시 수지 및 비스페놀 A형 에폭시 수지의 혼합물인 다이 결합용 접착 테이프
  3. 제 1항에 있어서, 폴리에스테르 수지가 30℃이하의 유리전이온도를 갖는 다이 결합용 접착 테이프
  4. 제 1항에 있어서, 결합제중의 폴리에스테르의 비율이 에폭시 수지 100중량부를 기준하여 20내지 100중량부인 다이 결합용 접착 테이프
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019870009633A 1987-07-15 1987-09-01 다이 결합용 접착 테이프 KR960002767B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP62174826A JPH0628269B2 (ja) 1987-07-15 1987-07-15 ダイボンデイング用接着テ−プ
JP62-174826 1987-07-15

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KR890003024A true KR890003024A (ko) 1989-04-12
KR960002767B1 KR960002767B1 (ko) 1996-02-26

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US (1) US4933219A (ko)
JP (1) JPH0628269B2 (ko)
KR (1) KR960002767B1 (ko)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5436063A (en) * 1993-04-15 1995-07-25 Minnesota Mining And Manufacturing Company Coated abrasive article incorporating an energy cured hot melt make coat
US6485589B1 (en) 1993-04-15 2002-11-26 3M Innovative Properties Company Melt-flowable materials and method of sealing surfaces
US7575653B2 (en) * 1993-04-15 2009-08-18 3M Innovative Properties Company Melt-flowable materials and method of sealing surfaces
KR0137826B1 (ko) * 1994-11-15 1998-04-28 문정환 반도체 디바이스 패키지 방법 및 디바이스 패키지
KR100426298B1 (ko) 1994-12-26 2004-04-08 히다치 가세고교 가부시끼가이샤 필름 형상의 유기 다이본딩재의 라미네이트 방법,다이본딩 방법, 라미네이트 장치, 다이본딩 장치, 반도체장치 및 반도체 장치의 제조 방법
TW310481B (ko) 1995-07-06 1997-07-11 Hitachi Chemical Co Ltd
US7012320B2 (en) 1995-07-06 2006-03-14 Hitachi Chemical Company, Ltd. Semiconductor device and process for fabrication thereof
JP3535281B2 (ja) * 1995-08-31 2004-06-07 株式会社巴川製紙所 電子部品用接着テープ及び液状接着剤
US6077601A (en) 1998-05-01 2000-06-20 3M Innovative Properties Company Coated abrasive article
US6274643B1 (en) 1998-05-01 2001-08-14 3M Innovative Properties Company Epoxy/thermoplastic photocurable adhesive composition
US6228133B1 (en) 1998-05-01 2001-05-08 3M Innovative Properties Company Abrasive articles having abrasive layer bond system derived from solid, dry-coated binder precursor particles having a fusible, radiation curable component
US6057382A (en) 1998-05-01 2000-05-02 3M Innovative Properties Company Epoxy/thermoplastic photocurable adhesive composition
US6136398A (en) * 1998-05-01 2000-10-24 3M Innovative Properties Company Energy cured sealant composition
US6541872B1 (en) 1999-01-11 2003-04-01 Micron Technology, Inc. Multi-layered adhesive for attaching a semiconductor die to a substrate
KR100311820B1 (ko) * 1999-12-08 2001-10-17 이형도 연성기판의 엠보싱 스페이서
US6543510B1 (en) * 2000-06-07 2003-04-08 Micron Technology, Inc. Apparatus and methods for coverlay removal and adhesive application
JP4537555B2 (ja) 2000-09-11 2010-09-01 新日鐵化学株式会社 半導体パッケージの製造方法及び半導体パッケージ
JP3898958B2 (ja) * 2002-02-18 2007-03-28 ソニーケミカル＆インフォメーションデバイス株式会社 異方導電性接着剤及び電気装置
KR100517075B1 (ko) 2003-08-11 2005-09-26 삼성전자주식회사 반도체 소자 제조 방법

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2599359A (en) * 1946-03-21 1952-06-03 American Cyanamid Co Adhesive materials and processes of assembling sheet materials
US3741786A (en) * 1971-05-28 1973-06-26 Avery Products Corp Transfer tape having non-contiguous pressure sensitive adhesive patterns
JPS547441A (en) * 1977-06-17 1979-01-20 Nitto Electric Ind Co Ltd Adhesive composition
JPS57185316A (en) * 1981-05-11 1982-11-15 Sumitomo Metal Mining Co Ltd Electrically conductive resin paste
JPS58112335A (ja) * 1981-12-26 1983-07-04 Nitto Electric Ind Co Ltd 半導体素子固定用接着フイルム
JPS6049636A (ja) * 1983-08-29 1985-03-18 Sumitomo Bakelite Co Ltd チップのマウント方法
GB2152060B (en) * 1983-12-02 1987-05-13 Osaka Soda Co Ltd Electrically conductive adhesive composition
JPS60130494A (ja) * 1983-12-16 1985-07-11 Kitsudo:Kk ダイボンディング用導電性ペ−スト
US4695508A (en) * 1985-09-06 1987-09-22 The Yokohama Rubber Co., Ltd. Adhesive composition

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Publication number Publication date
US4933219A (en) 1990-06-12
JPH0628269B2 (ja) 1994-04-13
JPS6419735A (en) 1989-01-23
KR960002767B1 (ko) 1996-02-26

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