JPH0225431B2 - - Google Patents
Info
- Publication number
- JPH0225431B2 JPH0225431B2 JP58166674A JP16667483A JPH0225431B2 JP H0225431 B2 JPH0225431 B2 JP H0225431B2 JP 58166674 A JP58166674 A JP 58166674A JP 16667483 A JP16667483 A JP 16667483A JP H0225431 B2 JPH0225431 B2 JP H0225431B2
- Authority
- JP
- Japan
- Prior art keywords
- plating
- powder
- core material
- aqueous suspension
- electroless plating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1635—Composition of the substrate
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Powder Metallurgy (AREA)
- Chemically Coating (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58166674A JPS6059070A (ja) | 1983-09-12 | 1983-09-12 | 粉粒体メツキ品の製造法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58166674A JPS6059070A (ja) | 1983-09-12 | 1983-09-12 | 粉粒体メツキ品の製造法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6059070A JPS6059070A (ja) | 1985-04-05 |
| JPH0225431B2 true JPH0225431B2 (enExample) | 1990-06-04 |
Family
ID=15835617
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58166674A Granted JPS6059070A (ja) | 1983-09-12 | 1983-09-12 | 粉粒体メツキ品の製造法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6059070A (enExample) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61276979A (ja) * | 1985-05-30 | 1986-12-06 | Nippon Chem Ind Co Ltd:The | ニッケルめっき材料の製造法 |
| JPS62107073A (ja) * | 1985-11-01 | 1987-05-18 | Nippon Chem Ind Co Ltd:The | 貴金属めっき材料の製造法 |
| JPS6421082A (en) * | 1987-07-15 | 1989-01-24 | Nippon Chemical Ind | Production of powdery plated material |
| JPH01225776A (ja) * | 1988-03-07 | 1989-09-08 | Mitsubishi Metal Corp | 銀被覆球状フエノール樹脂粉末 |
| CN101836266B (zh) | 2007-10-22 | 2012-02-15 | 日本化学工业株式会社 | 包覆导电性粉体以及使用该包覆导电性粉体的导电性粘合剂 |
| JP5425636B2 (ja) | 2007-10-22 | 2014-02-26 | 日本化学工業株式会社 | 被覆導電性粉体およびそれを用いた導電性接着剤 |
| KR101586659B1 (ko) | 2013-09-10 | 2016-01-20 | 한국기계연구원 | 고반응성 금속분말의 산화막 제어방법 |
| JP6863170B2 (ja) * | 2016-12-21 | 2021-04-21 | 住友金属鉱山株式会社 | 無電解めっき液のめっき処理時間の測定方法、無電解めっき液を評価するための試料を作製する試料作製方法、および無電解めっき液の評価方法 |
| KR102568485B1 (ko) * | 2020-12-30 | 2023-08-21 | 한국수력원자력 주식회사 | 원전 주제어실의 냉각을 위한 피동형 냉각장치 |
-
1983
- 1983-09-12 JP JP58166674A patent/JPS6059070A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6059070A (ja) | 1985-04-05 |
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