JPS6059070A - 粉粒体メツキ品の製造法 - Google Patents

粉粒体メツキ品の製造法

Info

Publication number
JPS6059070A
JPS6059070A JP58166674A JP16667483A JPS6059070A JP S6059070 A JPS6059070 A JP S6059070A JP 58166674 A JP58166674 A JP 58166674A JP 16667483 A JP16667483 A JP 16667483A JP S6059070 A JPS6059070 A JP S6059070A
Authority
JP
Japan
Prior art keywords
plating
core material
electroless plating
aqueous suspension
powder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58166674A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0225431B2 (enExample
Inventor
Hiroshi Kawakami
浩 川上
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Chemical Industrial Co Ltd
Original Assignee
Nippon Chemical Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Chemical Industrial Co Ltd filed Critical Nippon Chemical Industrial Co Ltd
Priority to JP58166674A priority Critical patent/JPS6059070A/ja
Publication of JPS6059070A publication Critical patent/JPS6059070A/ja
Publication of JPH0225431B2 publication Critical patent/JPH0225431B2/ja
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1635—Composition of the substrate

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Powder Metallurgy (AREA)
  • Chemically Coating (AREA)
JP58166674A 1983-09-12 1983-09-12 粉粒体メツキ品の製造法 Granted JPS6059070A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58166674A JPS6059070A (ja) 1983-09-12 1983-09-12 粉粒体メツキ品の製造法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58166674A JPS6059070A (ja) 1983-09-12 1983-09-12 粉粒体メツキ品の製造法

Publications (2)

Publication Number Publication Date
JPS6059070A true JPS6059070A (ja) 1985-04-05
JPH0225431B2 JPH0225431B2 (enExample) 1990-06-04

Family

ID=15835617

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58166674A Granted JPS6059070A (ja) 1983-09-12 1983-09-12 粉粒体メツキ品の製造法

Country Status (1)

Country Link
JP (1) JPS6059070A (enExample)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61276979A (ja) * 1985-05-30 1986-12-06 Nippon Chem Ind Co Ltd:The ニッケルめっき材料の製造法
JPS62107073A (ja) * 1985-11-01 1987-05-18 Nippon Chem Ind Co Ltd:The 貴金属めっき材料の製造法
JPS6421082A (en) * 1987-07-15 1989-01-24 Nippon Chemical Ind Production of powdery plated material
JPH01225776A (ja) * 1988-03-07 1989-09-08 Mitsubishi Metal Corp 銀被覆球状フエノール樹脂粉末
WO2009054386A1 (ja) 2007-10-22 2009-04-30 Nippon Chemical Industrial Co., Ltd. 被覆導電性粉体およびそれを用いた導電性接着剤
US8124232B2 (en) 2007-10-22 2012-02-28 Nippon Chemical Industrial Co., Ltd. Coated conductive powder and conductive adhesive using the same
KR20150029835A (ko) 2013-09-10 2015-03-19 한국기계연구원 고반응성 금속분말의 산화막 제어방법
JP2018100442A (ja) * 2016-12-21 2018-06-28 住友金属鉱山株式会社 無電解めっき液のめっき処理時間の測定方法、無電解めっき液を評価するための試料を作製する試料作製方法、および無電解めっき液の評価方法
KR20220095917A (ko) * 2020-12-30 2022-07-07 한국수력원자력 주식회사 원전 주제어실의 냉각을 위한 피동형 냉각장치

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61276979A (ja) * 1985-05-30 1986-12-06 Nippon Chem Ind Co Ltd:The ニッケルめっき材料の製造法
JPS62107073A (ja) * 1985-11-01 1987-05-18 Nippon Chem Ind Co Ltd:The 貴金属めっき材料の製造法
JPS6421082A (en) * 1987-07-15 1989-01-24 Nippon Chemical Ind Production of powdery plated material
JPH01225776A (ja) * 1988-03-07 1989-09-08 Mitsubishi Metal Corp 銀被覆球状フエノール樹脂粉末
WO2009054386A1 (ja) 2007-10-22 2009-04-30 Nippon Chemical Industrial Co., Ltd. 被覆導電性粉体およびそれを用いた導電性接着剤
US8124232B2 (en) 2007-10-22 2012-02-28 Nippon Chemical Industrial Co., Ltd. Coated conductive powder and conductive adhesive using the same
KR20150029835A (ko) 2013-09-10 2015-03-19 한국기계연구원 고반응성 금속분말의 산화막 제어방법
JP2018100442A (ja) * 2016-12-21 2018-06-28 住友金属鉱山株式会社 無電解めっき液のめっき処理時間の測定方法、無電解めっき液を評価するための試料を作製する試料作製方法、および無電解めっき液の評価方法
KR20220095917A (ko) * 2020-12-30 2022-07-07 한국수력원자력 주식회사 원전 주제어실의 냉각을 위한 피동형 냉각장치

Also Published As

Publication number Publication date
JPH0225431B2 (enExample) 1990-06-04

Similar Documents

Publication Publication Date Title
CN106119818B (zh) 一种无机粉体表面化学镀的方法及其薄膜
CN111618316A (zh) 一种表面改性的银粉及其包覆制备方法
JPS6059070A (ja) 粉粒体メツキ品の製造法
JPH0696771B2 (ja) 無電解めっき粉末並びに導電性フィラーおよびその製造方法
JPS60175549A (ja) 触媒方法および触媒系
US4278712A (en) Method for activating non-noble metal colloidal dispersion by controlled oxidation for electroless plating
JPH0293076A (ja) 無電解メッキに利用される微細な金属体の製造方法
JPS60177182A (ja) 無電解メツキ液およびその液を用いるメツキ方法
JPS6320486A (ja) 銀又は銅被膜雲母の製造法
JP2602495B2 (ja) ニツケルめつき材料の製造法
CN107034453B (zh) 一种钯胶体活化液的制备方法
JPS6096548A (ja) 導電性材料
JP3210096B2 (ja) ニッケル合金めっきされた粉末及びその製造方法
JP3905013B2 (ja) 導電性無電解めっき粉体及びその製造方法
JPS61276979A (ja) ニッケルめっき材料の製造法
US4440805A (en) Stabilized dispersion for electroless plating catalysts using corrosion inhibitors as stabilizers
JPS62207878A (ja) 化学めつき用触媒ペ−ストを用いた金属めつき方法
JPS60162779A (ja) 銀メッキ粉体及びその製造方法
JPS62107073A (ja) 貴金属めっき材料の製造法
JPS60177183A (ja) 銀メッキ物品及びその製造方法
JPS62207875A (ja) 金属めつきされた無機粒子粉末の製造方法
CN111364031A (zh) 一种以n,n-二甲基甲酰胺作还原剂在高分子微球表面化学镀层的方法
JPS6237301A (ja) 金属担持粒子の製造方法
CN112719264A (zh) 一种聚苯乙烯/银复合微球的制备方法
JPH04354882A (ja) アルミニウム系無電解めっき粉末並びに導電性フィラーとその製造方法