JPH0224376B2 - - Google Patents

Info

Publication number
JPH0224376B2
JPH0224376B2 JP58140828A JP14082883A JPH0224376B2 JP H0224376 B2 JPH0224376 B2 JP H0224376B2 JP 58140828 A JP58140828 A JP 58140828A JP 14082883 A JP14082883 A JP 14082883A JP H0224376 B2 JPH0224376 B2 JP H0224376B2
Authority
JP
Japan
Prior art keywords
bump
lead
bonding
small
bumps
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP58140828A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6031245A (ja
Inventor
Hideo Ishikawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Priority to JP58140828A priority Critical patent/JPS6031245A/ja
Publication of JPS6031245A publication Critical patent/JPS6031245A/ja
Publication of JPH0224376B2 publication Critical patent/JPH0224376B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/012—
    • H10W72/234—
    • H10W72/244—
    • H10W72/247—
    • H10W72/251—

Landscapes

  • Wire Bonding (AREA)
JP58140828A 1983-08-01 1983-08-01 半導体装置 Granted JPS6031245A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58140828A JPS6031245A (ja) 1983-08-01 1983-08-01 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58140828A JPS6031245A (ja) 1983-08-01 1983-08-01 半導体装置

Publications (2)

Publication Number Publication Date
JPS6031245A JPS6031245A (ja) 1985-02-18
JPH0224376B2 true JPH0224376B2 (enExample) 1990-05-29

Family

ID=15277661

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58140828A Granted JPS6031245A (ja) 1983-08-01 1983-08-01 半導体装置

Country Status (1)

Country Link
JP (1) JPS6031245A (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3700563B2 (ja) 2000-09-04 2005-09-28 セイコーエプソン株式会社 バンプの形成方法及び半導体装置の製造方法
JP2002170838A (ja) * 2000-11-30 2002-06-14 Shinkawa Ltd 半導体装置およびその製造方法
JP2006092006A (ja) * 2004-09-21 2006-04-06 Hitachi Chem Co Ltd 非接触通信機器及びその製造方法

Also Published As

Publication number Publication date
JPS6031245A (ja) 1985-02-18

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