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Sharp Corp
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Sharp Corp
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Application filed by Sharp CorpfiledCriticalSharp Corp
Priority to JP58066266ApriorityCriticalpatent/JPS59191394A/ja
Priority to DE19833319339prioritypatent/DE3319339A1/de
Publication of JPS59191394ApublicationCriticalpatent/JPS59191394A/ja
Publication of JPH0218585B2publicationCriticalpatent/JPH0218585B2/ja
Priority to US07/658,436prioritypatent/US5137205A/en
Method of making an electronic package with a thermally conductive support member having a thin circuitized substrate and semiconductor device bonded thereto
Semiconductor device including a semiconductor pellet having bump electrodes connected to pad electrodes of an interconnect board and method for manufacturing same