JPH0217949B2 - - Google Patents

Info

Publication number
JPH0217949B2
JPH0217949B2 JP59037804A JP3780484A JPH0217949B2 JP H0217949 B2 JPH0217949 B2 JP H0217949B2 JP 59037804 A JP59037804 A JP 59037804A JP 3780484 A JP3780484 A JP 3780484A JP H0217949 B2 JPH0217949 B2 JP H0217949B2
Authority
JP
Japan
Prior art keywords
solder
component
circuit board
printed circuit
lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP59037804A
Other languages
English (en)
Japanese (ja)
Other versions
JPS60182796A (ja
Inventor
Akira Fujii
Osamu Ooshima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP59037804A priority Critical patent/JPS60182796A/ja
Publication of JPS60182796A publication Critical patent/JPS60182796A/ja
Publication of JPH0217949B2 publication Critical patent/JPH0217949B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP59037804A 1984-02-29 1984-02-29 部品取付け方法 Granted JPS60182796A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59037804A JPS60182796A (ja) 1984-02-29 1984-02-29 部品取付け方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59037804A JPS60182796A (ja) 1984-02-29 1984-02-29 部品取付け方法

Publications (2)

Publication Number Publication Date
JPS60182796A JPS60182796A (ja) 1985-09-18
JPH0217949B2 true JPH0217949B2 (enExample) 1990-04-24

Family

ID=12507696

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59037804A Granted JPS60182796A (ja) 1984-02-29 1984-02-29 部品取付け方法

Country Status (1)

Country Link
JP (1) JPS60182796A (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0448266B1 (en) * 1990-03-23 1996-06-05 Motorola, Inc. Surface mountable semiconductor device having self loaded solder joints
JP3202221B2 (ja) * 1990-11-22 2001-08-27 日本たばこ産業株式会社 シガレットの製造方法及び装置

Also Published As

Publication number Publication date
JPS60182796A (ja) 1985-09-18

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