JPS60182796A - 部品取付け方法 - Google Patents

部品取付け方法

Info

Publication number
JPS60182796A
JPS60182796A JP59037804A JP3780484A JPS60182796A JP S60182796 A JPS60182796 A JP S60182796A JP 59037804 A JP59037804 A JP 59037804A JP 3780484 A JP3780484 A JP 3780484A JP S60182796 A JPS60182796 A JP S60182796A
Authority
JP
Japan
Prior art keywords
solder
printed circuit
circuit board
pad
lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP59037804A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0217949B2 (enExample
Inventor
明 藤井
大嶋　修
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP59037804A priority Critical patent/JPS60182796A/ja
Publication of JPS60182796A publication Critical patent/JPS60182796A/ja
Publication of JPH0217949B2 publication Critical patent/JPH0217949B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP59037804A 1984-02-29 1984-02-29 部品取付け方法 Granted JPS60182796A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59037804A JPS60182796A (ja) 1984-02-29 1984-02-29 部品取付け方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59037804A JPS60182796A (ja) 1984-02-29 1984-02-29 部品取付け方法

Publications (2)

Publication Number Publication Date
JPS60182796A true JPS60182796A (ja) 1985-09-18
JPH0217949B2 JPH0217949B2 (enExample) 1990-04-24

Family

ID=12507696

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59037804A Granted JPS60182796A (ja) 1984-02-29 1984-02-29 部品取付け方法

Country Status (1)

Country Link
JP (1) JPS60182796A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5222509A (en) * 1990-11-22 1993-06-29 Japan Tobacco Inc. Method of making cigarettes and apparatus therefore
JPH065760A (ja) * 1990-03-23 1994-01-14 Motorola Inc 表面実装型半導体装置用パッケージリード

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH065760A (ja) * 1990-03-23 1994-01-14 Motorola Inc 表面実装型半導体装置用パッケージリード
US5222509A (en) * 1990-11-22 1993-06-29 Japan Tobacco Inc. Method of making cigarettes and apparatus therefore

Also Published As

Publication number Publication date
JPH0217949B2 (enExample) 1990-04-24

Similar Documents

Publication Publication Date Title
JPS60182796A (ja) 部品取付け方法
JPS60201696A (ja) フラツトパツケ−ジの半田付方法
JPH0362935A (ja) フィルムキャリヤ型半導体装置の実装方法
JPS594196A (ja) 半導体部品実装用半田バンプの形成方法
JPS60182797A (ja) 部品の取付け方法
JP2625973B2 (ja) 半田供給方法
JP3795599B2 (ja) はんだ転写方法
JPS60161693A (ja) プリント基板
JPS61290799A (ja) 電子部品の製造方法
JP2000100863A (ja) はんだバンプの形成方法
JPH0917913A (ja) 電子回路装置
JPS59207690A (ja) 集積回路素子の実装方法
JPH04343239A (ja) ボンディングツール
JPS63204696A (ja) 可撓性プリント基板への部品ハンダ付け実装法
JPS6387794A (ja) 回路基板のリフロ−半田付用当て具及び半田付方法
JPS63177584A (ja) 混成集積回路の組立方法
JPH0418741A (ja) Ｌｓｉベアチップの実装方法
JPS5999792A (ja) 予備半田後の半田面の半田量規制方法
JPS61287197A (ja) 電子部品の製造方法
JPH0653396A (ja) 半導体装置の組立方法
JPS58105594A (ja) 混成集積回路装置の製造方法
JPH0210886A (ja) リードレス電子部品の実装方法
JPH0529759A (ja) レーザはんだ付け方法
JPH08162482A (ja) 半導体装置
JPH03204950A (ja) テープキャリアのボンディング方法