JPH0212022B2 - - Google Patents
Info
- Publication number
- JPH0212022B2 JPH0212022B2 JP57037580A JP3758082A JPH0212022B2 JP H0212022 B2 JPH0212022 B2 JP H0212022B2 JP 57037580 A JP57037580 A JP 57037580A JP 3758082 A JP3758082 A JP 3758082A JP H0212022 B2 JPH0212022 B2 JP H0212022B2
- Authority
- JP
- Japan
- Prior art keywords
- bonding
- tensile strength
- rare earth
- high temperature
- earth element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229910001020 Au alloy Inorganic materials 0.000 claims abstract description 12
- 239000003353 gold alloy Substances 0.000 claims abstract description 12
- GWXLDORMOJMVQZ-UHFFFAOYSA-N cerium Chemical group [Ce] GWXLDORMOJMVQZ-UHFFFAOYSA-N 0.000 claims abstract description 8
- 239000010931 gold Substances 0.000 claims abstract description 8
- 229910052761 rare earth metal Inorganic materials 0.000 claims abstract description 8
- 229910052737 gold Inorganic materials 0.000 claims abstract description 7
- 229910052790 beryllium Inorganic materials 0.000 claims abstract description 6
- 229910052732 germanium Inorganic materials 0.000 claims abstract description 6
- 239000012535 impurity Substances 0.000 claims abstract description 4
- 239000004065 semiconductor Substances 0.000 claims description 18
- 229910052684 Cerium Inorganic materials 0.000 claims description 2
- 229910052779 Neodymium Inorganic materials 0.000 claims description 2
- 229910052777 Praseodymium Inorganic materials 0.000 claims description 2
- 229910052746 lanthanum Inorganic materials 0.000 claims description 2
- 230000000694 effects Effects 0.000 abstract description 4
- 239000000956 alloy Substances 0.000 abstract description 3
- 229910045601 alloy Inorganic materials 0.000 abstract description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 13
- 239000000463 material Substances 0.000 description 6
- 238000005491 wire drawing Methods 0.000 description 4
- 229910052759 nickel Inorganic materials 0.000 description 3
- 239000013078 crystal Substances 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 238000009864 tensile test Methods 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 238000001953 recrystallisation Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 238000007665 sagging Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01004—Beryllium [Be]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/0102—Calcium [Ca]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01021—Scandium [Sc]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01039—Yttrium [Y]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01057—Lanthanum [La]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01058—Cerium [Ce]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01078—Platinum [Pt]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/011—Groups of the periodic table
- H01L2924/01105—Rare earth metals
Priority Applications (12)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP57037580A JPS58154242A (ja) | 1982-03-10 | 1982-03-10 | 半導体素子ボンデイング用金合金細線 |
GB08227141A GB2116208B (en) | 1981-12-04 | 1982-09-23 | Fine gold alloy wire for bonding of a semiconductor device |
NL8203706A NL8203706A (nl) | 1981-12-04 | 1982-09-24 | Draad vervaardigd uit een goudlegering en halfgeleiderorgaan voorzien van een dergelijke draad. |
FR8216472A FR2517885B1 (fr) | 1981-12-04 | 1982-09-30 | Fil d'alliage d'or fin pour connecter un dispositif a semi-conducteur |
DE19823237385 DE3237385A1 (de) | 1981-12-04 | 1982-10-08 | Feingoldlegierungsdraht zum verbinden von halbleiterelementen |
KR8204586A KR890003143B1 (ko) | 1981-12-04 | 1982-10-12 | 반도체 소자 결선용 금합금 세선 |
IT68243/82A IT1156088B (it) | 1981-12-04 | 1982-10-25 | Filo sottile in lega d oro per il collegamento di un dispositivo a semiconduttore |
SG934/87A SG93487G (en) | 1981-12-04 | 1987-10-26 | Fine gold alloy wire for bonding of a semiconductor device |
MY920/87A MY8700920A (en) | 1981-12-04 | 1987-12-30 | Fine gold alloy wire for bonding of a semiconductor device |
HK178/88A HK17888A (en) | 1981-12-04 | 1988-03-03 | Fine gold alloy wire for bonding of a semiconductor device |
US07/296,350 US4885135A (en) | 1981-12-04 | 1989-01-09 | Fine gold alloy wire for bonding of a semi-conductor device |
US07/445,542 US5071619A (en) | 1981-12-04 | 1989-12-04 | Fine gold alloy wire for bonding of a semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP57037580A JPS58154242A (ja) | 1982-03-10 | 1982-03-10 | 半導体素子ボンデイング用金合金細線 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP3060831A Division JPH0647699B2 (ja) | 1991-01-29 | 1991-01-29 | 半導体素子ボンディング用金合金細線 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS58154242A JPS58154242A (ja) | 1983-09-13 |
JPH0212022B2 true JPH0212022B2 (ko) | 1990-03-16 |
Family
ID=12501472
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP57037580A Granted JPS58154242A (ja) | 1981-12-04 | 1982-03-10 | 半導体素子ボンデイング用金合金細線 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS58154242A (ko) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8440137B2 (en) | 2004-11-26 | 2013-05-14 | Tanaka Denshi Kogyo K.K. | Au bonding wire for semiconductor device |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6030158A (ja) * | 1983-07-29 | 1985-02-15 | Sumitomo Metal Mining Co Ltd | ボンデイングワイヤ− |
JPS62228440A (ja) * | 1986-03-28 | 1987-10-07 | Matsuda Kikinzoku Kogyo Kk | 半導体素子ボンデイング用金線 |
JP2536546B2 (ja) * | 1987-09-21 | 1996-09-18 | 三菱マテリアル株式会社 | 経時的硬さ低下のない半導体装置のろう付け用Au合金リボン箔材 |
JPH01146336A (ja) * | 1987-12-03 | 1989-06-08 | Mitsubishi Metal Corp | 半導体素子ボンディング用Au合金極細線 |
JP2621288B2 (ja) * | 1988-02-02 | 1997-06-18 | 三菱マテリアル株式会社 | 半導体素子ボンディング用Au合金極細線 |
JP2778093B2 (ja) * | 1988-09-29 | 1998-07-23 | 三菱マテリアル株式会社 | 金バンプ用金合金細線 |
JP2773202B2 (ja) * | 1989-03-24 | 1998-07-09 | 三菱マテリアル株式会社 | 半導体素子ボンディング用Au合金極細線 |
JP2641000B2 (ja) * | 1991-12-26 | 1997-08-13 | 新日本製鐵株式会社 | ボンディング用金合金細線 |
JP5311715B2 (ja) | 2005-01-24 | 2013-10-09 | 新日鉄住金マテリアルズ株式会社 | 半導体素子接続用金線 |
JP5258175B2 (ja) * | 2006-07-04 | 2013-08-07 | 田中電子工業株式会社 | 半導体素子用Auボンディングワイヤ |
JP5383419B2 (ja) | 2009-10-14 | 2014-01-08 | 株式会社日立ハイテクノロジーズ | イオンビーム装置 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS53112059A (en) * | 1977-03-11 | 1978-09-30 | Tanaka Electronics Ind | Gold wire for bonding semiconductor |
JPS53112061A (en) * | 1977-03-11 | 1978-09-30 | Sharp Corp | Wiring substrate of semiconductor chip |
JPH0212022A (ja) * | 1988-06-30 | 1990-01-17 | Canon Inc | 超伝導光検出素子 |
-
1982
- 1982-03-10 JP JP57037580A patent/JPS58154242A/ja active Granted
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS53112059A (en) * | 1977-03-11 | 1978-09-30 | Tanaka Electronics Ind | Gold wire for bonding semiconductor |
JPS53112061A (en) * | 1977-03-11 | 1978-09-30 | Sharp Corp | Wiring substrate of semiconductor chip |
JPH0212022A (ja) * | 1988-06-30 | 1990-01-17 | Canon Inc | 超伝導光検出素子 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8440137B2 (en) | 2004-11-26 | 2013-05-14 | Tanaka Denshi Kogyo K.K. | Au bonding wire for semiconductor device |
Also Published As
Publication number | Publication date |
---|---|
JPS58154242A (ja) | 1983-09-13 |
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