JPH0212019B2 - - Google Patents

Info

Publication number
JPH0212019B2
JPH0212019B2 JP58105306A JP10530683A JPH0212019B2 JP H0212019 B2 JPH0212019 B2 JP H0212019B2 JP 58105306 A JP58105306 A JP 58105306A JP 10530683 A JP10530683 A JP 10530683A JP H0212019 B2 JPH0212019 B2 JP H0212019B2
Authority
JP
Japan
Prior art keywords
film
gate electrode
mask
etching
insulating film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP58105306A
Other languages
English (en)
Japanese (ja)
Other versions
JPS59229876A (ja
Inventor
Toshuki Terada
Nobuyuki Toyoda
Akimichi Hojo
Kyoo Kamei
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Shibaura Electric Co Ltd filed Critical Tokyo Shibaura Electric Co Ltd
Priority to JP58105306A priority Critical patent/JPS59229876A/ja
Priority to DE8484303864T priority patent/DE3483851D1/de
Priority to EP84303864A priority patent/EP0128751B1/en
Priority to US06/618,262 priority patent/US4569119A/en
Publication of JPS59229876A publication Critical patent/JPS59229876A/ja
Publication of JPH0212019B2 publication Critical patent/JPH0212019B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/01—Manufacture or treatment
    • H10D30/061—Manufacture or treatment of FETs having Schottky gates
    • H10D30/0612—Manufacture or treatment of FETs having Schottky gates of lateral single-gate Schottky FETs
    • H10D30/0614—Manufacture or treatment of FETs having Schottky gates of lateral single-gate Schottky FETs using processes wherein the final gate is made after the completion of the source and drain regions, e.g. gate-last processes using dummy gates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/60—Insulated-gate field-effect transistors [IGFET]
    • H10D30/67—Thin-film transistors [TFT]
    • H10D30/6729—Thin-film transistors [TFT] characterised by the electrodes
    • H10D30/6737—Thin-film transistors [TFT] characterised by the electrodes characterised by the electrode materials
    • H10D30/6738—Schottky barrier electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/60—Insulated-gate field-effect transistors [IGFET]
    • H10D30/67—Thin-film transistors [TFT]
    • H10D30/674—Thin-film transistors [TFT] characterised by the active materials
    • H10D30/675—Group III-V materials, Group II-VI materials, Group IV-VI materials, selenium or tellurium
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/80—FETs having rectifying junction gate electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/80—FETs having rectifying junction gate electrodes
    • H10D30/87—FETs having Schottky gate electrodes, e.g. metal-semiconductor FETs [MESFET]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00—Electrodes of devices having potential barriers
    • H10D64/60—Electrodes characterised by their materials
    • H10D64/64—Electrodes comprising a Schottky barrier to a semiconductor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/80—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
    • H10D62/85—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group III-V materials, e.g. GaAs

Landscapes

  • Junction Field-Effect Transistors (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Drying Of Semiconductors (AREA)
JP58105306A 1983-06-13 1983-06-13 シヨツトキ−ゲ−ト型電界効果トランジスタの製造方法 Granted JPS59229876A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP58105306A JPS59229876A (ja) 1983-06-13 1983-06-13 シヨツトキ−ゲ−ト型電界効果トランジスタの製造方法
DE8484303864T DE3483851D1 (de) 1983-06-13 1984-06-07 Verfahren zur herstellung eines schottky-gate-feldeffekttransistors.
EP84303864A EP0128751B1 (en) 1983-06-13 1984-06-07 Manufacturing method of schottky gate fet
US06/618,262 US4569119A (en) 1983-06-13 1984-06-07 Manufacturing method of Schottky gate FET

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58105306A JPS59229876A (ja) 1983-06-13 1983-06-13 シヨツトキ−ゲ−ト型電界効果トランジスタの製造方法

Publications (2)

Publication Number Publication Date
JPS59229876A JPS59229876A (ja) 1984-12-24
JPH0212019B2 true JPH0212019B2 (en, 2012) 1990-03-16

Family

ID=14404016

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58105306A Granted JPS59229876A (ja) 1983-06-13 1983-06-13 シヨツトキ−ゲ−ト型電界効果トランジスタの製造方法

Country Status (4)

Country Link
US (1) US4569119A (en, 2012)
EP (1) EP0128751B1 (en, 2012)
JP (1) JPS59229876A (en, 2012)
DE (1) DE3483851D1 (en, 2012)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0793318B2 (ja) * 1984-10-11 1995-10-09 日本電気株式会社 半導体装置の製造方法
JPH0793319B2 (ja) * 1984-10-16 1995-10-09 松下電子工業株式会社 電界効果トランジスタの製造方法
US4632713A (en) * 1985-07-31 1986-12-30 Texas Instruments Incorporated Process of making Schottky barrier devices formed by diffusion before contacting
DE3576610D1 (de) * 1985-12-06 1990-04-19 Ibm Verfahren zum herstellen eines voellig selbstjustierten feldeffekttransistors.
US4745082A (en) * 1986-06-12 1988-05-17 Ford Microelectronics, Inc. Method of making a self-aligned MESFET using a substitutional gate with side walls
JPS6362272A (ja) * 1986-09-02 1988-03-18 Seiko Instr & Electronics Ltd 半導体装置の製造方法
US4859618A (en) * 1986-11-20 1989-08-22 Sumitomo Electric Industries, Ltd. Method of producing the gate electrode of a field effect transistor
JPS63132452A (ja) * 1986-11-24 1988-06-04 Mitsubishi Electric Corp パタ−ン形成方法
WO1989001235A1 (en) * 1987-08-03 1989-02-09 Ford Microelectronics, Inc. High effective barrier height transistor and method of making same
US5229323A (en) * 1987-08-21 1993-07-20 Kabushiki Kaisha Toshiba Method for manufacturing a semiconductor device with Schottky electrodes
US4843037A (en) * 1987-08-21 1989-06-27 Bell Communications Research, Inc. Passivation of indium gallium arsenide surfaces
JPS6455871A (en) * 1987-08-26 1989-03-02 Sumitomo Electric Industries Manufacture of self-alignment type gate electrode
JPH0787195B2 (ja) * 1987-10-22 1995-09-20 三菱電機株式会社 ショットキゲート電界効果トランジスタの製造方法
JPH01114041A (ja) * 1987-10-27 1989-05-02 Nec Corp 微細パタン形成方法
US4863879A (en) * 1987-12-16 1989-09-05 Ford Microelectronics, Inc. Method of manufacturing self-aligned GaAs MESFET
JPH0748502B2 (ja) * 1988-05-13 1995-05-24 三菱電機株式会社 半導体装置の製造方法
US4947062A (en) * 1988-05-19 1990-08-07 Adams Russell Electronics Co., Inc. Double balanced mixing
DE3911512A1 (de) * 1988-09-07 1990-03-22 Licentia Gmbh Selbstjustierendes verfahren zur herstellung einer steuerelektrode
US5143857A (en) * 1988-11-07 1992-09-01 Triquint Semiconductor, Inc. Method of fabricating an electronic device with reduced susceptiblity to backgating effects
JP2550412B2 (ja) * 1989-05-15 1996-11-06 ローム株式会社 電界効果トランジスタの製造方法
JPH0817184B2 (ja) * 1989-11-08 1996-02-21 三菱電機株式会社 化合物半導体装置の製造方法
DE59009067D1 (de) * 1990-04-27 1995-06-14 Siemens Ag Verfahren zur Herstellung einer Öffnung in einem Halbleiterschichtaufbau und dessen Verwendung zur Herstellung von Kontaktlöchern.
US6406950B1 (en) * 2000-12-07 2002-06-18 Advanced Micro Devices, Inc. Definition of small damascene metal gates using reverse through approach
JP3959032B2 (ja) * 2003-01-08 2007-08-15 松下電器産業株式会社 固体撮像装置の製造方法
KR100871967B1 (ko) * 2007-06-05 2008-12-08 주식회사 하이닉스반도체 반도체 소자의 미세 패턴 형성 방법
US8950215B2 (en) * 2010-10-06 2015-02-10 Apple Inc. Non-contact polishing techniques for reducing roughness on glass surfaces

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4481704A (en) * 1978-04-21 1984-11-13 Texas Instruments Incorporated Method of making an improved MESFET semiconductor device
JPS55153377A (en) * 1979-05-18 1980-11-29 Matsushita Electronics Corp Production of semiconductor device
US4344980A (en) * 1981-03-25 1982-08-17 The United States Of America As Represented By The Secretary Of The Navy Superior ohmic contacts to III-V semiconductor by virtue of double donor impurity
JPS57196581A (en) * 1981-05-27 1982-12-02 Matsushita Electric Ind Co Ltd Manufacture of semiconductor device
JPS5896769A (ja) * 1981-12-04 1983-06-08 Oki Electric Ind Co Ltd 半導体素子の製造方法
US4403396A (en) * 1981-12-24 1983-09-13 Gte Laboratories Incorporated Semiconductor device design and process
US4561169A (en) * 1982-07-30 1985-12-31 Hitachi, Ltd. Method of manufacturing semiconductor device utilizing multilayer mask
JPS59114871A (ja) * 1982-12-21 1984-07-03 Toshiba Corp シヨツトキ−ゲ−ト型ＧａＡｓ電界効果トランジスタの製造方法

Also Published As

Publication number Publication date
EP0128751A2 (en) 1984-12-19
JPS59229876A (ja) 1984-12-24
EP0128751B1 (en) 1990-12-27
US4569119A (en) 1986-02-11
DE3483851D1 (de) 1991-02-07
EP0128751A3 (en) 1986-11-20

Similar Documents

Publication Publication Date Title
JPH0212019B2 (en, 2012)
KR920002090B1 (ko) 전계효과 트랜지스터의 제조방법
JP2778600B2 (ja) 半導体装置の製造方法
US4645563A (en) Method of manufacturing GaAs field effect transistor
KR900008277B1 (ko) 전계효과 트랜지스터의 제조방법
JPS63263770A (ja) ＧａＡｓ　ＭＥＳＦＥＴ及びその製造方法
EP0706202A2 (en) Method for producing a pattern and a semiconductor device
KR940001402B1 (ko) 골드구조를 가지는 반도체소자의 제조방법
JP2677401B2 (ja) 自己整列ゲートｆｅｔの製造方法
US5001077A (en) Method of producing an asymmetrically doped LDD MESFET
JPH0329301B2 (en, 2012)
US4587709A (en) Method of making short channel IGFET
US5780345A (en) Semiconductor device and method for forming the same
US5640029A (en) Field-effect transistor and method of producing same
JPS6323669B2 (en, 2012)
JPS6258154B2 (en, 2012)
JPH0219622B2 (en, 2012)
JPH1070138A (ja) 半導体装置の製造方法
JP2003297853A (ja) 電界効果トランジスタの製造方法
JPH04350945A (ja) 電界効果トランジスタの製造方法
JP2003218129A (ja) 半導体装置およびその製造方法
JPS6163063A (ja) 半導体装置の製造方法
JPH0684954A (ja) 半導体装置の製造方法
JPH033932B2 (en, 2012)
EP0366939A2 (en) A process for forming a Schottky barrier gate on gallium-arsenide