JPH0187549U - - Google Patents

Info

Publication number
JPH0187549U
JPH0187549U JP18482687U JP18482687U JPH0187549U JP H0187549 U JPH0187549 U JP H0187549U JP 18482687 U JP18482687 U JP 18482687U JP 18482687 U JP18482687 U JP 18482687U JP H0187549 U JPH0187549 U JP H0187549U
Authority
JP
Japan
Prior art keywords
semiconductor element
dam
sealing material
semiconductor
surround
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP18482687U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP18482687U priority Critical patent/JPH0187549U/ja
Publication of JPH0187549U publication Critical patent/JPH0187549U/ja
Pending legal-status Critical Current

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  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP18482687U 1987-12-03 1987-12-03 Pending JPH0187549U (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18482687U JPH0187549U (zh) 1987-12-03 1987-12-03

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18482687U JPH0187549U (zh) 1987-12-03 1987-12-03

Publications (1)

Publication Number Publication Date
JPH0187549U true JPH0187549U (zh) 1989-06-09

Family

ID=31476163

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18482687U Pending JPH0187549U (zh) 1987-12-03 1987-12-03

Country Status (1)

Country Link
JP (1) JPH0187549U (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014220305A (ja) * 2013-05-06 2014-11-20 株式会社デンソー 多層基板およびこれを用いた電子装置、電子装置の製造方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5916351A (ja) * 1982-07-19 1984-01-27 Matsushita Electric Ind Co Ltd 電子回路装置とその製造方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5916351A (ja) * 1982-07-19 1984-01-27 Matsushita Electric Ind Co Ltd 電子回路装置とその製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014220305A (ja) * 2013-05-06 2014-11-20 株式会社デンソー 多層基板およびこれを用いた電子装置、電子装置の製造方法

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