JPH0153501B2 - - Google Patents

Info

Publication number
JPH0153501B2
JPH0153501B2 JP58029097A JP2909783A JPH0153501B2 JP H0153501 B2 JPH0153501 B2 JP H0153501B2 JP 58029097 A JP58029097 A JP 58029097A JP 2909783 A JP2909783 A JP 2909783A JP H0153501 B2 JPH0153501 B2 JP H0153501B2
Authority
JP
Japan
Prior art keywords
mold
lead frame
chuck
semiconductor lead
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP58029097A
Other languages
English (en)
Japanese (ja)
Other versions
JPS59154031A (ja
Inventor
Takeshi Amakawa
Michio Osada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to JP2909783A priority Critical patent/JPS59154031A/ja
Publication of JPS59154031A publication Critical patent/JPS59154031A/ja
Publication of JPH0153501B2 publication Critical patent/JPH0153501B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP2909783A 1983-02-22 1983-02-22 半導体リ−ドフレ−ムの自動供給・取出方法 Granted JPS59154031A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2909783A JPS59154031A (ja) 1983-02-22 1983-02-22 半導体リ−ドフレ−ムの自動供給・取出方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2909783A JPS59154031A (ja) 1983-02-22 1983-02-22 半導体リ−ドフレ−ムの自動供給・取出方法

Publications (2)

Publication Number Publication Date
JPS59154031A JPS59154031A (ja) 1984-09-03
JPH0153501B2 true JPH0153501B2 (ru) 1989-11-14

Family

ID=12266845

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2909783A Granted JPS59154031A (ja) 1983-02-22 1983-02-22 半導体リ−ドフレ−ムの自動供給・取出方法

Country Status (1)

Country Link
JP (1) JPS59154031A (ru)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3429441A1 (de) * 1984-08-10 1986-02-20 Hoechst Ag, 6230 Frankfurt Thermoplastische, weichmacherhaltige polyvinylbutyralformmassen
JP2612465B2 (ja) * 1988-03-22 1997-05-21 半導体フレームの供給方法
JP6164380B1 (ja) * 2017-01-30 2017-07-19 第一精工株式会社 基材の搬送装置及び基材の搬送方法
JP7240339B2 (ja) * 2020-01-20 2023-03-15 Ｔｏｗａ株式会社 樹脂成形品の製造方法及び樹脂成形装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5287768A (en) * 1976-01-16 1977-07-22 Yamada Seisakusho Kk Automatic conveying frame body for work load frame
JPS5287767A (en) * 1976-01-16 1977-07-22 Yamada Seisakusho Kk Automatic loading device for work load frame

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5287768A (en) * 1976-01-16 1977-07-22 Yamada Seisakusho Kk Automatic conveying frame body for work load frame
JPS5287767A (en) * 1976-01-16 1977-07-22 Yamada Seisakusho Kk Automatic loading device for work load frame

Also Published As

Publication number Publication date
JPS59154031A (ja) 1984-09-03

Similar Documents

Publication Publication Date Title
US4826641A (en) Injection molding process
JPH0153501B2 (ru)
JP2567603B2 (ja) 連続自動樹脂封止方法
JPS5839425A (ja) 低圧射出成形法
JPS59165632A (ja) 中空品の射出成形方法及び装置
JPH0416940B2 (ru)
JP3195840B2 (ja) 樹脂モールド装置及びその制御方法
JPH0374892B2 (ru)
JP3419228B2 (ja) 二段離型方式射出成形金型
JP2000052390A (ja) プラスチック部品の成形方法およびその金型
JP2736664B2 (ja) 射出成形品の製法
JPH0590314A (ja) 半導体の樹脂封止成形方法
JP2683204B2 (ja) 樹脂パッケージング方法及びその装置
JPS588622A (ja) 精密プラスチツク部品の成形方法
JP4025060B2 (ja) スタックモールド金型
JPH0449018A (ja) 二層射出成形品の製造方法および成形金型
JP2002187175A (ja) 半導体樹脂封止成形品の取出方法
JP2794261B2 (ja) 合成樹脂成形品の成形用金型
JPH0222018A (ja) 射出成形機
JPH11353720A (ja) 光ディスク基板の製造方法
JPH0511531B2 (ru)
JPS60122125A (ja) 合成樹脂の多色成形方法
KR19980031214A (ko) 사출 성형품 성형방법
JPS59178230A (ja) 射出圧縮成形方法
JPH03109746A (ja) 半導体素子の樹脂封止方法及び樹脂封止金型