JPH0148526B2 - - Google Patents
Info
- Publication number
- JPH0148526B2 JPH0148526B2 JP5871882A JP5871882A JPH0148526B2 JP H0148526 B2 JPH0148526 B2 JP H0148526B2 JP 5871882 A JP5871882 A JP 5871882A JP 5871882 A JP5871882 A JP 5871882A JP H0148526 B2 JPH0148526 B2 JP H0148526B2
- Authority
- JP
- Japan
- Prior art keywords
- photoresist
- halogen atom
- light
- lower alkyl
- film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229920002120 photoresistant polymer Polymers 0.000 claims description 63
- 239000006096 absorbing agent Substances 0.000 claims description 31
- 229920001971 elastomer Polymers 0.000 claims description 12
- 125000005843 halogen group Chemical group 0.000 claims description 10
- 125000000217 alkyl group Chemical group 0.000 claims description 8
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 6
- 125000000449 nitro group Chemical group [O-][N+](*)=O 0.000 claims description 6
- 229920003986 novolac Polymers 0.000 claims description 5
- -1 o-quinone azide compound Chemical class 0.000 claims description 5
- 229920005989 resin Polymers 0.000 claims description 5
- 239000011347 resin Substances 0.000 claims description 5
- 125000004432 carbon atom Chemical group C* 0.000 claims description 4
- WQMWHMMJVJNCAL-UHFFFAOYSA-N 2,4-dimethylpenta-1,4-dien-3-one Chemical compound CC(=C)C(=O)C(C)=C WQMWHMMJVJNCAL-UHFFFAOYSA-N 0.000 claims description 3
- 150000001875 compounds Chemical class 0.000 claims description 3
- 229920002454 poly(glycidyl methacrylate) polymer Polymers 0.000 claims description 3
- 229920003229 poly(methyl methacrylate) Polymers 0.000 claims description 3
- 239000004926 polymethyl methacrylate Substances 0.000 claims description 3
- 239000000758 substrate Substances 0.000 description 12
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 10
- 229910052782 aluminium Inorganic materials 0.000 description 10
- 239000002250 absorbent Substances 0.000 description 8
- 230000002745 absorbent Effects 0.000 description 8
- 230000000694 effects Effects 0.000 description 7
- 239000000047 product Substances 0.000 description 6
- 238000000034 method Methods 0.000 description 5
- 239000002904 solvent Substances 0.000 description 5
- 238000000859 sublimation Methods 0.000 description 5
- 230000008022 sublimation Effects 0.000 description 5
- 239000013078 crystal Substances 0.000 description 4
- 238000011161 development Methods 0.000 description 4
- 239000003921 oil Substances 0.000 description 4
- 238000001259 photo etching Methods 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 238000009792 diffusion process Methods 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- JPSIGBPVFZRYFI-UHFFFAOYSA-N 4-[(4-chlorophenyl)diazenyl]-n,n-diethylaniline Chemical compound C1=CC(N(CC)CC)=CC=C1N=NC1=CC=C(Cl)C=C1 JPSIGBPVFZRYFI-UHFFFAOYSA-N 0.000 description 2
- DKPFZGUDAPQIHT-UHFFFAOYSA-N butyl acetate Chemical compound CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 description 2
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 2
- 238000007654 immersion Methods 0.000 description 2
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 2
- 229910052753 mercury Inorganic materials 0.000 description 2
- LVQIWDUSUJTZJF-UHFFFAOYSA-N n,n-diethyl-4-[(4-nitrophenyl)diazenyl]aniline Chemical compound C1=CC(N(CC)CC)=CC=C1N=NC1=CC=C([N+]([O-])=O)C=C1 LVQIWDUSUJTZJF-UHFFFAOYSA-N 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 239000002244 precipitate Substances 0.000 description 2
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- 238000011160 research Methods 0.000 description 2
- 239000013557 residual solvent Substances 0.000 description 2
- 230000035945 sensitivity Effects 0.000 description 2
- 230000037303 wrinkles Effects 0.000 description 2
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- AYKNBEUSHQHYSX-UHFFFAOYSA-N 4-[(4-ethoxyphenyl)diazenyl]-n,n-diethylaniline Chemical compound C1=CC(OCC)=CC=C1N=NC1=CC=C(N(CC)CC)C=C1 AYKNBEUSHQHYSX-UHFFFAOYSA-N 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 238000002835 absorbance Methods 0.000 description 1
- 239000011358 absorbing material Substances 0.000 description 1
- 150000001555 benzenes Chemical class 0.000 description 1
- 125000001246 bromo group Chemical group Br* 0.000 description 1
- 125000001309 chloro group Chemical group Cl* 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 239000003814 drug Substances 0.000 description 1
- 229940079593 drug Drugs 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000031700 light absorption Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 125000004433 nitrogen atom Chemical group N* 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 238000002161 passivation Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000004083 survival effect Effects 0.000 description 1
- WGTYBPLFGIVFAS-UHFFFAOYSA-M tetramethylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)C WGTYBPLFGIVFAS-UHFFFAOYSA-M 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
- G03F7/091—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers characterised by antireflection means or light filtering or absorbing means, e.g. anti-halation, contrast enhancement
Landscapes
- Engineering & Computer Science (AREA)
- Architecture (AREA)
- Structural Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5871882A JPS58174941A (ja) | 1982-04-08 | 1982-04-08 | 新規な吸光剤及びそれを含有するホトレジスト組成物 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5871882A JPS58174941A (ja) | 1982-04-08 | 1982-04-08 | 新規な吸光剤及びそれを含有するホトレジスト組成物 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58174941A JPS58174941A (ja) | 1983-10-14 |
| JPH0148526B2 true JPH0148526B2 (en, 2012) | 1989-10-19 |
Family
ID=13092271
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5871882A Granted JPS58174941A (ja) | 1982-04-08 | 1982-04-08 | 新規な吸光剤及びそれを含有するホトレジスト組成物 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58174941A (en, 2012) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0193603A4 (en) * | 1984-09-13 | 1988-04-06 | Advanced Micro Devices Inc | PHOTOLITOGRAPHIC PROCESS USING POSITIVE PROTECTIVE PHOTOGRAPHIC MATERIAL CONTAINING A COLORLESS LIGHT ABSORBING AGENT. |
| JP2614847B2 (ja) * | 1986-06-16 | 1997-05-28 | 東京応化工業 株式会社 | ポジ型感光性組成物 |
| JPH0823692B2 (ja) * | 1986-12-24 | 1996-03-06 | 日本合成ゴム株式会社 | ポジ型ホトレジスト |
| JPS63161443A (ja) * | 1986-12-24 | 1988-07-05 | Sumitomo Chem Co Ltd | フオトレジスト組成物 |
| JPS63286843A (ja) * | 1987-05-19 | 1988-11-24 | Nippon Zeon Co Ltd | ポジ型フォトレジスト組成物 |
| JP2654947B2 (ja) * | 1987-07-16 | 1997-09-17 | 日本ゼオン株式会社 | ポジ型フォトレジスト組成物 |
| JP2584316B2 (ja) * | 1988-06-30 | 1997-02-26 | 富士写真フイルム株式会社 | ポジ型フオトレジスト組成物 |
| JPH02269348A (ja) * | 1989-04-10 | 1990-11-02 | Sumitomo Chem Co Ltd | フォトレジスト用組成物 |
| JP2827518B2 (ja) * | 1991-01-16 | 1998-11-25 | 三菱電機株式会社 | フォトレジストおよびレジストパターンの形成方法 |
| JPH09211849A (ja) * | 1996-02-07 | 1997-08-15 | Nec Corp | レジスト材料およびパターン形成方法 |
| JP4735432B2 (ja) * | 2006-06-14 | 2011-07-27 | 株式会社島津製作所 | 分析装置の保護回路 |
-
1982
- 1982-04-08 JP JP5871882A patent/JPS58174941A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS58174941A (ja) | 1983-10-14 |
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