JPH0118977B2 - - Google Patents
Info
- Publication number
- JPH0118977B2 JPH0118977B2 JP57230402A JP23040282A JPH0118977B2 JP H0118977 B2 JPH0118977 B2 JP H0118977B2 JP 57230402 A JP57230402 A JP 57230402A JP 23040282 A JP23040282 A JP 23040282A JP H0118977 B2 JPH0118977 B2 JP H0118977B2
- Authority
- JP
- Japan
- Prior art keywords
- weight
- precipitates
- lead frame
- based alloy
- heat treatment
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H10W70/456—
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
-
- H10W72/0198—
-
- H10W72/536—
-
- H10W72/5363—
-
- H10W72/5522—
-
- H10W72/884—
-
- H10W74/00—
-
- H10W90/736—
-
- H10W90/756—
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Conductive Materials (AREA)
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57230402A JPS59117144A (ja) | 1982-12-23 | 1982-12-23 | リ−ドフレ−ムおよびその製造方法 |
| EP83112791A EP0114338B2 (en) | 1982-12-23 | 1983-12-19 | Lead frame and method for manufacturing the same |
| DE8383112791T DE3367259D1 (en) | 1982-12-23 | 1983-12-19 | Lead frame and method for manufacturing the same |
| US06/563,445 US4640723A (en) | 1982-12-23 | 1983-12-20 | Lead frame and method for manufacturing the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57230402A JPS59117144A (ja) | 1982-12-23 | 1982-12-23 | リ−ドフレ−ムおよびその製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59117144A JPS59117144A (ja) | 1984-07-06 |
| JPH0118977B2 true JPH0118977B2 (cg-RX-API-DMAC10.html) | 1989-04-10 |
Family
ID=16907314
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57230402A Granted JPS59117144A (ja) | 1982-12-23 | 1982-12-23 | リ−ドフレ−ムおよびその製造方法 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US4640723A (cg-RX-API-DMAC10.html) |
| EP (1) | EP0114338B2 (cg-RX-API-DMAC10.html) |
| JP (1) | JPS59117144A (cg-RX-API-DMAC10.html) |
| DE (1) | DE3367259D1 (cg-RX-API-DMAC10.html) |
Families Citing this family (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59117144A (ja) * | 1982-12-23 | 1984-07-06 | Toshiba Corp | リ−ドフレ−ムおよびその製造方法 |
| US4656003A (en) * | 1984-10-20 | 1987-04-07 | Kabushiki Kaisha Kobe Seiko Sho | Copper alloy and production of the same |
| DE3511999A1 (de) * | 1985-04-02 | 1986-10-02 | Wieland-Werke Ag, 7900 Ulm | Verwendung einer kupfer-titan-kobalt-legierung als werkstoff fuer elektronische bauteile |
| EP0250146A1 (en) * | 1986-06-16 | 1987-12-23 | Texas Instruments Incorporated | Palladium plated lead frame for integrated circuit |
| EP0251036B1 (en) * | 1986-06-25 | 1991-05-08 | Kabushiki Kaisha Toshiba | Thermal head |
| DE3854682T2 (de) * | 1987-05-26 | 1996-04-25 | Nippon Steel Corp | Eisen-Kupfer-Chrom-Legierung für einen hochfesten Leiterrahmen oder ein Steckstiftgitter und Verfahren zu ihrer Herstellung. |
| DE69133422T2 (de) * | 1990-05-31 | 2006-02-02 | Kabushiki Kaisha Toshiba, Kawasaki | Leiterrahmen und diesen verwendende halbleiter verpackung |
| DE69110435T2 (de) * | 1990-12-20 | 1995-11-16 | Toshiba Kawasaki Kk | Kupferlegierungen und daraus hergestellte Leitergitter. |
| DE4219953C2 (de) * | 1992-06-18 | 1996-05-30 | Diehl Gmbh & Co | Herstellung von Druckglasdurchführungen mit Fassungen aus ausscheidungshärtbaren Legierungen |
| US5777259A (en) * | 1994-01-14 | 1998-07-07 | Brush Wellman Inc. | Heat exchanger assembly and method for making the same |
| EP0667640A3 (en) * | 1994-01-14 | 1997-05-14 | Brush Wellman | Multi-layer laminate product and its manufacture. |
| DE19530673A1 (de) * | 1994-09-15 | 1996-03-21 | Siemens Ag | Oberleitungsdraht einer elektrischen Hochgeschwindigkeitsbahnstrecke und Verfahren zu dessen Herstellung |
| US6022426A (en) * | 1995-05-31 | 2000-02-08 | Brush Wellman Inc. | Multilayer laminate process |
| US6053994A (en) * | 1997-09-12 | 2000-04-25 | Fisk Alloy Wire, Inc. | Copper alloy wire and cable and method for preparing same |
| AU1310399A (en) | 1997-11-05 | 1999-05-24 | Robert A. Martin | Chip housing, methods of making same and methods for mounting chips therein |
| AU2003252210A1 (en) * | 2002-07-18 | 2004-02-09 | Honda Giken Kogyo Kabushiki Kaisha | Copper alloy, copper alloy producing method, copper complex material, and copper complex material producing method |
| JP3731600B2 (ja) * | 2003-09-19 | 2006-01-05 | 住友金属工業株式会社 | 銅合金およびその製造方法 |
| JP2008088558A (ja) * | 2007-10-17 | 2008-04-17 | Nikko Kinzoku Kk | 延性に優れた高力高導電性銅合金 |
| KR101092616B1 (ko) * | 2008-04-29 | 2011-12-13 | 일진머티리얼즈 주식회사 | 전자 부품용 금속 프레임 |
| CN108866378B (zh) * | 2018-06-05 | 2020-01-07 | 北京科技大学 | 一种高温环境用高强高导电率铜合金及其制备方法 |
| CN112126815A (zh) * | 2020-09-25 | 2020-12-25 | 宁波博威合金板带有限公司 | 一种铜铬合金带材及其制备方法 |
| CN113564408B (zh) * | 2021-07-29 | 2022-04-19 | 内蒙古工业大学 | 一种高强高导稀土铜合金Cu-Cr-Zr-Y及其制备方法 |
| CN115612871B (zh) * | 2022-09-20 | 2023-12-22 | 陕西斯瑞新材料股份有限公司 | 一种核电汽轮发电机转子楔用铜合金的加工工艺 |
| CN116240420B (zh) * | 2022-12-12 | 2025-06-27 | 中国科学院金属研究所 | 一种多相协同引线框架用铜合金及其制备方法 |
Family Cites Families (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CA730642A (en) * | 1966-03-22 | R. Pels Alan | Copper chromium zirconium alloy | |
| GB512142A (en) * | 1937-11-19 | 1939-08-30 | Mallory & Co Inc P R | Improvements in copper base alloys |
| GB921795A (en) * | 1961-01-27 | 1963-03-27 | Mallory Metallurg Prod Ltd | Improvements in and relating to copper-base alloys |
| GB1094579A (en) * | 1965-10-15 | 1967-12-13 | American Metal Climax Inc | Copper-zirconium-magnesium alloy |
| SU515818A1 (ru) * | 1971-07-20 | 1976-05-30 | Государственный Научно-Исследовательский И Проектный Институт Сплавов И Обработки Цветных Металлов | Сплав на основе меди |
| FR2198491A5 (en) * | 1972-09-05 | 1974-03-29 | G Auchno | Copper alloy, with high conductivity and tensile strength - for electrical conductors |
| DE2243731B2 (de) * | 1972-09-06 | 1975-08-14 | Gosudarstwenny Nautschno-Issledowatelskij I Projektnyj Institut Splawow I Obrabotki Zwetnych Metallow Giprozwetmetobrabotka, Moskau | Aushärtbare Kupferlegierung |
| JPS50145317A (cg-RX-API-DMAC10.html) * | 1974-05-15 | 1975-11-21 | ||
| US4067750A (en) * | 1976-01-28 | 1978-01-10 | Olin Corporation | Method of processing copper base alloys |
| JPS52150327A (en) * | 1976-06-10 | 1977-12-14 | Toshiba Corp | Lead wire and its production method |
| DE2635454C2 (de) * | 1976-08-06 | 1986-02-27 | Kabel- und Metallwerke Gutehoffnungshütte AG, 3000 Hannover | Verwendung einer Kupferlegierung |
| US4047980A (en) * | 1976-10-04 | 1977-09-13 | Olin Corporation | Processing chromium-containing precipitation hardenable copper base alloys |
| US4049426A (en) * | 1976-10-04 | 1977-09-20 | Olin Corporation | Copper-base alloys containing chromium, niobium and zirconium |
| JPS54100257A (en) * | 1978-01-25 | 1979-08-07 | Toshiba Corp | Lead frame |
| JPS5839901B2 (ja) * | 1978-03-10 | 1983-09-02 | 日本鉱業株式会社 | リ−ドフレ−ム用の銅合金 |
| JPS55102260A (en) * | 1979-01-31 | 1980-08-05 | Nippon Gakki Seizo Kk | Leadframe |
| US4224066A (en) * | 1979-06-26 | 1980-09-23 | Olin Corporation | Copper base alloy and process |
| EP0023362B2 (en) * | 1979-07-30 | 1993-04-28 | Kabushiki Kaisha Toshiba | A method for manufacturing an electrically conductive copper alloy material |
| JPS5620136A (en) * | 1979-07-30 | 1981-02-25 | Toshiba Corp | Copper alloy member |
| JPS5625940A (en) * | 1979-08-07 | 1981-03-12 | Toshiba Corp | Refinig method of copper alloy |
| JPS56102537A (en) * | 1980-01-16 | 1981-08-17 | Toshiba Corp | Copper alloy member |
| JPS57155355A (en) * | 1981-03-18 | 1982-09-25 | Showa Electric Wire & Cable Co Ltd | Manufacture of copper alloy for electricity conduction |
| JPS58108761A (ja) * | 1981-12-23 | 1983-06-28 | Toshiba Corp | 電子部品 |
| JPS59117144A (ja) * | 1982-12-23 | 1984-07-06 | Toshiba Corp | リ−ドフレ−ムおよびその製造方法 |
-
1982
- 1982-12-23 JP JP57230402A patent/JPS59117144A/ja active Granted
-
1983
- 1983-12-19 EP EP83112791A patent/EP0114338B2/en not_active Expired - Lifetime
- 1983-12-19 DE DE8383112791T patent/DE3367259D1/de not_active Expired
- 1983-12-20 US US06/563,445 patent/US4640723A/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS59117144A (ja) | 1984-07-06 |
| US4640723A (en) | 1987-02-03 |
| EP0114338B2 (en) | 1997-08-27 |
| EP0114338A1 (en) | 1984-08-01 |
| EP0114338B1 (en) | 1986-10-29 |
| DE3367259D1 (en) | 1986-12-04 |
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