JPH0117253B2 - - Google Patents
Info
- Publication number
- JPH0117253B2 JPH0117253B2 JP13040484A JP13040484A JPH0117253B2 JP H0117253 B2 JPH0117253 B2 JP H0117253B2 JP 13040484 A JP13040484 A JP 13040484A JP 13040484 A JP13040484 A JP 13040484A JP H0117253 B2 JPH0117253 B2 JP H0117253B2
- Authority
- JP
- Japan
- Prior art keywords
- coating
- hole
- resist pattern
- film
- pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13040484A JPS618952A (ja) | 1984-06-23 | 1984-06-23 | 配線形成方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13040484A JPS618952A (ja) | 1984-06-23 | 1984-06-23 | 配線形成方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS618952A JPS618952A (ja) | 1986-01-16 |
| JPH0117253B2 true JPH0117253B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1989-03-29 |
Family
ID=15033469
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13040484A Granted JPS618952A (ja) | 1984-06-23 | 1984-06-23 | 配線形成方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS618952A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5190892A (en) * | 1988-08-11 | 1993-03-02 | Oki Electric Industry Co., Ltd. | Method for forming pattern using lift-off |
| JP2964446B2 (ja) * | 1994-11-22 | 1999-10-18 | 矢崎総業株式会社 | 圧接コネクタ |
| JPH0982381A (ja) * | 1995-09-11 | 1997-03-28 | Yazaki Corp | 圧接コネクタ |
| JP2019125528A (ja) | 2018-01-18 | 2019-07-25 | 株式会社オートネットワーク技術研究所 | 電線カバー、及びコネクタ |
-
1984
- 1984-06-23 JP JP13040484A patent/JPS618952A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS618952A (ja) | 1986-01-16 |