JPS618952A - 配線形成方法 - Google Patents
配線形成方法Info
- Publication number
- JPS618952A JPS618952A JP13040484A JP13040484A JPS618952A JP S618952 A JPS618952 A JP S618952A JP 13040484 A JP13040484 A JP 13040484A JP 13040484 A JP13040484 A JP 13040484A JP S618952 A JPS618952 A JP S618952A
- Authority
- JP
- Japan
- Prior art keywords
- film
- pattern
- wiring
- resist pattern
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims abstract description 23
- 238000000151 deposition Methods 0.000 claims abstract description 17
- 238000005530 etching Methods 0.000 claims abstract description 6
- 229910052751 metal Inorganic materials 0.000 abstract description 17
- 239000002184 metal Substances 0.000 abstract description 17
- 239000000758 substrate Substances 0.000 abstract description 12
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 abstract description 5
- 229910052759 nickel Inorganic materials 0.000 abstract description 3
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 abstract description 3
- 229910052721 tungsten Inorganic materials 0.000 abstract description 3
- 239000010937 tungsten Substances 0.000 abstract description 3
- 230000002708 enhancing effect Effects 0.000 abstract 1
- 238000000576 coating method Methods 0.000 description 38
- 239000011248 coating agent Substances 0.000 description 33
- 239000004065 semiconductor Substances 0.000 description 4
- 238000004544 sputter deposition Methods 0.000 description 4
- 238000007796 conventional method Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000005468 ion implantation Methods 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005566 electron beam evaporation Methods 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000008267 milk Substances 0.000 description 1
- 210000004080 milk Anatomy 0.000 description 1
- 235000013336 milk Nutrition 0.000 description 1
- 150000002815 nickel Chemical class 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 238000001020 plasma etching Methods 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13040484A JPS618952A (ja) | 1984-06-23 | 1984-06-23 | 配線形成方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13040484A JPS618952A (ja) | 1984-06-23 | 1984-06-23 | 配線形成方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS618952A true JPS618952A (ja) | 1986-01-16 |
| JPH0117253B2 JPH0117253B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1989-03-29 |
Family
ID=15033469
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13040484A Granted JPS618952A (ja) | 1984-06-23 | 1984-06-23 | 配線形成方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS618952A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5190892A (en) * | 1988-08-11 | 1993-03-02 | Oki Electric Industry Co., Ltd. | Method for forming pattern using lift-off |
| US5683272A (en) * | 1994-11-22 | 1997-11-04 | Yazaki Corporation | Pressure-contact connector |
| US5713756A (en) * | 1995-09-11 | 1998-02-03 | Yazaki Corporation | Insulation displacement connector |
| US10615536B2 (en) | 2018-01-18 | 2020-04-07 | Autonetworks Technologies, Ltd. | Electric cable cover and connector |
-
1984
- 1984-06-23 JP JP13040484A patent/JPS618952A/ja active Granted
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5190892A (en) * | 1988-08-11 | 1993-03-02 | Oki Electric Industry Co., Ltd. | Method for forming pattern using lift-off |
| US5683272A (en) * | 1994-11-22 | 1997-11-04 | Yazaki Corporation | Pressure-contact connector |
| US5713756A (en) * | 1995-09-11 | 1998-02-03 | Yazaki Corporation | Insulation displacement connector |
| US10615536B2 (en) | 2018-01-18 | 2020-04-07 | Autonetworks Technologies, Ltd. | Electric cable cover and connector |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0117253B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1989-03-29 |
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