JPH01105716A - 樹脂封止装置 - Google Patents

樹脂封止装置

Info

Publication number
JPH01105716A
JPH01105716A JP26448387A JP26448387A JPH01105716A JP H01105716 A JPH01105716 A JP H01105716A JP 26448387 A JP26448387 A JP 26448387A JP 26448387 A JP26448387 A JP 26448387A JP H01105716 A JPH01105716 A JP H01105716A
Authority
JP
Japan
Prior art keywords
plungers
plunger
plate
spring
lowering
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP26448387A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0523572B2 (enrdf_load_stackoverflow
Inventor
Yoshiro Takemoto
武本 義郎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP26448387A priority Critical patent/JPH01105716A/ja
Publication of JPH01105716A publication Critical patent/JPH01105716A/ja
Publication of JPH0523572B2 publication Critical patent/JPH0523572B2/ja
Granted legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/02Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
    • B29C45/021Plunger drives; Pressure equalizing means for a plurality of transfer plungers

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
JP26448387A 1987-10-20 1987-10-20 樹脂封止装置 Granted JPH01105716A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP26448387A JPH01105716A (ja) 1987-10-20 1987-10-20 樹脂封止装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP26448387A JPH01105716A (ja) 1987-10-20 1987-10-20 樹脂封止装置

Publications (2)

Publication Number Publication Date
JPH01105716A true JPH01105716A (ja) 1989-04-24
JPH0523572B2 JPH0523572B2 (enrdf_load_stackoverflow) 1993-04-05

Family

ID=17403864

Family Applications (1)

Application Number Title Priority Date Filing Date
JP26448387A Granted JPH01105716A (ja) 1987-10-20 1987-10-20 樹脂封止装置

Country Status (1)

Country Link
JP (1) JPH01105716A (enrdf_load_stackoverflow)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL9100339A (nl) * 1991-02-26 1992-09-16 Boschman Tech Bv Inrichting voor het omhullen van elektronische onderdelen.
US5328347A (en) * 1991-09-16 1994-07-12 Amco Hi-Tech B.V. Device for introducing a plastic material into a mould cavity

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL9100339A (nl) * 1991-02-26 1992-09-16 Boschman Tech Bv Inrichting voor het omhullen van elektronische onderdelen.
US5158780A (en) * 1991-02-26 1992-10-27 Boschman Technologies B.V. Device for encapsulating electronic components
US5328347A (en) * 1991-09-16 1994-07-12 Amco Hi-Tech B.V. Device for introducing a plastic material into a mould cavity

Also Published As

Publication number Publication date
JPH0523572B2 (enrdf_load_stackoverflow) 1993-04-05

Similar Documents

Publication Publication Date Title
EP0933808B1 (en) Resin sealing method and apparatus for a semiconductor device
JP3182432B2 (ja) 電子部品をカプセルに入れる装置
US5254501A (en) Same-side gated process for encapsulating semiconductor devices
JP2001047458A (ja) 樹脂封止装置
JPH01105716A (ja) 樹脂封止装置
JP3100843B2 (ja) 半導体パッケージ成形用モルドプレス
JPS6219418A (ja) 成形装置
JPS6097815A (ja) 成形方法および成形機
JPH0148126B2 (enrdf_load_stackoverflow)
JP3536999B2 (ja) 樹脂モールド装置
JPH10135260A (ja) 電子部品の樹脂封止成形方法及び金型装置
JPH0356341Y2 (enrdf_load_stackoverflow)
JPH06106567A (ja) 樹脂封止用成形装置
JPH08197570A (ja) 樹脂モールド装置
JPS6154633A (ja) 半導体樹脂封止用金型
JPH0290633A (ja) 半導体装置用樹脂封止金型
JPH11300783A (ja) 樹脂モールド装置
JP2861821B2 (ja) モールドプレス装置
JPH01144640A (ja) 半導体樹脂封止装置
JPH0776032A (ja) 射出成形装置
JP2706914B2 (ja) 電子部品の樹脂封止成形方法及び金型
JPH04273132A (ja) 半導体装置の樹脂封止方法
JPH03256712A (ja) トランスファ成形装置
JPS63115710A (ja) 封止金型のプランジヤ−装置
JPH04179242A (ja) 半導体素子の封止方法