JPH01105716A - 樹脂封止装置 - Google Patents
樹脂封止装置Info
- Publication number
- JPH01105716A JPH01105716A JP62264483A JP26448387A JPH01105716A JP H01105716 A JPH01105716 A JP H01105716A JP 62264483 A JP62264483 A JP 62264483A JP 26448387 A JP26448387 A JP 26448387A JP H01105716 A JPH01105716 A JP H01105716A
- Authority
- JP
- Japan
- Prior art keywords
- plungers
- plunger
- plate
- spring
- lowering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/02—Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
- B29C45/021—Plunger drives; Pressure equalizing means for a plurality of transfer plungers
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62264483A JPH01105716A (ja) | 1987-10-20 | 1987-10-20 | 樹脂封止装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62264483A JPH01105716A (ja) | 1987-10-20 | 1987-10-20 | 樹脂封止装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01105716A true JPH01105716A (ja) | 1989-04-24 |
| JPH0523572B2 JPH0523572B2 (enrdf_load_stackoverflow) | 1993-04-05 |
Family
ID=17403864
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62264483A Granted JPH01105716A (ja) | 1987-10-20 | 1987-10-20 | 樹脂封止装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01105716A (enrdf_load_stackoverflow) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| NL9100339A (nl) * | 1991-02-26 | 1992-09-16 | Boschman Tech Bv | Inrichting voor het omhullen van elektronische onderdelen. |
| US5328347A (en) * | 1991-09-16 | 1994-07-12 | Amco Hi-Tech B.V. | Device for introducing a plastic material into a mould cavity |
-
1987
- 1987-10-20 JP JP62264483A patent/JPH01105716A/ja active Granted
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| NL9100339A (nl) * | 1991-02-26 | 1992-09-16 | Boschman Tech Bv | Inrichting voor het omhullen van elektronische onderdelen. |
| US5158780A (en) * | 1991-02-26 | 1992-10-27 | Boschman Technologies B.V. | Device for encapsulating electronic components |
| US5328347A (en) * | 1991-09-16 | 1994-07-12 | Amco Hi-Tech B.V. | Device for introducing a plastic material into a mould cavity |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0523572B2 (enrdf_load_stackoverflow) | 1993-04-05 |
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