JPH0148126B2 - - Google Patents

Info

Publication number
JPH0148126B2
JPH0148126B2 JP10727382A JP10727382A JPH0148126B2 JP H0148126 B2 JPH0148126 B2 JP H0148126B2 JP 10727382 A JP10727382 A JP 10727382A JP 10727382 A JP10727382 A JP 10727382A JP H0148126 B2 JPH0148126 B2 JP H0148126B2
Authority
JP
Japan
Prior art keywords
speed
resin
plunger
transfer
cylinder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP10727382A
Other languages
English (en)
Japanese (ja)
Other versions
JPS58222831A (ja
Inventor
Osamu Yamauchi
Kyoshi Kakya
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP10727382A priority Critical patent/JPS58222831A/ja
Publication of JPS58222831A publication Critical patent/JPS58222831A/ja
Publication of JPH0148126B2 publication Critical patent/JPH0148126B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/76—Measuring, controlling or regulating
    • B29C45/77—Measuring, controlling or regulating of velocity or pressure of moulding material

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
JP10727382A 1982-06-22 1982-06-22 トランスフア成形装置 Granted JPS58222831A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10727382A JPS58222831A (ja) 1982-06-22 1982-06-22 トランスフア成形装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10727382A JPS58222831A (ja) 1982-06-22 1982-06-22 トランスフア成形装置

Publications (2)

Publication Number Publication Date
JPS58222831A JPS58222831A (ja) 1983-12-24
JPH0148126B2 true JPH0148126B2 (enrdf_load_stackoverflow) 1989-10-18

Family

ID=14454877

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10727382A Granted JPS58222831A (ja) 1982-06-22 1982-06-22 トランスフア成形装置

Country Status (1)

Country Link
JP (1) JPS58222831A (enrdf_load_stackoverflow)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61117843A (ja) * 1984-11-14 1986-06-05 Sumitomo Heavy Ind Ltd 半導体樹脂封止成形方法
JPS62125635A (ja) * 1985-11-26 1987-06-06 Nec Corp 樹脂封止型半導体装置の樹脂封止方法
JP2654878B2 (ja) * 1991-09-24 1997-09-17 株式会社三井ハイテック 極薄型半導体装置の製造方法
WO2005078807A1 (ja) * 2004-02-17 2005-08-25 Matsushita Electric Industrial Co., Ltd. 光電変換プラグとそれを用いた光電変換モジュール、及びその光電変換プラグの製造方法
IT1399743B1 (it) * 2010-03-15 2013-05-03 Afros Spa Metodo e apparecchiatura per l'erogazione di una miscela poliuretanica in corpi cavi.

Also Published As

Publication number Publication date
JPS58222831A (ja) 1983-12-24

Similar Documents

Publication Publication Date Title
US4242073A (en) Injection molding apparatus and molding method with use of the apparatus
KR920001029B1 (ko) 반도체 소자 제조 장치 및 그 제조 방법
KR100429046B1 (ko) 에폭시수지로캡슐화된반도체장치의제조방법
JPH0148126B2 (enrdf_load_stackoverflow)
KR20010021240A (ko) 수지밀봉장치
JP3767465B2 (ja) 薄肉成形品の製造方法及びそれに用いる成形金型装置
JP3149409B2 (ja) 半導体装置の製造方法
JPH06124971A (ja) 樹脂封止金型
JP2786197B2 (ja) 半導体装置の製造方法
US5169586A (en) Method of manufacturing resin-sealed type semiconductor device
JPS589749B2 (ja) 樹脂射出成形用型装置
JPH04201220A (ja) モールド金型
JPH0290633A (ja) 半導体装置用樹脂封止金型
JP3207844B2 (ja) 半導体装置の製造方法
JPS61125821A (ja) 樹脂成形装置
JPS63193814A (ja) トランスフアモ−ルド金型
KR960005041B1 (ko) 반도체 성형 장치
JPH0464417A (ja) 金型
JP2786426B2 (ja) 半導体装置の製造方法
JPH03129839A (ja) 半導体装置の製造方法
JP2858942B2 (ja) 樹脂封止方法及び樹脂封止装置
JPH06252190A (ja) 半導体封止装置
JPH01105716A (ja) 樹脂封止装置
JPH0749145B2 (ja) 縦型ダイキヤストマシンの射出制御装置
JPH02131912A (ja) 多数個取り射出成形法