JP7806097B2 - 感光性樹脂組成物、感光性樹脂積層体、及びレジストパターンの形成方法 - Google Patents

感光性樹脂組成物、感光性樹脂積層体、及びレジストパターンの形成方法

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Publication number
JP7806097B2
JP7806097B2 JP2023574094A JP2023574094A JP7806097B2 JP 7806097 B2 JP7806097 B2 JP 7806097B2 JP 2023574094 A JP2023574094 A JP 2023574094A JP 2023574094 A JP2023574094 A JP 2023574094A JP 7806097 B2 JP7806097 B2 JP 7806097B2
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Japan
Prior art keywords
component
photosensitive resin
mass
resin composition
composition according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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JP2023574094A
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English (en)
Japanese (ja)
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JPWO2023136333A1 (https=
Inventor
大介 宇野
隆覚 櫻井
秀昭 西本
裕樹 松尾
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Asahi Kasei Corp
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Asahi Kasei Corp
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Publication date
Application filed by Asahi Kasei Corp filed Critical Asahi Kasei Corp
Publication of JPWO2023136333A1 publication Critical patent/JPWO2023136333A1/ja
Priority to JP2026004499A priority Critical patent/JP2026063148A/ja
Application granted granted Critical
Publication of JP7806097B2 publication Critical patent/JP7806097B2/ja
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Anticipated expiration legal-status Critical

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/029—Inorganic compounds; Onium compounds; Organic compounds having hetero atoms other than oxygen, nitrogen or sulfur
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/092—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers characterised by backside coating or layers, by lubricating-slip layers or means, by oxygen barrier layers or by stripping-release layers or means
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/105—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having substances, e.g. indicators, for forming visible images
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/064—Photoresists

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Structural Engineering (AREA)
  • Architecture (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Inorganic Chemistry (AREA)
  • Materials For Photolithography (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Polymerisation Methods In General (AREA)
JP2023574094A 2022-01-14 2023-01-13 感光性樹脂組成物、感光性樹脂積層体、及びレジストパターンの形成方法 Active JP7806097B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2026004499A JP2026063148A (ja) 2022-01-14 2026-01-14 感光性樹脂組成物、感光性樹脂積層体、及びレジストパターンの形成方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022004558 2022-01-14
JP2022004558 2022-01-14
PCT/JP2023/000842 WO2023136333A1 (ja) 2022-01-14 2023-01-13 感光性樹脂組成物、感光性樹脂積層体、及びレジストパターンの形成方法

Related Child Applications (1)

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JP2026004499A Division JP2026063148A (ja) 2022-01-14 2026-01-14 感光性樹脂組成物、感光性樹脂積層体、及びレジストパターンの形成方法

Publications (2)

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JPWO2023136333A1 JPWO2023136333A1 (https=) 2023-07-20
JP7806097B2 true JP7806097B2 (ja) 2026-01-26

Family

ID=87279284

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JP2023574094A Active JP7806097B2 (ja) 2022-01-14 2023-01-13 感光性樹脂組成物、感光性樹脂積層体、及びレジストパターンの形成方法
JP2026004499A Pending JP2026063148A (ja) 2022-01-14 2026-01-14 感光性樹脂組成物、感光性樹脂積層体、及びレジストパターンの形成方法

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Country Status (5)

Country Link
JP (2) JP7806097B2 (https=)
KR (1) KR20240054400A (https=)
CN (1) CN118541643A (https=)
TW (1) TWI912575B (https=)
WO (1) WO2023136333A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2025074828A1 (https=) * 2023-10-06 2025-04-10
WO2025115078A1 (ja) * 2023-11-27 2025-06-05 株式会社レゾナック 感光性樹脂組成物、感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法
WO2025126273A1 (ja) * 2023-12-11 2025-06-19 株式会社レゾナック 感光性樹脂組成物、感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001142223A (ja) 1999-11-15 2001-05-25 Hitachi Chem Co Ltd 感光性エレメントの製造法、感光性エレメント及びカラーフィルターの製造法
JP2002023365A (ja) 2000-07-13 2002-01-23 Asahi Kasei Corp 感光性樹脂積層体
JP2005148720A (ja) 2003-11-17 2005-06-09 Qimei Industry Co Ltd カラーフィルター用感光性樹脂組成物
WO2007013233A1 (ja) 2005-07-29 2007-02-01 Fujifilm Corporation 液晶表示素子用感光性樹脂組成物、それを用いたカラーフィルター並びにその製造方法、及び、液晶表示素子
WO2007080698A1 (ja) 2006-01-13 2007-07-19 Fujifilm Corporation 感光性樹脂組成物及び感光性転写フィルム並びにパターン形成方法
JP2007304536A (ja) 2006-04-13 2007-11-22 Hitachi Chem Co Ltd 感光性樹脂組成物
CN108287452A (zh) 2018-01-24 2018-07-17 浙江福斯特新材料研究院有限公司 一种具有快速显影和优异掩盖异形孔性能的感光树脂组合物

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2826330B2 (ja) * 1988-12-15 1998-11-18 ダイセル化学工業株式会社 光重合性組成物
JPH08339081A (ja) 1995-06-09 1996-12-24 Tokyo Ohka Kogyo Co Ltd 感光性樹脂組成物及びその製造方法
JP6374595B1 (ja) * 2017-09-26 2018-08-15 東京応化工業株式会社 感光性樹脂組成物、硬化膜、表示装置、及びパターン形成方法
KR102655468B1 (ko) 2018-06-22 2024-04-05 아사히 가세이 가부시키가이샤 감광성 수지 조성물 및 레지스트 패턴의 형성 방법

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001142223A (ja) 1999-11-15 2001-05-25 Hitachi Chem Co Ltd 感光性エレメントの製造法、感光性エレメント及びカラーフィルターの製造法
JP2002023365A (ja) 2000-07-13 2002-01-23 Asahi Kasei Corp 感光性樹脂積層体
JP2005148720A (ja) 2003-11-17 2005-06-09 Qimei Industry Co Ltd カラーフィルター用感光性樹脂組成物
WO2007013233A1 (ja) 2005-07-29 2007-02-01 Fujifilm Corporation 液晶表示素子用感光性樹脂組成物、それを用いたカラーフィルター並びにその製造方法、及び、液晶表示素子
WO2007080698A1 (ja) 2006-01-13 2007-07-19 Fujifilm Corporation 感光性樹脂組成物及び感光性転写フィルム並びにパターン形成方法
JP2007304536A (ja) 2006-04-13 2007-11-22 Hitachi Chem Co Ltd 感光性樹脂組成物
CN108287452A (zh) 2018-01-24 2018-07-17 浙江福斯特新材料研究院有限公司 一种具有快速显影和优异掩盖异形孔性能的感光树脂组合物

Also Published As

Publication number Publication date
TW202330643A (zh) 2023-08-01
CN118541643A (zh) 2024-08-23
WO2023136333A1 (ja) 2023-07-20
JP2026063148A (ja) 2026-04-10
TWI912575B (zh) 2026-01-21
JPWO2023136333A1 (https=) 2023-07-20
KR20240054400A (ko) 2024-04-25

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