JPWO2023136333A1 - - Google Patents

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Publication number
JPWO2023136333A1
JPWO2023136333A1 JP2023574094A JP2023574094A JPWO2023136333A1 JP WO2023136333 A1 JPWO2023136333 A1 JP WO2023136333A1 JP 2023574094 A JP2023574094 A JP 2023574094A JP 2023574094 A JP2023574094 A JP 2023574094A JP WO2023136333 A1 JPWO2023136333 A1 JP WO2023136333A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2023574094A
Other languages
Japanese (ja)
Other versions
JP7806097B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2023136333A1 publication Critical patent/JPWO2023136333A1/ja
Priority to JP2026004499A priority Critical patent/JP2026063148A/ja
Application granted granted Critical
Publication of JP7806097B2 publication Critical patent/JP7806097B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/029—Inorganic compounds; Onium compounds; Organic compounds having hetero atoms other than oxygen, nitrogen or sulfur
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/092—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers characterised by backside coating or layers, by lubricating-slip layers or means, by oxygen barrier layers or by stripping-release layers or means
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/105—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having substances, e.g. indicators, for forming visible images
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/064—Photoresists

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Structural Engineering (AREA)
  • Architecture (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Inorganic Chemistry (AREA)
  • Materials For Photolithography (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Polymerisation Methods In General (AREA)
JP2023574094A 2022-01-14 2023-01-13 感光性樹脂組成物、感光性樹脂積層体、及びレジストパターンの形成方法 Active JP7806097B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2026004499A JP2026063148A (ja) 2022-01-14 2026-01-14 感光性樹脂組成物、感光性樹脂積層体、及びレジストパターンの形成方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022004558 2022-01-14
JP2022004558 2022-01-14
PCT/JP2023/000842 WO2023136333A1 (ja) 2022-01-14 2023-01-13 感光性樹脂組成物、感光性樹脂積層体、及びレジストパターンの形成方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2026004499A Division JP2026063148A (ja) 2022-01-14 2026-01-14 感光性樹脂組成物、感光性樹脂積層体、及びレジストパターンの形成方法

Publications (2)

Publication Number Publication Date
JPWO2023136333A1 true JPWO2023136333A1 (https=) 2023-07-20
JP7806097B2 JP7806097B2 (ja) 2026-01-26

Family

ID=87279284

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2023574094A Active JP7806097B2 (ja) 2022-01-14 2023-01-13 感光性樹脂組成物、感光性樹脂積層体、及びレジストパターンの形成方法
JP2026004499A Pending JP2026063148A (ja) 2022-01-14 2026-01-14 感光性樹脂組成物、感光性樹脂積層体、及びレジストパターンの形成方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2026004499A Pending JP2026063148A (ja) 2022-01-14 2026-01-14 感光性樹脂組成物、感光性樹脂積層体、及びレジストパターンの形成方法

Country Status (5)

Country Link
JP (2) JP7806097B2 (https=)
KR (1) KR20240054400A (https=)
CN (1) CN118541643A (https=)
TW (1) TWI912575B (https=)
WO (1) WO2023136333A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2025074828A1 (https=) * 2023-10-06 2025-04-10
WO2025115078A1 (ja) * 2023-11-27 2025-06-05 株式会社レゾナック 感光性樹脂組成物、感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法
WO2025126273A1 (ja) * 2023-12-11 2025-06-19 株式会社レゾナック 感光性樹脂組成物、感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02161443A (ja) * 1988-12-15 1990-06-21 Daicel Chem Ind Ltd 光重合性組成物
JP2001142223A (ja) * 1999-11-15 2001-05-25 Hitachi Chem Co Ltd 感光性エレメントの製造法、感光性エレメント及びカラーフィルターの製造法
JP2002023365A (ja) * 2000-07-13 2002-01-23 Asahi Kasei Corp 感光性樹脂積層体
JP2005148720A (ja) * 2003-11-17 2005-06-09 Qimei Industry Co Ltd カラーフィルター用感光性樹脂組成物
WO2007013233A1 (ja) * 2005-07-29 2007-02-01 Fujifilm Corporation 液晶表示素子用感光性樹脂組成物、それを用いたカラーフィルター並びにその製造方法、及び、液晶表示素子
WO2007080698A1 (ja) * 2006-01-13 2007-07-19 Fujifilm Corporation 感光性樹脂組成物及び感光性転写フィルム並びにパターン形成方法
JP2007304536A (ja) * 2006-04-13 2007-11-22 Hitachi Chem Co Ltd 感光性樹脂組成物
CN108287452A (zh) * 2018-01-24 2018-07-17 浙江福斯特新材料研究院有限公司 一种具有快速显影和优异掩盖异形孔性能的感光树脂组合物

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08339081A (ja) 1995-06-09 1996-12-24 Tokyo Ohka Kogyo Co Ltd 感光性樹脂組成物及びその製造方法
JP6374595B1 (ja) * 2017-09-26 2018-08-15 東京応化工業株式会社 感光性樹脂組成物、硬化膜、表示装置、及びパターン形成方法
KR102655468B1 (ko) 2018-06-22 2024-04-05 아사히 가세이 가부시키가이샤 감광성 수지 조성물 및 레지스트 패턴의 형성 방법

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02161443A (ja) * 1988-12-15 1990-06-21 Daicel Chem Ind Ltd 光重合性組成物
JP2001142223A (ja) * 1999-11-15 2001-05-25 Hitachi Chem Co Ltd 感光性エレメントの製造法、感光性エレメント及びカラーフィルターの製造法
JP2002023365A (ja) * 2000-07-13 2002-01-23 Asahi Kasei Corp 感光性樹脂積層体
JP2005148720A (ja) * 2003-11-17 2005-06-09 Qimei Industry Co Ltd カラーフィルター用感光性樹脂組成物
WO2007013233A1 (ja) * 2005-07-29 2007-02-01 Fujifilm Corporation 液晶表示素子用感光性樹脂組成物、それを用いたカラーフィルター並びにその製造方法、及び、液晶表示素子
WO2007080698A1 (ja) * 2006-01-13 2007-07-19 Fujifilm Corporation 感光性樹脂組成物及び感光性転写フィルム並びにパターン形成方法
JP2007304536A (ja) * 2006-04-13 2007-11-22 Hitachi Chem Co Ltd 感光性樹脂組成物
CN108287452A (zh) * 2018-01-24 2018-07-17 浙江福斯特新材料研究院有限公司 一种具有快速显影和优异掩盖异形孔性能的感光树脂组合物

Also Published As

Publication number Publication date
TW202330643A (zh) 2023-08-01
CN118541643A (zh) 2024-08-23
WO2023136333A1 (ja) 2023-07-20
JP2026063148A (ja) 2026-04-10
TWI912575B (zh) 2026-01-21
JP7806097B2 (ja) 2026-01-26
KR20240054400A (ko) 2024-04-25

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