TWI912575B - 感光性樹脂組成物、感光性樹脂積層體、及光阻圖案之形成方法 - Google Patents

感光性樹脂組成物、感光性樹脂積層體、及光阻圖案之形成方法

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Publication number
TWI912575B
TWI912575B TW112101229A TW112101229A TWI912575B TW I912575 B TWI912575 B TW I912575B TW 112101229 A TW112101229 A TW 112101229A TW 112101229 A TW112101229 A TW 112101229A TW I912575 B TWI912575 B TW I912575B
Authority
TW
Taiwan
Prior art keywords
photosensitive resin
component
resin composition
mass
mass ratio
Prior art date
Application number
TW112101229A
Other languages
English (en)
Chinese (zh)
Other versions
TW202330643A (zh
Inventor
宇野大介
櫻井隆覺
西本秀昭
松尾裕樹
Original Assignee
日商旭化成股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商旭化成股份有限公司 filed Critical 日商旭化成股份有限公司
Publication of TW202330643A publication Critical patent/TW202330643A/zh
Application granted granted Critical
Publication of TWI912575B publication Critical patent/TWI912575B/zh

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/029—Inorganic compounds; Onium compounds; Organic compounds having hetero atoms other than oxygen, nitrogen or sulfur
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/092—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers characterised by backside coating or layers, by lubricating-slip layers or means, by oxygen barrier layers or by stripping-release layers or means
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/105—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having substances, e.g. indicators, for forming visible images
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/064—Photoresists

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Structural Engineering (AREA)
  • Architecture (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Inorganic Chemistry (AREA)
  • Materials For Photolithography (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Polymerisation Methods In General (AREA)
TW112101229A 2022-01-14 2023-01-11 感光性樹脂組成物、感光性樹脂積層體、及光阻圖案之形成方法 TWI912575B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022004558 2022-01-14
JP2022-004558 2022-01-14

Publications (2)

Publication Number Publication Date
TW202330643A TW202330643A (zh) 2023-08-01
TWI912575B true TWI912575B (zh) 2026-01-21

Family

ID=87279284

Family Applications (1)

Application Number Title Priority Date Filing Date
TW112101229A TWI912575B (zh) 2022-01-14 2023-01-11 感光性樹脂組成物、感光性樹脂積層體、及光阻圖案之形成方法

Country Status (5)

Country Link
JP (2) JP7806097B2 (https=)
KR (1) KR20240054400A (https=)
CN (1) CN118541643A (https=)
TW (1) TWI912575B (https=)
WO (1) WO2023136333A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2025074828A1 (https=) * 2023-10-06 2025-04-10
WO2025115078A1 (ja) * 2023-11-27 2025-06-05 株式会社レゾナック 感光性樹脂組成物、感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法
WO2025126273A1 (ja) * 2023-12-11 2025-06-19 株式会社レゾナック 感光性樹脂組成物、感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002023365A (ja) * 2000-07-13 2002-01-23 Asahi Kasei Corp 感光性樹脂積層体
CN108287452A (zh) * 2018-01-24 2018-07-17 浙江福斯特新材料研究院有限公司 一种具有快速显影和优异掩盖异形孔性能的感光树脂组合物
TW201920501A (zh) * 2017-09-26 2019-06-01 日商東京應化工業股份有限公司 感光性樹脂組成物、硬化膜、顯示裝置、及圖型形成方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2826330B2 (ja) * 1988-12-15 1998-11-18 ダイセル化学工業株式会社 光重合性組成物
JPH08339081A (ja) 1995-06-09 1996-12-24 Tokyo Ohka Kogyo Co Ltd 感光性樹脂組成物及びその製造方法
JP2001142223A (ja) 1999-11-15 2001-05-25 Hitachi Chem Co Ltd 感光性エレメントの製造法、感光性エレメント及びカラーフィルターの製造法
TWI249552B (en) 2003-11-17 2006-02-21 Chi Mei Corp Photosensitive resin composition used for color filter
KR20080030687A (ko) 2005-07-29 2008-04-04 후지필름 가부시키가이샤 액정표시소자용 감광성 수지조성물, 그를 이용한컬러필터와 그 제조방법 및 액정표시소자
WO2007080698A1 (ja) * 2006-01-13 2007-07-19 Fujifilm Corporation 感光性樹脂組成物及び感光性転写フィルム並びにパターン形成方法
JP4752650B2 (ja) 2006-04-13 2011-08-17 日立化成工業株式会社 感光性樹脂組成物
KR102655468B1 (ko) 2018-06-22 2024-04-05 아사히 가세이 가부시키가이샤 감광성 수지 조성물 및 레지스트 패턴의 형성 방법

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002023365A (ja) * 2000-07-13 2002-01-23 Asahi Kasei Corp 感光性樹脂積層体
TW201920501A (zh) * 2017-09-26 2019-06-01 日商東京應化工業股份有限公司 感光性樹脂組成物、硬化膜、顯示裝置、及圖型形成方法
CN108287452A (zh) * 2018-01-24 2018-07-17 浙江福斯特新材料研究院有限公司 一种具有快速显影和优异掩盖异形孔性能的感光树脂组合物

Also Published As

Publication number Publication date
TW202330643A (zh) 2023-08-01
CN118541643A (zh) 2024-08-23
WO2023136333A1 (ja) 2023-07-20
JP2026063148A (ja) 2026-04-10
JP7806097B2 (ja) 2026-01-26
JPWO2023136333A1 (https=) 2023-07-20
KR20240054400A (ko) 2024-04-25

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