JP7768825B2 - エッチング液 - Google Patents

エッチング液

Info

Publication number
JP7768825B2
JP7768825B2 JP2022070772A JP2022070772A JP7768825B2 JP 7768825 B2 JP7768825 B2 JP 7768825B2 JP 2022070772 A JP2022070772 A JP 2022070772A JP 2022070772 A JP2022070772 A JP 2022070772A JP 7768825 B2 JP7768825 B2 JP 7768825B2
Authority
JP
Japan
Prior art keywords
etching solution
etching
group
present disclosure
mass
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2022070772A
Other languages
English (en)
Japanese (ja)
Other versions
JP2022167883A5 (enExample
JP2022167883A (ja
Inventor
寛司 佐藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kao Corp
Original Assignee
Kao Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kao Corp filed Critical Kao Corp
Publication of JP2022167883A publication Critical patent/JP2022167883A/ja
Publication of JP2022167883A5 publication Critical patent/JP2022167883A5/ja
Application granted granted Critical
Publication of JP7768825B2 publication Critical patent/JP7768825B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H10P50/69—Etching of wafers, substrates or parts of devices using masks for semiconductor materials
    • H10P50/691—Etching of wafers, substrates or parts of devices using masks for semiconductor materials for Group V materials or Group III-V materials
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K13/00—Etching, surface-brightening or pickling compositions
    • C09K13/04—Etching, surface-brightening or pickling compositions containing an inorganic acid
    • C09K13/06—Etching, surface-brightening or pickling compositions containing an inorganic acid with organic material
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H10P50/20—Dry etching; Plasma etching; Reactive-ion etching
    • H10P50/28—Dry etching; Plasma etching; Reactive-ion etching of insulating materials
    • H10P50/282—Dry etching; Plasma etching; Reactive-ion etching of insulating materials of inorganic materials
    • H10P50/283—Dry etching; Plasma etching; Reactive-ion etching of insulating materials of inorganic materials by chemical means

Landscapes

  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Weting (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
JP2022070772A 2021-04-22 2022-04-22 エッチング液 Active JP7768825B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021072537 2021-04-22
JP2021072537 2021-04-22

Publications (3)

Publication Number Publication Date
JP2022167883A JP2022167883A (ja) 2022-11-04
JP2022167883A5 JP2022167883A5 (enExample) 2025-03-04
JP7768825B2 true JP7768825B2 (ja) 2025-11-12

Family

ID=83722358

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022070772A Active JP7768825B2 (ja) 2021-04-22 2022-04-22 エッチング液

Country Status (5)

Country Link
US (1) US20240209260A1 (enExample)
JP (1) JP7768825B2 (enExample)
KR (1) KR20230173103A (enExample)
CN (1) CN117223092A (enExample)
WO (1) WO2022225032A1 (enExample)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018085513A (ja) 2016-11-24 2018-05-31 三星電子株式会社Ｓａｍｓｕｎｇ Ｅｌｅｃｔｒｏｎｉｃｓ Ｃｏ．，Ｌｔｄ． エッチング組成物、及びそれを利用した集積回路素子の製造方法
JP2018207108A (ja) 2017-06-05 2018-12-27 バーサム マテリアルズ ユーエス，リミティド ライアビリティ カンパニー 半導体デバイスの製造中に窒化ケイ素を選択的に除去するためのエッチング溶液
JP2020068376A (ja) 2018-10-25 2020-04-30 エスケー イノベーション カンパニー リミテッドＳｋ Ｉｎｎｏｖａｔｉｏｎ Ｃｏ．，Ｌｔｄ． エッチング組成物添加剤、その製造方法及びこれを含むエッチング組成物

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NO901662L (no) * 1989-04-17 1990-12-21 Monsanto Co Toert herbicid preparat med forbedret vannopploeselighet.
WO2020022491A1 (ja) * 2018-07-27 2020-01-30 花王株式会社 洗浄方法
KR102258307B1 (ko) * 2018-09-03 2021-06-01 주식회사 이엔에프테크놀로지 실리콘 질화막 식각 조성물 및 이를 이용한 방법
JP2021086943A (ja) * 2019-11-28 2021-06-03 花王株式会社 エッチング液

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018085513A (ja) 2016-11-24 2018-05-31 三星電子株式会社Ｓａｍｓｕｎｇ Ｅｌｅｃｔｒｏｎｉｃｓ Ｃｏ．，Ｌｔｄ． エッチング組成物、及びそれを利用した集積回路素子の製造方法
JP2018207108A (ja) 2017-06-05 2018-12-27 バーサム マテリアルズ ユーエス，リミティド ライアビリティ カンパニー 半導体デバイスの製造中に窒化ケイ素を選択的に除去するためのエッチング溶液
JP2020068376A (ja) 2018-10-25 2020-04-30 エスケー イノベーション カンパニー リミテッドＳｋ Ｉｎｎｏｖａｔｉｏｎ Ｃｏ．，Ｌｔｄ． エッチング組成物添加剤、その製造方法及びこれを含むエッチング組成物

Also Published As

Publication number Publication date
TW202302817A (zh) 2023-01-16
KR20230173103A (ko) 2023-12-26
WO2022225032A1 (ja) 2022-10-27
JP2022167883A (ja) 2022-11-04
CN117223092A (zh) 2023-12-12
US20240209260A1 (en) 2024-06-27

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