CN117223092A - 蚀刻液 - Google Patents

蚀刻液 Download PDF

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Publication number
CN117223092A
CN117223092A CN202280029695.9A CN202280029695A CN117223092A CN 117223092 A CN117223092 A CN 117223092A CN 202280029695 A CN202280029695 A CN 202280029695A CN 117223092 A CN117223092 A CN 117223092A
Authority
CN
China
Prior art keywords
etching
etching solution
group
film
less
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202280029695.9A
Other languages
English (en)
Chinese (zh)
Inventor
佐藤宽司
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kao Corp
Original Assignee
Kao Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kao Corp filed Critical Kao Corp
Publication of CN117223092A publication Critical patent/CN117223092A/zh
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H10P50/69—Etching of wafers, substrates or parts of devices using masks for semiconductor materials
    • H10P50/691—Etching of wafers, substrates or parts of devices using masks for semiconductor materials for Group V materials or Group III-V materials
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K13/00—Etching, surface-brightening or pickling compositions
    • C09K13/04—Etching, surface-brightening or pickling compositions containing an inorganic acid
    • C09K13/06—Etching, surface-brightening or pickling compositions containing an inorganic acid with organic material
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H10P50/20—Dry etching; Plasma etching; Reactive-ion etching
    • H10P50/28—Dry etching; Plasma etching; Reactive-ion etching of insulating materials
    • H10P50/282—Dry etching; Plasma etching; Reactive-ion etching of insulating materials of inorganic materials
    • H10P50/283—Dry etching; Plasma etching; Reactive-ion etching of insulating materials of inorganic materials by chemical means

Landscapes

  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Weting (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
CN202280029695.9A 2021-04-22 2022-04-22 蚀刻液 Pending CN117223092A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021072537 2021-04-22
JP2021-072537 2021-04-22
PCT/JP2022/018503 WO2022225032A1 (ja) 2021-04-22 2022-04-22 エッチング液

Publications (1)

Publication Number Publication Date
CN117223092A true CN117223092A (zh) 2023-12-12

Family

ID=83722358

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202280029695.9A Pending CN117223092A (zh) 2021-04-22 2022-04-22 蚀刻液

Country Status (5)

Country Link
US (1) US20240209260A1 (enExample)
JP (1) JP7768825B2 (enExample)
KR (1) KR20230173103A (enExample)
CN (1) CN117223092A (enExample)
WO (1) WO2022225032A1 (enExample)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109054838A (zh) * 2017-06-05 2018-12-21 弗萨姆材料美国有限责任公司 用于在半导体器件的制造过程中选择性除去氮化硅的蚀刻溶液
KR20200026716A (ko) * 2018-09-03 2020-03-11 주식회사 이엔에프테크놀로지 실리콘 질화막 식각 조성물 및 이를 이용한 방법
CN112470079A (zh) * 2018-07-27 2021-03-09 花王株式会社 清洗方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NO901662L (no) * 1989-04-17 1990-12-21 Monsanto Co Toert herbicid preparat med forbedret vannopploeselighet.
US10995269B2 (en) 2016-11-24 2021-05-04 Samsung Electronics Co., Ltd. Etchant composition and method of fabricating integrated circuit device using the same
KR102557642B1 (ko) * 2018-10-25 2023-07-20 에스케이이노베이션 주식회사 식각 조성물 첨가제, 그 제조방법 및 이를 포함하는 식각 조성물
JP2021086943A (ja) * 2019-11-28 2021-06-03 花王株式会社 エッチング液

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109054838A (zh) * 2017-06-05 2018-12-21 弗萨姆材料美国有限责任公司 用于在半导体器件的制造过程中选择性除去氮化硅的蚀刻溶液
CN112470079A (zh) * 2018-07-27 2021-03-09 花王株式会社 清洗方法
KR20200026716A (ko) * 2018-09-03 2020-03-11 주식회사 이엔에프테크놀로지 실리콘 질화막 식각 조성물 및 이를 이용한 방법

Also Published As

Publication number Publication date
TW202302817A (zh) 2023-01-16
KR20230173103A (ko) 2023-12-26
WO2022225032A1 (ja) 2022-10-27
JP2022167883A (ja) 2022-11-04
US20240209260A1 (en) 2024-06-27
JP7768825B2 (ja) 2025-11-12

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