JP7767652B2 - 基板搬送ロボットシステム - Google Patents

基板搬送ロボットシステム

Info

Publication number
JP7767652B2
JP7767652B2 JP2024567990A JP2024567990A JP7767652B2 JP 7767652 B2 JP7767652 B2 JP 7767652B2 JP 2024567990 A JP2024567990 A JP 2024567990A JP 2024567990 A JP2024567990 A JP 2024567990A JP 7767652 B2 JP7767652 B2 JP 7767652B2
Authority
JP
Japan
Prior art keywords
substrate
robot arm
deviation
robot
unit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2024567990A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2024143550A1 (https=
Inventor
良太 小野
泰希 今西
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kawasaki Motors Ltd
Original Assignee
Kawasaki Jukogyo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kawasaki Jukogyo KK filed Critical Kawasaki Jukogyo KK
Publication of JPWO2024143550A1 publication Critical patent/JPWO2024143550A1/ja
Application granted granted Critical
Publication of JP7767652B2 publication Critical patent/JP7767652B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3302—Mechanical parts of transfer devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J13/00—Controls for manipulators
    • B25J13/08—Controls for manipulators by means of sensing devices, e.g. viewing or touching devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
    • B25J15/0014—Gripping heads and other end effectors having fork, comb or plate shaped means for engaging the lower surface on a object to be transported
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J19/00—Accessories fitted to manipulators, e.g. for monitoring, for viewing; Safety devices combined with or specially adapted for use in connection with manipulators
    • B25J19/02—Sensing devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Program-controlled manipulators
    • B25J9/10—Program-controlled manipulators characterised by positioning means for manipulator elements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Program-controlled manipulators
    • B25J9/16—Program controls
    • B25J9/1656—Program controls characterised by programming, planning systems for manipulators
    • B25J9/1664—Program controls characterised by programming, planning systems for manipulators characterised by motion, path, trajectory planning
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Program-controlled manipulators
    • B25J9/16—Program controls
    • B25J9/1679—Program controls characterised by the tasks executed
    • B25J9/1692—Calibration of manipulator
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D3/00—Control of position or direction
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0606—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • H10P72/53—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment using optical controlling means

Landscapes

  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Automation & Control Theory (AREA)
  • Human Computer Interaction (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Manipulator (AREA)
JP2024567990A 2022-12-28 2023-12-28 基板搬送ロボットシステム Active JP7767652B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022211864 2022-12-28
JP2022211864 2022-12-28
PCT/JP2023/047313 WO2024143550A1 (ja) 2022-12-28 2023-12-28 基板搬送ロボットシステム

Publications (2)

Publication Number Publication Date
JPWO2024143550A1 JPWO2024143550A1 (https=) 2024-07-04
JP7767652B2 true JP7767652B2 (ja) 2025-11-11

Family

ID=91718184

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024567990A Active JP7767652B2 (ja) 2022-12-28 2023-12-28 基板搬送ロボットシステム

Country Status (5)

Country Link
JP (1) JP7767652B2 (https=)
KR (1) KR20250103716A (https=)
CN (1) CN120418948A (https=)
TW (1) TWI911616B (https=)
WO (1) WO2024143550A1 (https=)

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000506789A (ja) 1996-03-22 2000-06-06 ジェンマーク オートメーション インコーポレイテッド 多自由度ロボット
JP2012231041A (ja) 2011-04-27 2012-11-22 Hitachi High-Tech Control Systems Corp 基板搬送装置
JP2014522743A (ja) 2011-08-08 2014-09-08 アプライド マテリアルズ インコーポレイテッド マルチリンケージロボットを有するシステム及びマルチリンケージロボットにおいて位置アライメント及び回転アライメントを補正するための方法
JP2015514019A (ja) 2012-04-12 2015-05-18 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 独立して回転可能なウェストを有するロボットシステム、装置、および方法
JP2015178161A (ja) 2014-03-19 2015-10-08 株式会社安川電機 搬送ロボットおよび搬送システム
JP2016062909A (ja) 2014-09-12 2016-04-25 キヤノン株式会社 基板搬送システム、基板搬送方法、リソグラフィ装置、および物品の製造方法
JP2017092246A (ja) 2015-11-10 2017-05-25 株式会社Ｓｃｒｅｅｎホールディングス 基板搬送装置、基板処理システム、および基板搬送方法
JP2017191448A (ja) 2016-04-13 2017-10-19 ファナック株式会社 モータ制御装置、モータ制御方法及びモータ制御プログラム
JP2022102888A (ja) 2020-12-25 2022-07-07 川崎重工業株式会社 基板搬送ロボットの制御装置及び関節モータの制御方法
JP2022148398A (ja) 2021-03-24 2022-10-06 東京エレクトロン株式会社 基板搬送方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9202733B2 (en) * 2011-11-07 2015-12-01 Persimmon Technologies Corporation Robot system with independent arms
JP5596093B2 (ja) * 2012-09-05 2014-09-24 ファナック株式会社 バックラッシを補正するモータ制御装置
JP7553191B2 (ja) * 2020-08-31 2024-09-18 東京エレクトロン株式会社 基板搬送システムの制御方法及び基板搬送システム

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000506789A (ja) 1996-03-22 2000-06-06 ジェンマーク オートメーション インコーポレイテッド 多自由度ロボット
JP2012231041A (ja) 2011-04-27 2012-11-22 Hitachi High-Tech Control Systems Corp 基板搬送装置
JP2014522743A (ja) 2011-08-08 2014-09-08 アプライド マテリアルズ インコーポレイテッド マルチリンケージロボットを有するシステム及びマルチリンケージロボットにおいて位置アライメント及び回転アライメントを補正するための方法
JP2015514019A (ja) 2012-04-12 2015-05-18 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 独立して回転可能なウェストを有するロボットシステム、装置、および方法
JP2015178161A (ja) 2014-03-19 2015-10-08 株式会社安川電機 搬送ロボットおよび搬送システム
JP2016062909A (ja) 2014-09-12 2016-04-25 キヤノン株式会社 基板搬送システム、基板搬送方法、リソグラフィ装置、および物品の製造方法
JP2017092246A (ja) 2015-11-10 2017-05-25 株式会社Ｓｃｒｅｅｎホールディングス 基板搬送装置、基板処理システム、および基板搬送方法
JP2017191448A (ja) 2016-04-13 2017-10-19 ファナック株式会社 モータ制御装置、モータ制御方法及びモータ制御プログラム
JP2022102888A (ja) 2020-12-25 2022-07-07 川崎重工業株式会社 基板搬送ロボットの制御装置及び関節モータの制御方法
JP2022148398A (ja) 2021-03-24 2022-10-06 東京エレクトロン株式会社 基板搬送方法

Also Published As

Publication number Publication date
CN120418948A (zh) 2025-08-01
WO2024143550A1 (ja) 2024-07-04
TWI911616B (zh) 2026-01-11
KR20250103716A (ko) 2025-07-07
JPWO2024143550A1 (https=) 2024-07-04
TW202435344A (zh) 2024-09-01

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