TWI911616B - 基板搬送機器人系統 - Google Patents
基板搬送機器人系統Info
- Publication number
- TWI911616B TWI911616B TW112151407A TW112151407A TWI911616B TW I911616 B TWI911616 B TW I911616B TW 112151407 A TW112151407 A TW 112151407A TW 112151407 A TW112151407 A TW 112151407A TW I911616 B TWI911616 B TW I911616B
- Authority
- TW
- Taiwan
- Prior art keywords
- aforementioned
- substrate
- robotic arm
- control unit
- movement
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
- H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
- H10P72/3302—Mechanical parts of transfer devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J13/00—Controls for manipulators
- B25J13/08—Controls for manipulators by means of sensing devices, e.g. viewing or touching devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J15/00—Gripping heads and other end effectors
- B25J15/0014—Gripping heads and other end effectors having fork, comb or plate shaped means for engaging the lower surface on a object to be transported
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J19/00—Accessories fitted to manipulators, e.g. for monitoring, for viewing; Safety devices combined with or specially adapted for use in connection with manipulators
- B25J19/02—Sensing devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J9/00—Program-controlled manipulators
- B25J9/10—Program-controlled manipulators characterised by positioning means for manipulator elements
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J9/00—Program-controlled manipulators
- B25J9/16—Program controls
- B25J9/1656—Program controls characterised by programming, planning systems for manipulators
- B25J9/1664—Program controls characterised by programming, planning systems for manipulators characterised by motion, path, trajectory planning
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J9/00—Program-controlled manipulators
- B25J9/16—Program controls
- B25J9/1679—Program controls characterised by the tasks executed
- B25J9/1692—Calibration of manipulator
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
- G05D3/00—Control of position or direction
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
- H10P72/0606—Position monitoring, e.g. misposition detection or presence detection
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
- H10P72/53—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment using optical controlling means
Landscapes
- Engineering & Computer Science (AREA)
- Robotics (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Automation & Control Theory (AREA)
- Human Computer Interaction (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Manipulator (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022211864 | 2022-12-28 | ||
| JP2022-211864 | 2022-12-28 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW202435344A TW202435344A (zh) | 2024-09-01 |
| TWI911616B true TWI911616B (zh) | 2026-01-11 |
Family
ID=91718184
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW112151407A TWI911616B (zh) | 2022-12-28 | 2023-12-28 | 基板搬送機器人系統 |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP7767652B2 (https=) |
| KR (1) | KR20250103716A (https=) |
| CN (1) | CN120418948A (https=) |
| TW (1) | TWI911616B (https=) |
| WO (1) | WO2024143550A1 (https=) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20130121798A1 (en) * | 2011-11-07 | 2013-05-16 | Martin Hosek | Robot system with independent arms |
| CN103676779B (zh) * | 2012-09-05 | 2015-09-30 | 发那科株式会社 | 修正齿隙的电动机控制装置 |
| CN114121740A (zh) * | 2020-08-31 | 2022-03-01 | 东京毅力科创株式会社 | 基板输送系统的控制方法和基板输送系统 |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5789890A (en) | 1996-03-22 | 1998-08-04 | Genmark Automation | Robot having multiple degrees of freedom |
| JP2012231041A (ja) | 2011-04-27 | 2012-11-22 | Hitachi High-Tech Control Systems Corp | 基板搬送装置 |
| US8768513B2 (en) | 2011-08-08 | 2014-07-01 | Applied Materials, Inc. | Systems having multi-linkage robots and methods to correct positional and rotational alignment in multi-linkage robots |
| CN104380452B (zh) | 2012-04-12 | 2016-10-19 | 应用材料公司 | 具有独立能旋转机身中段的机械手系统、设备及方法 |
| JP2015178161A (ja) | 2014-03-19 | 2015-10-08 | 株式会社安川電機 | 搬送ロボットおよび搬送システム |
| JP2016062909A (ja) | 2014-09-12 | 2016-04-25 | キヤノン株式会社 | 基板搬送システム、基板搬送方法、リソグラフィ装置、および物品の製造方法 |
| JP2017092246A (ja) * | 2015-11-10 | 2017-05-25 | 株式会社Screenホールディングス | 基板搬送装置、基板処理システム、および基板搬送方法 |
| JP6396360B2 (ja) | 2016-04-13 | 2018-09-26 | ファナック株式会社 | モータ制御装置、モータ制御方法及びモータ制御プログラム |
| JP7712078B2 (ja) | 2020-12-25 | 2025-07-23 | 川崎重工業株式会社 | 基板搬送ロボットの制御装置及び関節モータの制御方法 |
| JP7568366B2 (ja) | 2021-03-24 | 2024-10-16 | 東京エレクトロン株式会社 | 基板搬送方法 |
-
2023
- 2023-12-28 KR KR1020257018173A patent/KR20250103716A/ko active Pending
- 2023-12-28 WO PCT/JP2023/047313 patent/WO2024143550A1/ja not_active Ceased
- 2023-12-28 JP JP2024567990A patent/JP7767652B2/ja active Active
- 2023-12-28 CN CN202380089013.8A patent/CN120418948A/zh active Pending
- 2023-12-28 TW TW112151407A patent/TWI911616B/zh active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20130121798A1 (en) * | 2011-11-07 | 2013-05-16 | Martin Hosek | Robot system with independent arms |
| CN103676779B (zh) * | 2012-09-05 | 2015-09-30 | 发那科株式会社 | 修正齿隙的电动机控制装置 |
| CN114121740A (zh) * | 2020-08-31 | 2022-03-01 | 东京毅力科创株式会社 | 基板输送系统的控制方法和基板输送系统 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN120418948A (zh) | 2025-08-01 |
| JP7767652B2 (ja) | 2025-11-11 |
| WO2024143550A1 (ja) | 2024-07-04 |
| KR20250103716A (ko) | 2025-07-07 |
| JPWO2024143550A1 (https=) | 2024-07-04 |
| TW202435344A (zh) | 2024-09-01 |
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