JP7707213B2 - 感光性エレメント、およびレジストパターンの形成方法 - Google Patents

感光性エレメント、およびレジストパターンの形成方法 Download PDF

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Publication number
JP7707213B2
JP7707213B2 JP2022578410A JP2022578410A JP7707213B2 JP 7707213 B2 JP7707213 B2 JP 7707213B2 JP 2022578410 A JP2022578410 A JP 2022578410A JP 2022578410 A JP2022578410 A JP 2022578410A JP 7707213 B2 JP7707213 B2 JP 7707213B2
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Japan
Prior art keywords
exposure
photosensitive resin
photosensitive element
plating
substrate
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JP2022578410A
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Japanese (ja)
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JPWO2022163652A1 (https=
Inventor
翔太 柳
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Asahi Kasei Corp
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Asahi Kasei Corp
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Publication of JPWO2022163652A1 publication Critical patent/JPWO2022163652A1/ja
Priority to JP2025112510A priority Critical patent/JP2025141982A/ja
Priority to JP2025112505A priority patent/JP7840464B2/ja
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
    • G03F7/2004—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image characterised by the use of a particular light source, e.g. fluorescent lamps or deep UV light
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/064—Photoresists
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1377—Protective layers
    • H05K2203/1383—Temporary protective insulating layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Materials For Photolithography (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Laminated Bodies (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
JP2022578410A 2021-01-29 2022-01-25 感光性エレメント、およびレジストパターンの形成方法 Active JP7707213B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2025112510A JP2025141982A (ja) 2021-01-29 2025-07-02 感光性エレメント、およびレジストパターンの形成方法
JP2025112505A JP7840464B2 (ja) 2021-01-29 2025-07-02 感光性エレメント、およびレジストパターンの形成方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021012929 2021-01-29
JP2021012929 2021-01-29
PCT/JP2022/002691 WO2022163652A1 (ja) 2021-01-29 2022-01-25 感光性エレメント、およびレジストパターンの形成方法

Related Child Applications (2)

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JP2025112505A Division JP7840464B2 (ja) 2021-01-29 2025-07-02 感光性エレメント、およびレジストパターンの形成方法
JP2025112510A Division JP2025141982A (ja) 2021-01-29 2025-07-02 感光性エレメント、およびレジストパターンの形成方法

Publications (2)

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JPWO2022163652A1 JPWO2022163652A1 (https=) 2022-08-04
JP7707213B2 true JP7707213B2 (ja) 2025-07-14

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JP2022578410A Active JP7707213B2 (ja) 2021-01-29 2022-01-25 感光性エレメント、およびレジストパターンの形成方法
JP2025112510A Pending JP2025141982A (ja) 2021-01-29 2025-07-02 感光性エレメント、およびレジストパターンの形成方法
JP2025112505A Active JP7840464B2 (ja) 2021-01-29 2025-07-02 感光性エレメント、およびレジストパターンの形成方法

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JP2025112510A Pending JP2025141982A (ja) 2021-01-29 2025-07-02 感光性エレメント、およびレジストパターンの形成方法
JP2025112505A Active JP7840464B2 (ja) 2021-01-29 2025-07-02 感光性エレメント、およびレジストパターンの形成方法

Country Status (6)

Country Link
US (1) US20240012326A1 (https=)
JP (3) JP7707213B2 (https=)
KR (1) KR20250165694A (https=)
CN (1) CN116830038A (https=)
TW (1) TWI793995B (https=)
WO (1) WO2022163652A1 (https=)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003043691A (ja) 2001-07-31 2003-02-13 Toray Ind Inc フォトレジスト用積層ポリエステルフィルム
JP2004361446A (ja) 2003-06-02 2004-12-24 Toray Ind Inc フォトレジスト用ポリエステルフィルム
JP2007328331A (ja) 2006-05-09 2007-12-20 Fujifilm Corp 感光性熱転写材料、画像形成方法、表示装置用部材、カラーフィルタ、及び表示装置
JP2016087854A (ja) 2014-10-31 2016-05-23 東レ株式会社 ドライフィルムレジスト支持体用二軸配向ポリエステルフィルム
JP2018100391A (ja) 2016-12-19 2018-06-28 東レ株式会社 二軸配向ポリエステルフィルムおよびその製造方法
JP2019179232A (ja) 2018-03-30 2019-10-17 太陽インキ製造株式会社 ドライフィルム、硬化物およびプリント配線板

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1260617C (zh) 1999-06-24 2006-06-21 日立化成工业株式会社 感光元件、感光元件辊、使用其的抗蚀图形的制法、抗蚀图形、抗蚀图形的积层片、布线图形的制法及布线图形
JP2006154622A (ja) * 2004-12-01 2006-06-15 Fuji Photo Film Co Ltd パターン形成材料及びパターン形成方法
JP5411521B2 (ja) * 2009-02-09 2014-02-12 旭化成イーマテリアルズ株式会社 感光性樹脂積層体
JP5814667B2 (ja) 2011-07-15 2015-11-17 旭化成イーマテリアルズ株式会社 感光性エレメント
CN108475015B (zh) * 2016-01-19 2022-03-18 互应化学工业株式会社 感光性树脂组合物、干膜和印刷布线板
WO2018100730A1 (ja) 2016-12-02 2018-06-07 日立化成株式会社 感光性エレメント、レジストパターンの形成方法、及び、プリント配線板の製造方法
KR20190035864A (ko) 2016-12-07 2019-04-03 아사히 가세이 가부시키가이샤 감광성 수지 조성물 및 감광성 수지 적층체
TWI634003B (zh) * 2017-01-26 2018-09-01 長興材料工業股份有限公司 感光型乾膜及其應用
MY200922A (en) * 2018-06-22 2024-01-23 Asahi Chemical Ind Photosensitive Resin Composition and Resist Pattern Formation Method
CN112534351B (zh) * 2018-08-09 2025-03-18 旭化成株式会社 感光性树脂组合物及抗蚀图案的形成方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003043691A (ja) 2001-07-31 2003-02-13 Toray Ind Inc フォトレジスト用積層ポリエステルフィルム
JP2004361446A (ja) 2003-06-02 2004-12-24 Toray Ind Inc フォトレジスト用ポリエステルフィルム
JP2007328331A (ja) 2006-05-09 2007-12-20 Fujifilm Corp 感光性熱転写材料、画像形成方法、表示装置用部材、カラーフィルタ、及び表示装置
JP2016087854A (ja) 2014-10-31 2016-05-23 東レ株式会社 ドライフィルムレジスト支持体用二軸配向ポリエステルフィルム
JP2018100391A (ja) 2016-12-19 2018-06-28 東レ株式会社 二軸配向ポリエステルフィルムおよびその製造方法
JP2019179232A (ja) 2018-03-30 2019-10-17 太陽インキ製造株式会社 ドライフィルム、硬化物およびプリント配線板

Also Published As

Publication number Publication date
JP2025141981A (ja) 2025-09-29
JPWO2022163652A1 (https=) 2022-08-04
KR20230096046A (ko) 2023-06-29
CN116830038A (zh) 2023-09-29
JP2025141982A (ja) 2025-09-29
JP7840464B2 (ja) 2026-04-03
TW202234166A (zh) 2022-09-01
US20240012326A1 (en) 2024-01-11
KR20250165694A (ko) 2025-11-26
TWI793995B (zh) 2023-02-21
WO2022163652A1 (ja) 2022-08-04

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