JPWO2022163652A1 - - Google Patents
Info
- Publication number
- JPWO2022163652A1 JPWO2022163652A1 JP2022578410A JP2022578410A JPWO2022163652A1 JP WO2022163652 A1 JPWO2022163652 A1 JP WO2022163652A1 JP 2022578410 A JP2022578410 A JP 2022578410A JP 2022578410 A JP2022578410 A JP 2022578410A JP WO2022163652 A1 JPWO2022163652 A1 JP WO2022163652A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
- G03F7/2004—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image characterised by the use of a particular light source, e.g. fluorescent lamps or deep UV light
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/061—Etching masks
- H05K3/064—Photoresists
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1377—Protective layers
- H05K2203/1383—Temporary protective insulating layer
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Materials For Photolithography (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Laminated Bodies (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2025112510A JP2025141982A (ja) | 2021-01-29 | 2025-07-02 | 感光性エレメント、およびレジストパターンの形成方法 |
| JP2025112505A JP7840464B2 (ja) | 2021-01-29 | 2025-07-02 | 感光性エレメント、およびレジストパターンの形成方法 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021012929 | 2021-01-29 | ||
| JP2021012929 | 2021-01-29 | ||
| PCT/JP2022/002691 WO2022163652A1 (ja) | 2021-01-29 | 2022-01-25 | 感光性エレメント、およびレジストパターンの形成方法 |
Related Child Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2025112505A Division JP7840464B2 (ja) | 2021-01-29 | 2025-07-02 | 感光性エレメント、およびレジストパターンの形成方法 |
| JP2025112510A Division JP2025141982A (ja) | 2021-01-29 | 2025-07-02 | 感光性エレメント、およびレジストパターンの形成方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2022163652A1 true JPWO2022163652A1 (https=) | 2022-08-04 |
| JP7707213B2 JP7707213B2 (ja) | 2025-07-14 |
Family
ID=82653581
Family Applications (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022578410A Active JP7707213B2 (ja) | 2021-01-29 | 2022-01-25 | 感光性エレメント、およびレジストパターンの形成方法 |
| JP2025112510A Pending JP2025141982A (ja) | 2021-01-29 | 2025-07-02 | 感光性エレメント、およびレジストパターンの形成方法 |
| JP2025112505A Active JP7840464B2 (ja) | 2021-01-29 | 2025-07-02 | 感光性エレメント、およびレジストパターンの形成方法 |
Family Applications After (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2025112510A Pending JP2025141982A (ja) | 2021-01-29 | 2025-07-02 | 感光性エレメント、およびレジストパターンの形成方法 |
| JP2025112505A Active JP7840464B2 (ja) | 2021-01-29 | 2025-07-02 | 感光性エレメント、およびレジストパターンの形成方法 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20240012326A1 (https=) |
| JP (3) | JP7707213B2 (https=) |
| KR (1) | KR20250165694A (https=) |
| CN (1) | CN116830038A (https=) |
| TW (1) | TWI793995B (https=) |
| WO (1) | WO2022163652A1 (https=) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003043691A (ja) * | 2001-07-31 | 2003-02-13 | Toray Ind Inc | フォトレジスト用積層ポリエステルフィルム |
| JP2004361446A (ja) * | 2003-06-02 | 2004-12-24 | Toray Ind Inc | フォトレジスト用ポリエステルフィルム |
| JP2007328331A (ja) * | 2006-05-09 | 2007-12-20 | Fujifilm Corp | 感光性熱転写材料、画像形成方法、表示装置用部材、カラーフィルタ、及び表示装置 |
| JP2016087854A (ja) * | 2014-10-31 | 2016-05-23 | 東レ株式会社 | ドライフィルムレジスト支持体用二軸配向ポリエステルフィルム |
| JP2018100391A (ja) * | 2016-12-19 | 2018-06-28 | 東レ株式会社 | 二軸配向ポリエステルフィルムおよびその製造方法 |
| JP2019179232A (ja) * | 2018-03-30 | 2019-10-17 | 太陽インキ製造株式会社 | ドライフィルム、硬化物およびプリント配線板 |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1260617C (zh) | 1999-06-24 | 2006-06-21 | 日立化成工业株式会社 | 感光元件、感光元件辊、使用其的抗蚀图形的制法、抗蚀图形、抗蚀图形的积层片、布线图形的制法及布线图形 |
| JP2006154622A (ja) * | 2004-12-01 | 2006-06-15 | Fuji Photo Film Co Ltd | パターン形成材料及びパターン形成方法 |
| JP5411521B2 (ja) * | 2009-02-09 | 2014-02-12 | 旭化成イーマテリアルズ株式会社 | 感光性樹脂積層体 |
| JP5814667B2 (ja) | 2011-07-15 | 2015-11-17 | 旭化成イーマテリアルズ株式会社 | 感光性エレメント |
| CN108475015B (zh) * | 2016-01-19 | 2022-03-18 | 互应化学工业株式会社 | 感光性树脂组合物、干膜和印刷布线板 |
| WO2018100730A1 (ja) | 2016-12-02 | 2018-06-07 | 日立化成株式会社 | 感光性エレメント、レジストパターンの形成方法、及び、プリント配線板の製造方法 |
| KR20190035864A (ko) | 2016-12-07 | 2019-04-03 | 아사히 가세이 가부시키가이샤 | 감광성 수지 조성물 및 감광성 수지 적층체 |
| TWI634003B (zh) * | 2017-01-26 | 2018-09-01 | 長興材料工業股份有限公司 | 感光型乾膜及其應用 |
| MY200922A (en) * | 2018-06-22 | 2024-01-23 | Asahi Chemical Ind | Photosensitive Resin Composition and Resist Pattern Formation Method |
| CN112534351B (zh) * | 2018-08-09 | 2025-03-18 | 旭化成株式会社 | 感光性树脂组合物及抗蚀图案的形成方法 |
-
2022
- 2022-01-25 KR KR1020257038518A patent/KR20250165694A/ko active Pending
- 2022-01-25 JP JP2022578410A patent/JP7707213B2/ja active Active
- 2022-01-25 WO PCT/JP2022/002691 patent/WO2022163652A1/ja not_active Ceased
- 2022-01-25 CN CN202280012230.2A patent/CN116830038A/zh active Pending
- 2022-01-25 US US18/271,018 patent/US20240012326A1/en active Pending
- 2022-01-26 TW TW111103288A patent/TWI793995B/zh active
-
2025
- 2025-07-02 JP JP2025112510A patent/JP2025141982A/ja active Pending
- 2025-07-02 JP JP2025112505A patent/JP7840464B2/ja active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003043691A (ja) * | 2001-07-31 | 2003-02-13 | Toray Ind Inc | フォトレジスト用積層ポリエステルフィルム |
| JP2004361446A (ja) * | 2003-06-02 | 2004-12-24 | Toray Ind Inc | フォトレジスト用ポリエステルフィルム |
| JP2007328331A (ja) * | 2006-05-09 | 2007-12-20 | Fujifilm Corp | 感光性熱転写材料、画像形成方法、表示装置用部材、カラーフィルタ、及び表示装置 |
| JP2016087854A (ja) * | 2014-10-31 | 2016-05-23 | 東レ株式会社 | ドライフィルムレジスト支持体用二軸配向ポリエステルフィルム |
| JP2018100391A (ja) * | 2016-12-19 | 2018-06-28 | 東レ株式会社 | 二軸配向ポリエステルフィルムおよびその製造方法 |
| JP2019179232A (ja) * | 2018-03-30 | 2019-10-17 | 太陽インキ製造株式会社 | ドライフィルム、硬化物およびプリント配線板 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP7707213B2 (ja) | 2025-07-14 |
| JP2025141981A (ja) | 2025-09-29 |
| KR20230096046A (ko) | 2023-06-29 |
| CN116830038A (zh) | 2023-09-29 |
| JP2025141982A (ja) | 2025-09-29 |
| JP7840464B2 (ja) | 2026-04-03 |
| TW202234166A (zh) | 2022-09-01 |
| US20240012326A1 (en) | 2024-01-11 |
| KR20250165694A (ko) | 2025-11-26 |
| TWI793995B (zh) | 2023-02-21 |
| WO2022163652A1 (ja) | 2022-08-04 |
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