KR20250165694A - 감광성 엘리먼트, 및 레지스트 패턴의 형성 방법 - Google Patents

감광성 엘리먼트, 및 레지스트 패턴의 형성 방법

Info

Publication number
KR20250165694A
KR20250165694A KR1020257038518A KR20257038518A KR20250165694A KR 20250165694 A KR20250165694 A KR 20250165694A KR 1020257038518 A KR1020257038518 A KR 1020257038518A KR 20257038518 A KR20257038518 A KR 20257038518A KR 20250165694 A KR20250165694 A KR 20250165694A
Authority
KR
South Korea
Prior art keywords
photosensitive resin
photosensitive element
exposure
plating
photosensitive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
KR1020257038518A
Other languages
English (en)
Korean (ko)
Inventor
쇼타 야나기
Original Assignee
아사히 가세이 가부시키가이샤
아사히 가세이 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 아사히 가세이 가부시키가이샤, 아사히 가세이 가부시키가이샤 filed Critical 아사히 가세이 가부시키가이샤
Priority claimed from KR1020237017676A external-priority patent/KR102956068B1/ko
Publication of KR20250165694A publication Critical patent/KR20250165694A/ko
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
    • G03F7/2004—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image characterised by the use of a particular light source, e.g. fluorescent lamps or deep UV light
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/064—Photoresists
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1377—Protective layers
    • H05K2203/1383—Temporary protective insulating layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Materials For Photolithography (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Laminated Bodies (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
KR1020257038518A 2021-01-29 2022-01-25 감광성 엘리먼트, 및 레지스트 패턴의 형성 방법 Pending KR20250165694A (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JPJP-P-2021-012929 2021-01-29
JP2021012929 2021-01-29
KR1020237017676A KR102956068B1 (ko) 2021-01-29 2022-01-25 감광성 엘리먼트, 및 레지스트 패턴의 형성 방법
PCT/JP2022/002691 WO2022163652A1 (ja) 2021-01-29 2022-01-25 感光性エレメント、およびレジストパターンの形成方法

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
KR1020237017676A Division KR102956068B1 (ko) 2021-01-29 2022-01-25 감광성 엘리먼트, 및 레지스트 패턴의 형성 방법

Publications (1)

Publication Number Publication Date
KR20250165694A true KR20250165694A (ko) 2025-11-26

Family

ID=82653581

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020257038518A Pending KR20250165694A (ko) 2021-01-29 2022-01-25 감광성 엘리먼트, 및 레지스트 패턴의 형성 방법

Country Status (6)

Country Link
US (1) US20240012326A1 (https=)
JP (3) JP7707213B2 (https=)
KR (1) KR20250165694A (https=)
CN (1) CN116830038A (https=)
TW (1) TWI793995B (https=)
WO (1) WO2022163652A1 (https=)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4014872B2 (ja) 1999-06-24 2007-11-28 日立化成工業株式会社 感光性エレメント、感光性エレメントロール、これを用いたレジストパターンの製造法、レジストパターン、レジストパターン積層基板、配線パターンの製造法及び配線パターン
JP5814667B2 (ja) 2011-07-15 2015-11-17 旭化成イーマテリアルズ株式会社 感光性エレメント
WO2018100730A1 (ja) 2016-12-02 2018-06-07 日立化成株式会社 感光性エレメント、レジストパターンの形成方法、及び、プリント配線板の製造方法
WO2018105620A1 (ja) 2016-12-07 2018-06-14 旭化成株式会社 感光性樹脂組成物及び感光性樹脂積層体

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4724975B2 (ja) 2001-07-31 2011-07-13 東レ株式会社 フォトレジスト用積層ポリエステルフィルム
JP4285089B2 (ja) * 2003-06-02 2009-06-24 東レ株式会社 フォトレジスト用ポリエステルフィルム
JP2006154622A (ja) * 2004-12-01 2006-06-15 Fuji Photo Film Co Ltd パターン形成材料及びパターン形成方法
JP2007328331A (ja) 2006-05-09 2007-12-20 Fujifilm Corp 感光性熱転写材料、画像形成方法、表示装置用部材、カラーフィルタ、及び表示装置
JP5411521B2 (ja) * 2009-02-09 2014-02-12 旭化成イーマテリアルズ株式会社 感光性樹脂積層体
JP6432283B2 (ja) * 2014-10-31 2018-12-05 東レ株式会社 ドライフィルムレジスト支持体用二軸配向ポリエステルフィルム
CN108475015B (zh) * 2016-01-19 2022-03-18 互应化学工业株式会社 感光性树脂组合物、干膜和印刷布线板
JP7067010B2 (ja) 2016-12-19 2022-05-16 東レ株式会社 二軸配向ポリエステルフィルムおよびその製造方法
TWI634003B (zh) * 2017-01-26 2018-09-01 長興材料工業股份有限公司 感光型乾膜及其應用
JP7113644B2 (ja) 2018-03-30 2022-08-05 太陽インキ製造株式会社 ドライフィルム、硬化物およびプリント配線板
MY200922A (en) * 2018-06-22 2024-01-23 Asahi Chemical Ind Photosensitive Resin Composition and Resist Pattern Formation Method
CN112534351B (zh) * 2018-08-09 2025-03-18 旭化成株式会社 感光性树脂组合物及抗蚀图案的形成方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4014872B2 (ja) 1999-06-24 2007-11-28 日立化成工業株式会社 感光性エレメント、感光性エレメントロール、これを用いたレジストパターンの製造法、レジストパターン、レジストパターン積層基板、配線パターンの製造法及び配線パターン
JP5814667B2 (ja) 2011-07-15 2015-11-17 旭化成イーマテリアルズ株式会社 感光性エレメント
WO2018100730A1 (ja) 2016-12-02 2018-06-07 日立化成株式会社 感光性エレメント、レジストパターンの形成方法、及び、プリント配線板の製造方法
WO2018105620A1 (ja) 2016-12-07 2018-06-14 旭化成株式会社 感光性樹脂組成物及び感光性樹脂積層体

Also Published As

Publication number Publication date
JP7707213B2 (ja) 2025-07-14
JP2025141981A (ja) 2025-09-29
JPWO2022163652A1 (https=) 2022-08-04
KR20230096046A (ko) 2023-06-29
CN116830038A (zh) 2023-09-29
JP2025141982A (ja) 2025-09-29
JP7840464B2 (ja) 2026-04-03
TW202234166A (zh) 2022-09-01
US20240012326A1 (en) 2024-01-11
TWI793995B (zh) 2023-02-21
WO2022163652A1 (ja) 2022-08-04

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