TWI793995B - 感光性元件、及光阻圖案之形成方法 - Google Patents

感光性元件、及光阻圖案之形成方法 Download PDF

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Publication number
TWI793995B
TWI793995B TW111103288A TW111103288A TWI793995B TW I793995 B TWI793995 B TW I793995B TW 111103288 A TW111103288 A TW 111103288A TW 111103288 A TW111103288 A TW 111103288A TW I793995 B TWI793995 B TW I793995B
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TW
Taiwan
Prior art keywords
photosensitive resin
photosensitive element
exposure
plating
pattern
Prior art date
Application number
TW111103288A
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English (en)
Chinese (zh)
Other versions
TW202234166A (zh
Inventor
柳翔太
Original Assignee
日商旭化成股份有限公司
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Application filed by 日商旭化成股份有限公司 filed Critical 日商旭化成股份有限公司
Publication of TW202234166A publication Critical patent/TW202234166A/zh
Application granted granted Critical
Publication of TWI793995B publication Critical patent/TWI793995B/zh

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
    • G03F7/2004—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image characterised by the use of a particular light source, e.g. fluorescent lamps or deep UV light
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/064—Photoresists
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1377—Protective layers
    • H05K2203/1383—Temporary protective insulating layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Materials For Photolithography (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Laminated Bodies (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
TW111103288A 2021-01-29 2022-01-26 感光性元件、及光阻圖案之形成方法 TWI793995B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021-012929 2021-01-29
JP2021012929 2021-01-29

Publications (2)

Publication Number Publication Date
TW202234166A TW202234166A (zh) 2022-09-01
TWI793995B true TWI793995B (zh) 2023-02-21

Family

ID=82653581

Family Applications (1)

Application Number Title Priority Date Filing Date
TW111103288A TWI793995B (zh) 2021-01-29 2022-01-26 感光性元件、及光阻圖案之形成方法

Country Status (6)

Country Link
US (1) US20240012326A1 (https=)
JP (3) JP7707213B2 (https=)
KR (1) KR20250165694A (https=)
CN (1) CN116830038A (https=)
TW (1) TWI793995B (https=)
WO (1) WO2022163652A1 (https=)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010181813A (ja) * 2009-02-09 2010-08-19 Asahi Kasei E-Materials Corp 感光性樹脂積層体
US20180210342A1 (en) * 2017-01-26 2018-07-26 Eternal Materials Co., Ltd. Photosensitive dry film and uses of the same
CN108475015A (zh) * 2016-01-19 2018-08-31 互应化学工业株式会社 感光性树脂组合物、干膜和印刷布线板
JP2019179232A (ja) * 2018-03-30 2019-10-17 太陽インキ製造株式会社 ドライフィルム、硬化物およびプリント配線板
TW202005995A (zh) * 2018-06-22 2020-02-01 日商旭化成股份有限公司 感光性樹脂組合物及抗蝕劑圖案之形成方法
TW202016154A (zh) * 2018-08-09 2020-05-01 日商旭化成股份有限公司 感光性樹脂組合物及抗蝕圖案之形成方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1260617C (zh) 1999-06-24 2006-06-21 日立化成工业株式会社 感光元件、感光元件辊、使用其的抗蚀图形的制法、抗蚀图形、抗蚀图形的积层片、布线图形的制法及布线图形
JP4724975B2 (ja) 2001-07-31 2011-07-13 東レ株式会社 フォトレジスト用積層ポリエステルフィルム
JP4285089B2 (ja) * 2003-06-02 2009-06-24 東レ株式会社 フォトレジスト用ポリエステルフィルム
JP2006154622A (ja) * 2004-12-01 2006-06-15 Fuji Photo Film Co Ltd パターン形成材料及びパターン形成方法
JP2007328331A (ja) 2006-05-09 2007-12-20 Fujifilm Corp 感光性熱転写材料、画像形成方法、表示装置用部材、カラーフィルタ、及び表示装置
JP5814667B2 (ja) 2011-07-15 2015-11-17 旭化成イーマテリアルズ株式会社 感光性エレメント
JP6432283B2 (ja) * 2014-10-31 2018-12-05 東レ株式会社 ドライフィルムレジスト支持体用二軸配向ポリエステルフィルム
WO2018100730A1 (ja) 2016-12-02 2018-06-07 日立化成株式会社 感光性エレメント、レジストパターンの形成方法、及び、プリント配線板の製造方法
KR20190035864A (ko) 2016-12-07 2019-04-03 아사히 가세이 가부시키가이샤 감광성 수지 조성물 및 감광성 수지 적층체
JP7067010B2 (ja) 2016-12-19 2022-05-16 東レ株式会社 二軸配向ポリエステルフィルムおよびその製造方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010181813A (ja) * 2009-02-09 2010-08-19 Asahi Kasei E-Materials Corp 感光性樹脂積層体
CN108475015A (zh) * 2016-01-19 2018-08-31 互应化学工业株式会社 感光性树脂组合物、干膜和印刷布线板
US20180210342A1 (en) * 2017-01-26 2018-07-26 Eternal Materials Co., Ltd. Photosensitive dry film and uses of the same
JP2019179232A (ja) * 2018-03-30 2019-10-17 太陽インキ製造株式会社 ドライフィルム、硬化物およびプリント配線板
TW202005995A (zh) * 2018-06-22 2020-02-01 日商旭化成股份有限公司 感光性樹脂組合物及抗蝕劑圖案之形成方法
TW202016154A (zh) * 2018-08-09 2020-05-01 日商旭化成股份有限公司 感光性樹脂組合物及抗蝕圖案之形成方法

Also Published As

Publication number Publication date
JP7707213B2 (ja) 2025-07-14
JP2025141981A (ja) 2025-09-29
JPWO2022163652A1 (https=) 2022-08-04
KR20230096046A (ko) 2023-06-29
CN116830038A (zh) 2023-09-29
JP2025141982A (ja) 2025-09-29
JP7840464B2 (ja) 2026-04-03
TW202234166A (zh) 2022-09-01
US20240012326A1 (en) 2024-01-11
KR20250165694A (ko) 2025-11-26
WO2022163652A1 (ja) 2022-08-04

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