CN116830038A - 感光性元件和抗蚀图案的形成方法 - Google Patents

感光性元件和抗蚀图案的形成方法 Download PDF

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Publication number
CN116830038A
CN116830038A CN202280012230.2A CN202280012230A CN116830038A CN 116830038 A CN116830038 A CN 116830038A CN 202280012230 A CN202280012230 A CN 202280012230A CN 116830038 A CN116830038 A CN 116830038A
Authority
CN
China
Prior art keywords
photosensitive resin
exposure
plating
photosensitive element
pattern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202280012230.2A
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English (en)
Chinese (zh)
Inventor
柳翔太
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Asahi Kasei Corp
Original Assignee
Asahi Kasei Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Kasei Corp filed Critical Asahi Kasei Corp
Publication of CN116830038A publication Critical patent/CN116830038A/zh
Pending legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
    • G03F7/2004—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image characterised by the use of a particular light source, e.g. fluorescent lamps or deep UV light
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/064—Photoresists
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1377—Protective layers
    • H05K2203/1383—Temporary protective insulating layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Materials For Photolithography (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Laminated Bodies (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
CN202280012230.2A 2021-01-29 2022-01-25 感光性元件和抗蚀图案的形成方法 Pending CN116830038A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021-012929 2021-01-29
JP2021012929 2021-01-29
PCT/JP2022/002691 WO2022163652A1 (ja) 2021-01-29 2022-01-25 感光性エレメント、およびレジストパターンの形成方法

Publications (1)

Publication Number Publication Date
CN116830038A true CN116830038A (zh) 2023-09-29

Family

ID=82653581

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202280012230.2A Pending CN116830038A (zh) 2021-01-29 2022-01-25 感光性元件和抗蚀图案的形成方法

Country Status (6)

Country Link
US (1) US20240012326A1 (https=)
JP (3) JP7707213B2 (https=)
KR (1) KR20250165694A (https=)
CN (1) CN116830038A (https=)
TW (1) TWI793995B (https=)
WO (1) WO2022163652A1 (https=)

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1260617C (zh) 1999-06-24 2006-06-21 日立化成工业株式会社 感光元件、感光元件辊、使用其的抗蚀图形的制法、抗蚀图形、抗蚀图形的积层片、布线图形的制法及布线图形
JP4724975B2 (ja) 2001-07-31 2011-07-13 東レ株式会社 フォトレジスト用積層ポリエステルフィルム
JP4285089B2 (ja) * 2003-06-02 2009-06-24 東レ株式会社 フォトレジスト用ポリエステルフィルム
JP2006154622A (ja) * 2004-12-01 2006-06-15 Fuji Photo Film Co Ltd パターン形成材料及びパターン形成方法
JP2007328331A (ja) 2006-05-09 2007-12-20 Fujifilm Corp 感光性熱転写材料、画像形成方法、表示装置用部材、カラーフィルタ、及び表示装置
JP5411521B2 (ja) * 2009-02-09 2014-02-12 旭化成イーマテリアルズ株式会社 感光性樹脂積層体
JP5814667B2 (ja) 2011-07-15 2015-11-17 旭化成イーマテリアルズ株式会社 感光性エレメント
JP6432283B2 (ja) * 2014-10-31 2018-12-05 東レ株式会社 ドライフィルムレジスト支持体用二軸配向ポリエステルフィルム
CN108475015B (zh) * 2016-01-19 2022-03-18 互应化学工业株式会社 感光性树脂组合物、干膜和印刷布线板
WO2018100730A1 (ja) 2016-12-02 2018-06-07 日立化成株式会社 感光性エレメント、レジストパターンの形成方法、及び、プリント配線板の製造方法
KR20190035864A (ko) 2016-12-07 2019-04-03 아사히 가세이 가부시키가이샤 감광성 수지 조성물 및 감광성 수지 적층체
JP7067010B2 (ja) 2016-12-19 2022-05-16 東レ株式会社 二軸配向ポリエステルフィルムおよびその製造方法
TWI634003B (zh) * 2017-01-26 2018-09-01 長興材料工業股份有限公司 感光型乾膜及其應用
JP7113644B2 (ja) 2018-03-30 2022-08-05 太陽インキ製造株式会社 ドライフィルム、硬化物およびプリント配線板
MY200922A (en) * 2018-06-22 2024-01-23 Asahi Chemical Ind Photosensitive Resin Composition and Resist Pattern Formation Method
CN112534351B (zh) * 2018-08-09 2025-03-18 旭化成株式会社 感光性树脂组合物及抗蚀图案的形成方法

Also Published As

Publication number Publication date
JP7707213B2 (ja) 2025-07-14
JP2025141981A (ja) 2025-09-29
JPWO2022163652A1 (https=) 2022-08-04
KR20230096046A (ko) 2023-06-29
JP2025141982A (ja) 2025-09-29
JP7840464B2 (ja) 2026-04-03
TW202234166A (zh) 2022-09-01
US20240012326A1 (en) 2024-01-11
KR20250165694A (ko) 2025-11-26
TWI793995B (zh) 2023-02-21
WO2022163652A1 (ja) 2022-08-04

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