JP7679629B2 - 基板の搬送を行う装置、基板を処理するシステム及び基板を処理する方法 - Google Patents

基板の搬送を行う装置、基板を処理するシステム及び基板を処理する方法 Download PDF

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JP7679629B2
JP7679629B2 JP2021009861A JP2021009861A JP7679629B2 JP 7679629 B2 JP7679629 B2 JP 7679629B2 JP 2021009861 A JP2021009861 A JP 2021009861A JP 2021009861 A JP2021009861 A JP 2021009861A JP 7679629 B2 JP7679629 B2 JP 7679629B2
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Japan
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substrate
chamber
transfer
module
wafer
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JP2021009861A
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Japanese (ja)
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JP2022113548A (ja
JP2022113548A5 (https=
Inventor
健弘 新藤
明典 島村
博充 阪上
東偉 李
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Tokyo Electron Ltd
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Tokyo Electron Ltd
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Priority to JP2021009861A priority Critical patent/JP7679629B2/ja
Priority to TW111101083A priority patent/TW202243089A/zh
Priority to KR1020257023157A priority patent/KR20250112918A/ko
Priority to KR1020237027397A priority patent/KR102834376B1/ko
Priority to CN202280009603.0A priority patent/CN116711059A/zh
Priority to US18/273,446 priority patent/US20240120225A1/en
Priority to PCT/JP2022/000747 priority patent/WO2022158351A1/ja
Publication of JP2022113548A publication Critical patent/JP2022113548A/ja
Publication of JP2022113548A5 publication Critical patent/JP2022113548A5/ja
Priority to JP2025078228A priority patent/JP2025111814A/ja
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3204—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations using magnetic elements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0464—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the transfer chamber
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0606—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0616—Monitoring of warpages, curvatures, damages, defects or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3302—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3306—Horizontal transfer of a single workpiece
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • H10P72/53—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment using optical controlling means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7602—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a robot blade or gripped by a gripper for conveyance

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
  • Non-Mechanical Conveyors (AREA)
JP2021009861A 2021-01-25 2021-01-25 基板の搬送を行う装置、基板を処理するシステム及び基板を処理する方法 Active JP7679629B2 (ja)

Priority Applications (8)

Application Number Priority Date Filing Date Title
JP2021009861A JP7679629B2 (ja) 2021-01-25 2021-01-25 基板の搬送を行う装置、基板を処理するシステム及び基板を処理する方法
TW111101083A TW202243089A (zh) 2021-01-25 2022-01-11 進行基板的搬送之裝置、處理基板之系統及處理基板之方法
KR1020237027397A KR102834376B1 (ko) 2021-01-25 2022-01-12 기판의 반송을 행하는 장치, 기판을 처리하는 시스템 및 기판을 처리하는 방법
CN202280009603.0A CN116711059A (zh) 2021-01-25 2022-01-12 进行基板的输送的装置、对基板进行处理的系统以及对基板进行处理的方法
KR1020257023157A KR20250112918A (ko) 2021-01-25 2022-01-12 기판의 반송을 행하는 장치, 기판을 처리하는 시스템 및 기판을 처리하는 방법
US18/273,446 US20240120225A1 (en) 2021-01-25 2022-01-12 Apparatus for transferring substrate, substrate processing system and method of processing substrate
PCT/JP2022/000747 WO2022158351A1 (ja) 2021-01-25 2022-01-12 基板の搬送を行う装置、基板を処理するシステム及び基板を処理する方法
JP2025078228A JP2025111814A (ja) 2021-01-25 2025-05-08 基板の搬送を行う装置、基板を処理するシステム及び基板を処理する方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2021009861A JP7679629B2 (ja) 2021-01-25 2021-01-25 基板の搬送を行う装置、基板を処理するシステム及び基板を処理する方法

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JP2025078228A Division JP2025111814A (ja) 2021-01-25 2025-05-08 基板の搬送を行う装置、基板を処理するシステム及び基板を処理する方法

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JP2022113548A JP2022113548A (ja) 2022-08-04
JP2022113548A5 JP2022113548A5 (https=) 2023-10-26
JP7679629B2 true JP7679629B2 (ja) 2025-05-20

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JP2021009861A Active JP7679629B2 (ja) 2021-01-25 2021-01-25 基板の搬送を行う装置、基板を処理するシステム及び基板を処理する方法
JP2025078228A Pending JP2025111814A (ja) 2021-01-25 2025-05-08 基板の搬送を行う装置、基板を処理するシステム及び基板を処理する方法

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JP2025078228A Pending JP2025111814A (ja) 2021-01-25 2025-05-08 基板の搬送を行う装置、基板を処理するシステム及び基板を処理する方法

Country Status (6)

Country Link
US (1) US20240120225A1 (https=)
JP (2) JP7679629B2 (https=)
KR (2) KR20250112918A (https=)
CN (1) CN116711059A (https=)
TW (1) TW202243089A (https=)
WO (1) WO2022158351A1 (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7835056B2 (ja) * 2022-03-08 2026-03-25 東京エレクトロン株式会社 基板処理室内に配置される部材を搬送する装置、基板処理システム及び前記部材を搬送する方法
KR102662444B1 (ko) 2023-07-21 2024-05-03 브이엠 주식회사 상하부 자기 부상 레일을 이용하는 기판 이송 장치
CN121795144A (zh) * 2023-09-14 2026-04-03 东京毅力科创株式会社 基片处理系统和可移动式维护装置
JP2025085890A (ja) * 2023-11-27 2025-06-06 東京エレクトロン株式会社 搬送モジュール、及び半導体製造装置における基板搬送方法
JP2025187956A (ja) * 2024-06-14 2025-12-25 ヴイエム インコーポレイテッド 基板移送装置

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JP2018504784A (ja) 2015-01-23 2018-02-15 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 半導体処理設備
JP2019509622A (ja) 2016-01-18 2019-04-04 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 真空チャンバ内で基板キャリアを搬送するための装置、基板の真空処理のためのシステム、及び真空チャンバ内で基板キャリアを搬送するための方法
JP2019518138A (ja) 2016-05-18 2019-06-27 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 堆積源を搬送するための装置及び方法
WO2019238416A1 (de) 2018-06-14 2019-12-19 Robert Bosch Gmbh Beförderungsvorrichtung zum befördern mindestens eines wafers

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JP2019509622A (ja) 2016-01-18 2019-04-04 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 真空チャンバ内で基板キャリアを搬送するための装置、基板の真空処理のためのシステム、及び真空チャンバ内で基板キャリアを搬送するための方法
JP2019518138A (ja) 2016-05-18 2019-06-27 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 堆積源を搬送するための装置及び方法
WO2019238416A1 (de) 2018-06-14 2019-12-19 Robert Bosch Gmbh Beförderungsvorrichtung zum befördern mindestens eines wafers

Also Published As

Publication number Publication date
US20240120225A1 (en) 2024-04-11
KR20230129535A (ko) 2023-09-08
CN116711059A (zh) 2023-09-05
WO2022158351A1 (ja) 2022-07-28
TW202243089A (zh) 2022-11-01
JP2022113548A (ja) 2022-08-04
JP2025111814A (ja) 2025-07-30
KR20250112918A (ko) 2025-07-24
KR102834376B1 (ko) 2025-07-16

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