KR20250112918A - 기판의 반송을 행하는 장치, 기판을 처리하는 시스템 및 기판을 처리하는 방법 - Google Patents

기판의 반송을 행하는 장치, 기판을 처리하는 시스템 및 기판을 처리하는 방법

Info

Publication number
KR20250112918A
KR20250112918A KR1020257023157A KR20257023157A KR20250112918A KR 20250112918 A KR20250112918 A KR 20250112918A KR 1020257023157 A KR1020257023157 A KR 1020257023157A KR 20257023157 A KR20257023157 A KR 20257023157A KR 20250112918 A KR20250112918 A KR 20250112918A
Authority
KR
South Korea
Prior art keywords
substrate
room
return
module
magnet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
KR1020257023157A
Other languages
English (en)
Korean (ko)
Inventor
다케히로 신도
아키노리 시마무라
히로미츠 사카우에
동위 이
Original Assignee
도쿄엘렉트론가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 도쿄엘렉트론가부시키가이샤 filed Critical 도쿄엘렉트론가부시키가이샤
Publication of KR20250112918A publication Critical patent/KR20250112918A/ko
Pending legal-status Critical Current

Links

Classifications

    • H01L21/67709—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3204—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations using magnetic elements
    • H01L21/67017—
    • H01L21/67196—
    • H01L21/67259—
    • H01L21/67288—
    • H01L21/67742—
    • H01L21/67748—
    • H01L21/681—
    • H01L21/68707—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0464—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the transfer chamber
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0606—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0616—Monitoring of warpages, curvatures, damages, defects or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3302—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3306—Horizontal transfer of a single workpiece
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • H10P72/53—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment using optical controlling means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7602—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a robot blade or gripped by a gripper for conveyance

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
  • Non-Mechanical Conveyors (AREA)
KR1020257023157A 2021-01-25 2022-01-12 기판의 반송을 행하는 장치, 기판을 처리하는 시스템 및 기판을 처리하는 방법 Pending KR20250112918A (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JPJP-P-2021-009861 2021-01-25
JP2021009861A JP7679629B2 (ja) 2021-01-25 2021-01-25 基板の搬送を行う装置、基板を処理するシステム及び基板を処理する方法
KR1020237027397A KR102834376B1 (ko) 2021-01-25 2022-01-12 기판의 반송을 행하는 장치, 기판을 처리하는 시스템 및 기판을 처리하는 방법
PCT/JP2022/000747 WO2022158351A1 (ja) 2021-01-25 2022-01-12 基板の搬送を行う装置、基板を処理するシステム及び基板を処理する方法

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
KR1020237027397A Division KR102834376B1 (ko) 2021-01-25 2022-01-12 기판의 반송을 행하는 장치, 기판을 처리하는 시스템 및 기판을 처리하는 방법

Publications (1)

Publication Number Publication Date
KR20250112918A true KR20250112918A (ko) 2025-07-24

Family

ID=82548928

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1020257023157A Pending KR20250112918A (ko) 2021-01-25 2022-01-12 기판의 반송을 행하는 장치, 기판을 처리하는 시스템 및 기판을 처리하는 방법
KR1020237027397A Active KR102834376B1 (ko) 2021-01-25 2022-01-12 기판의 반송을 행하는 장치, 기판을 처리하는 시스템 및 기판을 처리하는 방법

Family Applications After (1)

Application Number Title Priority Date Filing Date
KR1020237027397A Active KR102834376B1 (ko) 2021-01-25 2022-01-12 기판의 반송을 행하는 장치, 기판을 처리하는 시스템 및 기판을 처리하는 방법

Country Status (6)

Country Link
US (1) US20240120225A1 (https=)
JP (2) JP7679629B2 (https=)
KR (2) KR20250112918A (https=)
CN (1) CN116711059A (https=)
TW (1) TW202243089A (https=)
WO (1) WO2022158351A1 (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7835056B2 (ja) * 2022-03-08 2026-03-25 東京エレクトロン株式会社 基板処理室内に配置される部材を搬送する装置、基板処理システム及び前記部材を搬送する方法
KR102662444B1 (ko) 2023-07-21 2024-05-03 브이엠 주식회사 상하부 자기 부상 레일을 이용하는 기판 이송 장치
CN121795144A (zh) * 2023-09-14 2026-04-03 东京毅力科创株式会社 基片处理系统和可移动式维护装置
JP2025085890A (ja) * 2023-11-27 2025-06-06 東京エレクトロン株式会社 搬送モジュール、及び半導体製造装置における基板搬送方法
JP2025187956A (ja) * 2024-06-14 2025-12-25 ヴイエム インコーポレイテッド 基板移送装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018504784A (ja) 2015-01-23 2018-02-15 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 半導体処理設備

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US5905850A (en) * 1996-06-28 1999-05-18 Lam Research Corporation Method and apparatus for positioning substrates
JP3442253B2 (ja) * 1997-03-13 2003-09-02 東京エレクトロン株式会社 基板処理装置
JP2000299367A (ja) * 1999-04-15 2000-10-24 Tokyo Electron Ltd 処理装置及び被処理体の搬送方法
JP4330703B2 (ja) * 1999-06-18 2009-09-16 東京エレクトロン株式会社 搬送モジュール及びクラスターシステム
JP4195227B2 (ja) * 2002-02-22 2008-12-10 東京エレクトロン株式会社 被処理体の導入ポート構造
US6896304B2 (en) * 2002-09-03 2005-05-24 Taiwan Semiconductor Manufacturing Co., Ltd. Automatic sensing wafer blade and method for using
JP4665037B2 (ja) * 2009-02-06 2011-04-06 東京エレクトロン株式会社 基板処理システム
IT1399285B1 (it) * 2009-07-03 2013-04-11 Applied Materials Inc Sistema di lavorazione substrato
JP2011115021A (ja) * 2009-11-30 2011-06-09 Nikon Corp 平面モータ装置及びステージ装置並びに露光装置
CN101770180A (zh) * 2010-02-02 2010-07-07 清华大学 一种采用多关节机械手的光刻机硅片台的线缆台
JP6338989B2 (ja) * 2014-09-19 2018-06-06 東京エレクトロン株式会社 基板搬送方法
DE102014225171A1 (de) * 2014-12-08 2016-06-09 Robert Bosch Gmbh Sicherungssystem für eine Anordnung zum Bewegen von Transportkörpern
EP3405973A1 (en) 2016-01-18 2018-11-28 Applied Materials, Inc. Apparatus for transportation of a substrate carrier in a vacuum chamber, system for vacuum processing of a substrate, and method for transportation of a substrate carrier in a vacuum chamber
KR102017875B1 (ko) 2016-05-18 2019-09-03 어플라이드 머티어리얼스, 인코포레이티드 증착 소스의 운송을 위한 장치 및 방법
DE102018006259A1 (de) 2018-06-14 2019-12-19 Robert Bosch Gmbh Beförderungsvorrichtung zum Befördern mindestens eines Wafers
US11527424B2 (en) * 2020-03-20 2022-12-13 Applied Materials, Inc. Substrate transfer systems and methods of use thereof

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JP2018504784A (ja) 2015-01-23 2018-02-15 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 半導体処理設備

Also Published As

Publication number Publication date
JP7679629B2 (ja) 2025-05-20
US20240120225A1 (en) 2024-04-11
KR20230129535A (ko) 2023-09-08
CN116711059A (zh) 2023-09-05
WO2022158351A1 (ja) 2022-07-28
TW202243089A (zh) 2022-11-01
JP2022113548A (ja) 2022-08-04
JP2025111814A (ja) 2025-07-30
KR102834376B1 (ko) 2025-07-16

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