CN116711059A - 进行基板的输送的装置、对基板进行处理的系统以及对基板进行处理的方法 - Google Patents

进行基板的输送的装置、对基板进行处理的系统以及对基板进行处理的方法 Download PDF

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Publication number
CN116711059A
CN116711059A CN202280009603.0A CN202280009603A CN116711059A CN 116711059 A CN116711059 A CN 116711059A CN 202280009603 A CN202280009603 A CN 202280009603A CN 116711059 A CN116711059 A CN 116711059A
Authority
CN
China
Prior art keywords
substrate
chamber
module
wafer
transfer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202280009603.0A
Other languages
English (en)
Chinese (zh)
Inventor
新藤健弘
岛村明典
阪上博充
李东伟
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of CN116711059A publication Critical patent/CN116711059A/zh
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3204—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations using magnetic elements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0464—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the transfer chamber
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0606—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0616—Monitoring of warpages, curvatures, damages, defects or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3302—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3306—Horizontal transfer of a single workpiece
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • H10P72/53—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment using optical controlling means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7602—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a robot blade or gripped by a gripper for conveyance

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
  • Non-Mechanical Conveyors (AREA)
CN202280009603.0A 2021-01-25 2022-01-12 进行基板的输送的装置、对基板进行处理的系统以及对基板进行处理的方法 Pending CN116711059A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021009861A JP7679629B2 (ja) 2021-01-25 2021-01-25 基板の搬送を行う装置、基板を処理するシステム及び基板を処理する方法
JP2021-009861 2021-01-25
PCT/JP2022/000747 WO2022158351A1 (ja) 2021-01-25 2022-01-12 基板の搬送を行う装置、基板を処理するシステム及び基板を処理する方法

Publications (1)

Publication Number Publication Date
CN116711059A true CN116711059A (zh) 2023-09-05

Family

ID=82548928

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202280009603.0A Pending CN116711059A (zh) 2021-01-25 2022-01-12 进行基板的输送的装置、对基板进行处理的系统以及对基板进行处理的方法

Country Status (6)

Country Link
US (1) US20240120225A1 (https=)
JP (2) JP7679629B2 (https=)
KR (2) KR20250112918A (https=)
CN (1) CN116711059A (https=)
TW (1) TW202243089A (https=)
WO (1) WO2022158351A1 (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7835056B2 (ja) * 2022-03-08 2026-03-25 東京エレクトロン株式会社 基板処理室内に配置される部材を搬送する装置、基板処理システム及び前記部材を搬送する方法
KR102662444B1 (ko) 2023-07-21 2024-05-03 브이엠 주식회사 상하부 자기 부상 레일을 이용하는 기판 이송 장치
CN121795144A (zh) * 2023-09-14 2026-04-03 东京毅力科创株式会社 基片处理系统和可移动式维护装置
JP2025085890A (ja) * 2023-11-27 2025-06-06 東京エレクトロン株式会社 搬送モジュール、及び半導体製造装置における基板搬送方法
JP2025187956A (ja) * 2024-06-14 2025-12-25 ヴイエム インコーポレイテッド 基板移送装置

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5905850A (en) * 1996-06-28 1999-05-18 Lam Research Corporation Method and apparatus for positioning substrates
JP3442253B2 (ja) * 1997-03-13 2003-09-02 東京エレクトロン株式会社 基板処理装置
JP2000299367A (ja) * 1999-04-15 2000-10-24 Tokyo Electron Ltd 処理装置及び被処理体の搬送方法
JP4330703B2 (ja) * 1999-06-18 2009-09-16 東京エレクトロン株式会社 搬送モジュール及びクラスターシステム
JP4195227B2 (ja) * 2002-02-22 2008-12-10 東京エレクトロン株式会社 被処理体の導入ポート構造
US6896304B2 (en) * 2002-09-03 2005-05-24 Taiwan Semiconductor Manufacturing Co., Ltd. Automatic sensing wafer blade and method for using
JP4665037B2 (ja) * 2009-02-06 2011-04-06 東京エレクトロン株式会社 基板処理システム
IT1399285B1 (it) * 2009-07-03 2013-04-11 Applied Materials Inc Sistema di lavorazione substrato
JP2011115021A (ja) * 2009-11-30 2011-06-09 Nikon Corp 平面モータ装置及びステージ装置並びに露光装置
CN101770180A (zh) * 2010-02-02 2010-07-07 清华大学 一种采用多关节机械手的光刻机硅片台的线缆台
JP6338989B2 (ja) * 2014-09-19 2018-06-06 東京エレクトロン株式会社 基板搬送方法
DE102014225171A1 (de) * 2014-12-08 2016-06-09 Robert Bosch Gmbh Sicherungssystem für eine Anordnung zum Bewegen von Transportkörpern
TWI676227B (zh) * 2015-01-23 2019-11-01 美商應用材料股份有限公司 半導體工藝設備
EP3405973A1 (en) 2016-01-18 2018-11-28 Applied Materials, Inc. Apparatus for transportation of a substrate carrier in a vacuum chamber, system for vacuum processing of a substrate, and method for transportation of a substrate carrier in a vacuum chamber
KR102017875B1 (ko) 2016-05-18 2019-09-03 어플라이드 머티어리얼스, 인코포레이티드 증착 소스의 운송을 위한 장치 및 방법
DE102018006259A1 (de) 2018-06-14 2019-12-19 Robert Bosch Gmbh Beförderungsvorrichtung zum Befördern mindestens eines Wafers
US11527424B2 (en) * 2020-03-20 2022-12-13 Applied Materials, Inc. Substrate transfer systems and methods of use thereof

Also Published As

Publication number Publication date
JP7679629B2 (ja) 2025-05-20
US20240120225A1 (en) 2024-04-11
KR20230129535A (ko) 2023-09-08
WO2022158351A1 (ja) 2022-07-28
TW202243089A (zh) 2022-11-01
JP2022113548A (ja) 2022-08-04
JP2025111814A (ja) 2025-07-30
KR20250112918A (ko) 2025-07-24
KR102834376B1 (ko) 2025-07-16

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