TW202243089A - 進行基板的搬送之裝置、處理基板之系統及處理基板之方法 - Google Patents

進行基板的搬送之裝置、處理基板之系統及處理基板之方法 Download PDF

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Publication number
TW202243089A
TW202243089A TW111101083A TW111101083A TW202243089A TW 202243089 A TW202243089 A TW 202243089A TW 111101083 A TW111101083 A TW 111101083A TW 111101083 A TW111101083 A TW 111101083A TW 202243089 A TW202243089 A TW 202243089A
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TW
Taiwan
Prior art keywords
substrate
chamber
substrate transfer
wafer
module
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TW111101083A
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English (en)
Chinese (zh)
Inventor
新藤健弘
島村明典
阪上博充
李東偉
Original Assignee
日商東京威力科創股份有限公司
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Publication of TW202243089A publication Critical patent/TW202243089A/zh

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3204—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations using magnetic elements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0464—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the transfer chamber
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0606—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0616—Monitoring of warpages, curvatures, damages, defects or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3302—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3306—Horizontal transfer of a single workpiece
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • H10P72/53—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment using optical controlling means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7602—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a robot blade or gripped by a gripper for conveyance

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
  • Non-Mechanical Conveyors (AREA)
TW111101083A 2021-01-25 2022-01-11 進行基板的搬送之裝置、處理基板之系統及處理基板之方法 TW202243089A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021009861A JP7679629B2 (ja) 2021-01-25 2021-01-25 基板の搬送を行う装置、基板を処理するシステム及び基板を処理する方法
JP2021-009861 2021-01-25

Publications (1)

Publication Number Publication Date
TW202243089A true TW202243089A (zh) 2022-11-01

Family

ID=82548928

Family Applications (1)

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TW111101083A TW202243089A (zh) 2021-01-25 2022-01-11 進行基板的搬送之裝置、處理基板之系統及處理基板之方法

Country Status (6)

Country Link
US (1) US20240120225A1 (https=)
JP (2) JP7679629B2 (https=)
KR (2) KR20250112918A (https=)
CN (1) CN116711059A (https=)
TW (1) TW202243089A (https=)
WO (1) WO2022158351A1 (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7835056B2 (ja) * 2022-03-08 2026-03-25 東京エレクトロン株式会社 基板処理室内に配置される部材を搬送する装置、基板処理システム及び前記部材を搬送する方法
KR102662444B1 (ko) 2023-07-21 2024-05-03 브이엠 주식회사 상하부 자기 부상 레일을 이용하는 기판 이송 장치
CN121795144A (zh) * 2023-09-14 2026-04-03 东京毅力科创株式会社 基片处理系统和可移动式维护装置
JP2025085890A (ja) * 2023-11-27 2025-06-06 東京エレクトロン株式会社 搬送モジュール、及び半導体製造装置における基板搬送方法
JP2025187956A (ja) * 2024-06-14 2025-12-25 ヴイエム インコーポレイテッド 基板移送装置

Family Cites Families (17)

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US5905850A (en) * 1996-06-28 1999-05-18 Lam Research Corporation Method and apparatus for positioning substrates
JP3442253B2 (ja) * 1997-03-13 2003-09-02 東京エレクトロン株式会社 基板処理装置
JP2000299367A (ja) * 1999-04-15 2000-10-24 Tokyo Electron Ltd 処理装置及び被処理体の搬送方法
JP4330703B2 (ja) * 1999-06-18 2009-09-16 東京エレクトロン株式会社 搬送モジュール及びクラスターシステム
JP4195227B2 (ja) * 2002-02-22 2008-12-10 東京エレクトロン株式会社 被処理体の導入ポート構造
US6896304B2 (en) * 2002-09-03 2005-05-24 Taiwan Semiconductor Manufacturing Co., Ltd. Automatic sensing wafer blade and method for using
JP4665037B2 (ja) * 2009-02-06 2011-04-06 東京エレクトロン株式会社 基板処理システム
IT1399285B1 (it) * 2009-07-03 2013-04-11 Applied Materials Inc Sistema di lavorazione substrato
JP2011115021A (ja) * 2009-11-30 2011-06-09 Nikon Corp 平面モータ装置及びステージ装置並びに露光装置
CN101770180A (zh) * 2010-02-02 2010-07-07 清华大学 一种采用多关节机械手的光刻机硅片台的线缆台
JP6338989B2 (ja) * 2014-09-19 2018-06-06 東京エレクトロン株式会社 基板搬送方法
DE102014225171A1 (de) * 2014-12-08 2016-06-09 Robert Bosch Gmbh Sicherungssystem für eine Anordnung zum Bewegen von Transportkörpern
TWI676227B (zh) * 2015-01-23 2019-11-01 美商應用材料股份有限公司 半導體工藝設備
EP3405973A1 (en) 2016-01-18 2018-11-28 Applied Materials, Inc. Apparatus for transportation of a substrate carrier in a vacuum chamber, system for vacuum processing of a substrate, and method for transportation of a substrate carrier in a vacuum chamber
KR102017875B1 (ko) 2016-05-18 2019-09-03 어플라이드 머티어리얼스, 인코포레이티드 증착 소스의 운송을 위한 장치 및 방법
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Also Published As

Publication number Publication date
JP7679629B2 (ja) 2025-05-20
US20240120225A1 (en) 2024-04-11
KR20230129535A (ko) 2023-09-08
CN116711059A (zh) 2023-09-05
WO2022158351A1 (ja) 2022-07-28
JP2022113548A (ja) 2022-08-04
JP2025111814A (ja) 2025-07-30
KR20250112918A (ko) 2025-07-24
KR102834376B1 (ko) 2025-07-16

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