JP7552360B2 - 感光性樹脂組成物、感光性シート、硬化膜、硬化膜の製造方法、層間絶縁膜および電子部品 - Google Patents

感光性樹脂組成物、感光性シート、硬化膜、硬化膜の製造方法、層間絶縁膜および電子部品 Download PDF

Info

Publication number
JP7552360B2
JP7552360B2 JP2020542921A JP2020542921A JP7552360B2 JP 7552360 B2 JP7552360 B2 JP 7552360B2 JP 2020542921 A JP2020542921 A JP 2020542921A JP 2020542921 A JP2020542921 A JP 2020542921A JP 7552360 B2 JP7552360 B2 JP 7552360B2
Authority
JP
Japan
Prior art keywords
photosensitive resin
resin composition
general formula
film
antenna
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2020542921A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2021020344A5 (https=
JPWO2021020344A1 (https=
Inventor
斉 荒木
央 小笠原
将也 壽慶
真佐夫 富川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toray Industries Inc
Original Assignee
Toray Industries Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toray Industries Inc filed Critical Toray Industries Inc
Publication of JPWO2021020344A1 publication Critical patent/JPWO2021020344A1/ja
Publication of JPWO2021020344A5 publication Critical patent/JPWO2021020344A5/ja
Application granted granted Critical
Publication of JP7552360B2 publication Critical patent/JP7552360B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1003—Preparatory processes
    • C08G73/1007—Preparatory processes from tetracarboxylic acids or derivatives and diamines
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/037—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polyamides or polyimides
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Structural Engineering (AREA)
  • Architecture (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Materials For Photolithography (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
JP2020542921A 2019-08-01 2020-07-27 感光性樹脂組成物、感光性シート、硬化膜、硬化膜の製造方法、層間絶縁膜および電子部品 Active JP7552360B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019141963 2019-08-01
JP2019141963 2019-08-01
PCT/JP2020/028701 WO2021020344A1 (ja) 2019-08-01 2020-07-27 感光性樹脂組成物、感光性シート、硬化膜、硬化膜の製造方法、層間絶縁膜および電子部品

Publications (3)

Publication Number Publication Date
JPWO2021020344A1 JPWO2021020344A1 (https=) 2021-02-04
JPWO2021020344A5 JPWO2021020344A5 (https=) 2023-07-04
JP7552360B2 true JP7552360B2 (ja) 2024-09-18

Family

ID=74230418

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2020542921A Active JP7552360B2 (ja) 2019-08-01 2020-07-27 感光性樹脂組成物、感光性シート、硬化膜、硬化膜の製造方法、層間絶縁膜および電子部品

Country Status (5)

Country Link
JP (1) JP7552360B2 (https=)
KR (1) KR102716758B1 (https=)
CN (1) CN114207520B (https=)
TW (1) TWI855121B (https=)
WO (1) WO2021020344A1 (https=)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SE543907C2 (en) * 2019-12-13 2021-09-21 Organoclick Ab Non-rewetting o/w (oil in water) emulsification system for hydrophobic compounds
KR102864324B1 (ko) * 2021-03-30 2025-09-25 후지필름 가부시키가이샤 수지 조성물, 경화물, 적층체, 경화물의 제조 방법, 및, 반도체 디바이스, 및, 폴리이미드 전구체 및 그 제조 방법
JP2023136961A (ja) * 2022-03-17 2023-09-29 Ｈｄマイクロシステムズ株式会社 絶縁膜形成材料、半導体装置の製造方法及び半導体装置
JPWO2023190061A1 (https=) * 2022-03-29 2023-10-05
KR20240156619A (ko) * 2022-03-29 2024-10-30 후지필름 가부시키가이샤 수지 조성물, 경화물, 적층체, 경화물의 제조 방법, 적층체의 제조 방법, 반도체 디바이스의 제조 방법, 및, 반도체 디바이스
WO2023190060A1 (ja) * 2022-03-29 2023-10-05 富士フイルム株式会社 感光性樹脂組成物、硬化物、積層体、硬化物の製造方法、積層体の製造方法、半導体デバイスの製造方法、及び、半導体デバイス
KR102952159B1 (ko) * 2022-04-29 2026-04-15 피아이첨단소재 주식회사 폴리이미드 전구체
KR20250016157A (ko) * 2022-05-23 2025-02-03 도레이 카부시키가이샤 수지 조성물, 경화물, 안테나 소자 및 전자 부품
WO2024100764A1 (ja) * 2022-11-08 2024-05-16 株式会社レゾナック 感光性樹脂組成物、硬化物、及び半導体素子
CN120322486A (zh) 2023-02-17 2025-07-15 东丽株式会社 聚酰亚胺树脂、感光性树脂组合物、固化物、有机el显示装置及电子部件
JP2025041542A (ja) * 2023-09-13 2025-03-26 荒川化学工業株式会社 （メタ）アクリロイル基含有ポリイミド、感光性組成物、硬化物及び物品
WO2025126934A1 (ja) * 2023-12-12 2025-06-19 富士フイルム株式会社 感光性樹脂組成物、硬化物、積層体、硬化物の製造方法、積層体の製造方法、半導体デバイスの製造方法、半導体デバイス、及び、樹脂
WO2025205722A1 (ja) * 2024-03-28 2025-10-02 富士フイルム株式会社 樹脂組成物、硬化物、積層体、硬化物の製造方法、積層体の製造方法、半導体デバイスの製造方法、及び、半導体デバイス
WO2025253920A1 (ja) * 2024-06-07 2025-12-11 住友化学株式会社 感光性樹脂組成物、その硬化膜、及び該硬化膜を含む半導体パッケージ
WO2026069942A1 (ja) * 2024-09-27 2026-04-02 三菱瓦斯化学株式会社 ポリイミド樹脂前駆体組成物及びポリイミドフィルム

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20150344627A1 (en) 2012-11-20 2015-12-03 Designer Molecules, Inc. Low modulus negative tone, aqueous developable photoresist
WO2017030070A1 (ja) 2015-08-20 2017-02-23 東レ株式会社 アンテナ基板の製造方法、配線と電極付きアンテナ基板の製造方法およびｒｆｉｄ素子の製造方法
JP2019031597A (ja) 2017-08-07 2019-02-28 東レ株式会社 樹脂組成物、硬化膜、半導体装置および半導体装置の製造方法
JP2020029504A (ja) 2018-08-22 2020-02-27 日立化成株式会社 硬化性組成物

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06282071A (ja) * 1993-01-27 1994-10-07 Japan Synthetic Rubber Co Ltd 感放射線性樹脂組成物
JP5078648B2 (ja) 2008-02-08 2012-11-21 旭化成イーマテリアルズ株式会社 感光性樹脂組成物
JP2009251451A (ja) * 2008-04-09 2009-10-29 Hitachi Chem Co Ltd 感光性樹脂組成物及び感光性エレメント
US9134608B2 (en) * 2010-01-21 2015-09-15 Hitachi Chemical Dupont Microsystems, Ltd. Positive photosensitive resin composition, method for producing patterned cured film and electronic component
TWI430024B (zh) * 2010-08-05 2014-03-11 旭化成電子材料股份有限公司 A photosensitive resin composition, a method for manufacturing a hardened bump pattern, and a semiconductor device
JP5742376B2 (ja) 2011-03-30 2015-07-01 東レ株式会社 ポジ型感光性樹脂組成物
KR20140073759A (ko) * 2012-12-07 2014-06-17 코오롱인더스트리 주식회사 광가교성 수지 조성물, 이로부터 형성된 절연막 및 유기발광소자
JP6422437B2 (ja) * 2013-06-28 2018-11-14 日鉄ケミカル＆マテリアル株式会社 ポリイミド、樹脂フィルム及び金属張積層体
SG11201706733UA (en) * 2015-03-04 2017-10-30 Toray Industries Photosensitive resin composition, method for manufacturing cured resin film, and semiconductor device
KR102090449B1 (ko) * 2016-03-31 2020-03-18 아사히 가세이 가부시키가이샤 감광성 수지 조성물, 경화 릴리프 패턴의 제조 방법 및 반도체 장치
CN109478016A (zh) * 2016-07-27 2019-03-15 日立化成杜邦微系统股份有限公司 感光性树脂组合物、其固化物、层间绝缘膜、表面保护膜和电子部件
KR101892170B1 (ko) * 2016-11-08 2018-08-27 울산과학기술원 전기화학 소자용 보호막, 이의 제조 방법 및 및 이를 포함하는 전기화학 소자
TWI614574B (zh) * 2017-01-03 2018-02-11 台虹科技股份有限公司 感光性組成物
JP2018203959A (ja) 2017-06-09 2018-12-27 日鉄ケミカル＆マテリアル株式会社 ポリイミド及び感光性樹脂組成物

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20150344627A1 (en) 2012-11-20 2015-12-03 Designer Molecules, Inc. Low modulus negative tone, aqueous developable photoresist
WO2017030070A1 (ja) 2015-08-20 2017-02-23 東レ株式会社 アンテナ基板の製造方法、配線と電極付きアンテナ基板の製造方法およびｒｆｉｄ素子の製造方法
JP2019031597A (ja) 2017-08-07 2019-02-28 東レ株式会社 樹脂組成物、硬化膜、半導体装置および半導体装置の製造方法
JP2020029504A (ja) 2018-08-22 2020-02-27 日立化成株式会社 硬化性組成物

Also Published As

Publication number Publication date
TWI855121B (zh) 2024-09-11
KR102716758B1 (ko) 2024-10-15
CN114207520B (zh) 2025-12-05
WO2021020344A1 (ja) 2021-02-04
JPWO2021020344A1 (https=) 2021-02-04
TW202106766A (zh) 2021-02-16
CN114207520A (zh) 2022-03-18
KR20220042060A (ko) 2022-04-04

Similar Documents

Publication Publication Date Title
JP7552360B2 (ja) 感光性樹脂組成物、感光性シート、硬化膜、硬化膜の製造方法、層間絶縁膜および電子部品
KR102896548B1 (ko) 감광성 수지 조성물, 감광성 시트, 경화막, 경화막의 제조 방법, 전자 부품, 안테나 소자, 반도체 패키지 및 표시 장치
JP7318206B2 (ja) 感光性樹脂組成物、感光性シート、ならびにそれらの硬化膜、その製造方法、それを用いた中空構造体および電子部品
TWI491987B (zh) A negative photosensitive resin composition, a hardened embossed pattern, and a semiconductor device
TWI820180B (zh) 感光性樹脂組成物、感光性薄片、以及彼等之硬化膜及其製造方法、電子零件
JP7003771B2 (ja) 感光性樹脂組成物、感光性シート、ならびにそれらの硬化膜およびその製造方法
JP7073717B2 (ja) ジアミン化合物、それを用いた耐熱性樹脂および樹脂組成物
KR20170125842A (ko) 감광성 수지 조성물, 수지 경화막의 제조 방법 및 반도체 장치
US20240045329A1 (en) Photosensitive resin composition, cured film, electronic component, antenna element, semiconductor package, and compound
KR20170125352A (ko) 감광성 수지 조성물 및 전자 부품
TWI819121B (zh) 硬化膜的製造方法、硬化膜、積層體的製造方法及半導體元件的製造方法
TW202332992A (zh) 感光性樹脂組成物
WO2023228568A1 (ja) 感光性樹脂組成物、並びにこれを用いたポリイミド硬化膜の製造方法及びポリイミド硬化膜
TWI824035B (zh) 樹脂組成物、硬化膜、積層體、硬化膜的製造方法及半導體元件
WO2019181782A1 (ja) アルカリ可溶性樹脂、感光性樹脂組成物、感光性シート、硬化膜、層間絶縁膜または半導体保護膜、硬化膜のレリーフパターンの製造方法、電子部品または半導体装置
TWI852213B (zh) 感光性樹脂組合物、硬化浮凸圖案之製造方法及半導體裝置
JP2008038141A (ja) 耐熱性樹脂組成物およびそれを用いた金属樹脂複合体
TWI830255B (zh) 感光性聚醯亞胺樹脂組成物
TWI904639B (zh) 負型感光性樹脂組合物、以及使用其之硬化浮凸圖案之製造方法及硬化膜
TW202449025A (zh) 負型感光性樹脂組合物及硬化浮凸圖案之製造方法
JP2023147245A (ja) 感光性樹脂組成物、硬化物および電子部品
CN121005901A (zh) 低温固化、低热膨胀光敏聚酰亚胺树脂及其光刻胶
WO2025074871A1 (ja) 樹脂、感光性樹脂組成物およびそれらの硬化物、ならびに、前記硬化物を用いた電子部品および表示装置
JP2024143774A (ja) 感光性樹脂組成物およびその製造方法
JP2024168314A (ja) 感光性樹脂組成物

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20230626

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20230626

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20240806

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20240819

R150 Certificate of patent or registration of utility model

Ref document number: 7552360

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150