JPWO2021020344A1 - - Google Patents
Info
- Publication number
- JPWO2021020344A1 JPWO2021020344A1 JP2020542921A JP2020542921A JPWO2021020344A1 JP WO2021020344 A1 JPWO2021020344 A1 JP WO2021020344A1 JP 2020542921 A JP2020542921 A JP 2020542921A JP 2020542921 A JP2020542921 A JP 2020542921A JP WO2021020344 A1 JPWO2021020344 A1 JP WO2021020344A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1003—Preparatory processes
- C08G73/1007—Preparatory processes from tetracarboxylic acids or derivatives and diamines
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
- G03F7/037—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polyamides or polyimides
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Engineering & Computer Science (AREA)
- Structural Engineering (AREA)
- Architecture (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
- Materials For Photolithography (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Macromonomer-Based Addition Polymer (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019141963 | 2019-08-01 | ||
| JP2019141963 | 2019-08-01 | ||
| PCT/JP2020/028701 WO2021020344A1 (ja) | 2019-08-01 | 2020-07-27 | 感光性樹脂組成物、感光性シート、硬化膜、硬化膜の製造方法、層間絶縁膜および電子部品 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2021020344A1 true JPWO2021020344A1 (https=) | 2021-02-04 |
| JPWO2021020344A5 JPWO2021020344A5 (https=) | 2023-07-04 |
| JP7552360B2 JP7552360B2 (ja) | 2024-09-18 |
Family
ID=74230418
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2020542921A Active JP7552360B2 (ja) | 2019-08-01 | 2020-07-27 | 感光性樹脂組成物、感光性シート、硬化膜、硬化膜の製造方法、層間絶縁膜および電子部品 |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP7552360B2 (https=) |
| KR (1) | KR102716758B1 (https=) |
| CN (1) | CN114207520B (https=) |
| TW (1) | TWI855121B (https=) |
| WO (1) | WO2021020344A1 (https=) |
Families Citing this family (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| SE543907C2 (en) * | 2019-12-13 | 2021-09-21 | Organoclick Ab | Non-rewetting o/w (oil in water) emulsification system for hydrophobic compounds |
| KR102864324B1 (ko) * | 2021-03-30 | 2025-09-25 | 후지필름 가부시키가이샤 | 수지 조성물, 경화물, 적층체, 경화물의 제조 방법, 및, 반도체 디바이스, 및, 폴리이미드 전구체 및 그 제조 방법 |
| JP2023136961A (ja) * | 2022-03-17 | 2023-09-29 | Ｈｄマイクロシステムズ株式会社 | 絶縁膜形成材料、半導体装置の製造方法及び半導体装置 |
| JPWO2023190061A1 (https=) * | 2022-03-29 | 2023-10-05 | ||
| KR20240156619A (ko) * | 2022-03-29 | 2024-10-30 | 후지필름 가부시키가이샤 | 수지 조성물, 경화물, 적층체, 경화물의 제조 방법, 적층체의 제조 방법, 반도체 디바이스의 제조 방법, 및, 반도체 디바이스 |
| WO2023190060A1 (ja) * | 2022-03-29 | 2023-10-05 | 富士フイルム株式会社 | 感光性樹脂組成物、硬化物、積層体、硬化物の製造方法、積層体の製造方法、半導体デバイスの製造方法、及び、半導体デバイス |
| KR102952159B1 (ko) * | 2022-04-29 | 2026-04-15 | 피아이첨단소재 주식회사 | 폴리이미드 전구체 |
| KR20250016157A (ko) * | 2022-05-23 | 2025-02-03 | 도레이 카부시키가이샤 | 수지 조성물, 경화물, 안테나 소자 및 전자 부품 |
| WO2024100764A1 (ja) * | 2022-11-08 | 2024-05-16 | 株式会社レゾナック | 感光性樹脂組成物、硬化物、及び半導体素子 |
| CN120322486A (zh) | 2023-02-17 | 2025-07-15 | 东丽株式会社 | 聚酰亚胺树脂、感光性树脂组合物、固化物、有机el显示装置及电子部件 |
| JP2025041542A (ja) * | 2023-09-13 | 2025-03-26 | 荒川化学工業株式会社 | （メタ）アクリロイル基含有ポリイミド、感光性組成物、硬化物及び物品 |
| WO2025126934A1 (ja) * | 2023-12-12 | 2025-06-19 | 富士フイルム株式会社 | 感光性樹脂組成物、硬化物、積層体、硬化物の製造方法、積層体の製造方法、半導体デバイスの製造方法、半導体デバイス、及び、樹脂 |
| WO2025205722A1 (ja) * | 2024-03-28 | 2025-10-02 | 富士フイルム株式会社 | 樹脂組成物、硬化物、積層体、硬化物の製造方法、積層体の製造方法、半導体デバイスの製造方法、及び、半導体デバイス |
| WO2025253920A1 (ja) * | 2024-06-07 | 2025-12-11 | 住友化学株式会社 | 感光性樹脂組成物、その硬化膜、及び該硬化膜を含む半導体パッケージ |
| WO2026069942A1 (ja) * | 2024-09-27 | 2026-04-02 | 三菱瓦斯化学株式会社 | ポリイミド樹脂前駆体組成物及びポリイミドフィルム |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06282071A (ja) * | 1993-01-27 | 1994-10-07 | Japan Synthetic Rubber Co Ltd | 感放射線性樹脂組成物 |
| US20150344627A1 (en) * | 2012-11-20 | 2015-12-03 | Designer Molecules, Inc. | Low modulus negative tone, aqueous developable photoresist |
| WO2017030070A1 (ja) * | 2015-08-20 | 2017-02-23 | 東レ株式会社 | アンテナ基板の製造方法、配線と電極付きアンテナ基板の製造方法およびｒｆｉｄ素子の製造方法 |
| JP2019031597A (ja) * | 2017-08-07 | 2019-02-28 | 東レ株式会社 | 樹脂組成物、硬化膜、半導体装置および半導体装置の製造方法 |
| JP2020029504A (ja) * | 2018-08-22 | 2020-02-27 | 日立化成株式会社 | 硬化性組成物 |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5078648B2 (ja) | 2008-02-08 | 2012-11-21 | 旭化成イーマテリアルズ株式会社 | 感光性樹脂組成物 |
| JP2009251451A (ja) * | 2008-04-09 | 2009-10-29 | Hitachi Chem Co Ltd | 感光性樹脂組成物及び感光性エレメント |
| US9134608B2 (en) * | 2010-01-21 | 2015-09-15 | Hitachi Chemical Dupont Microsystems, Ltd. | Positive photosensitive resin composition, method for producing patterned cured film and electronic component |
| TWI430024B (zh) * | 2010-08-05 | 2014-03-11 | 旭化成電子材料股份有限公司 | A photosensitive resin composition, a method for manufacturing a hardened bump pattern, and a semiconductor device |
| JP5742376B2 (ja) | 2011-03-30 | 2015-07-01 | 東レ株式会社 | ポジ型感光性樹脂組成物 |
| KR20140073759A (ko) * | 2012-12-07 | 2014-06-17 | 코오롱인더스트리 주식회사 | 광가교성 수지 조성물, 이로부터 형성된 절연막 및 유기발광소자 |
| JP6422437B2 (ja) * | 2013-06-28 | 2018-11-14 | 日鉄ケミカル＆マテリアル株式会社 | ポリイミド、樹脂フィルム及び金属張積層体 |
| SG11201706733UA (en) * | 2015-03-04 | 2017-10-30 | Toray Industries | Photosensitive resin composition, method for manufacturing cured resin film, and semiconductor device |
| KR102090449B1 (ko) * | 2016-03-31 | 2020-03-18 | 아사히 가세이 가부시키가이샤 | 감광성 수지 조성물, 경화 릴리프 패턴의 제조 방법 및 반도체 장치 |
| CN109478016A (zh) * | 2016-07-27 | 2019-03-15 | 日立化成杜邦微系统股份有限公司 | 感光性树脂组合物、其固化物、层间绝缘膜、表面保护膜和电子部件 |
| KR101892170B1 (ko) * | 2016-11-08 | 2018-08-27 | 울산과학기술원 | 전기화학 소자용 보호막, 이의 제조 방법 및 및 이를 포함하는 전기화학 소자 |
| TWI614574B (zh) * | 2017-01-03 | 2018-02-11 | 台虹科技股份有限公司 | 感光性組成物 |
| JP2018203959A (ja) | 2017-06-09 | 2018-12-27 | 日鉄ケミカル＆マテリアル株式会社 | ポリイミド及び感光性樹脂組成物 |
-
2020
- 2020-07-27 CN CN202080053940.0A patent/CN114207520B/zh active Active
- 2020-07-27 KR KR1020217041973A patent/KR102716758B1/ko active Active
- 2020-07-27 WO PCT/JP2020/028701 patent/WO2021020344A1/ja not_active Ceased
- 2020-07-27 JP JP2020542921A patent/JP7552360B2/ja active Active
- 2020-07-29 TW TW109125633A patent/TWI855121B/zh active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06282071A (ja) * | 1993-01-27 | 1994-10-07 | Japan Synthetic Rubber Co Ltd | 感放射線性樹脂組成物 |
| US20150344627A1 (en) * | 2012-11-20 | 2015-12-03 | Designer Molecules, Inc. | Low modulus negative tone, aqueous developable photoresist |
| WO2017030070A1 (ja) * | 2015-08-20 | 2017-02-23 | 東レ株式会社 | アンテナ基板の製造方法、配線と電極付きアンテナ基板の製造方法およびｒｆｉｄ素子の製造方法 |
| JP2019031597A (ja) * | 2017-08-07 | 2019-02-28 | 東レ株式会社 | 樹脂組成物、硬化膜、半導体装置および半導体装置の製造方法 |
| JP2020029504A (ja) * | 2018-08-22 | 2020-02-27 | 日立化成株式会社 | 硬化性組成物 |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI855121B (zh) | 2024-09-11 |
| KR102716758B1 (ko) | 2024-10-15 |
| JP7552360B2 (ja) | 2024-09-18 |
| CN114207520B (zh) | 2025-12-05 |
| WO2021020344A1 (ja) | 2021-02-04 |
| TW202106766A (zh) | 2021-02-16 |
| CN114207520A (zh) | 2022-03-18 |
| KR20220042060A (ko) | 2022-04-04 |
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