JP7448038B2 - 半導体ユニット及び半導体装置 - Google Patents
半導体ユニット及び半導体装置 Download PDFInfo
- Publication number
- JP7448038B2 JP7448038B2 JP2022571927A JP2022571927A JP7448038B2 JP 7448038 B2 JP7448038 B2 JP 7448038B2 JP 2022571927 A JP2022571927 A JP 2022571927A JP 2022571927 A JP2022571927 A JP 2022571927A JP 7448038 B2 JP7448038 B2 JP 7448038B2
- Authority
- JP
- Japan
- Prior art keywords
- circuit pattern
- semiconductor
- main current
- semiconductor unit
- current direction
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000004065 semiconductor Substances 0.000 title claims description 562
- 239000000919 ceramic Substances 0.000 description 81
- 230000004048 modification Effects 0.000 description 30
- 238000012986 modification Methods 0.000 description 30
- 229910052751 metal Inorganic materials 0.000 description 26
- 239000002184 metal Substances 0.000 description 26
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 16
- 229910000679 solder Inorganic materials 0.000 description 16
- 150000002739 metals Chemical class 0.000 description 9
- 239000000758 substrate Substances 0.000 description 9
- 230000017525 heat dissipation Effects 0.000 description 8
- 239000000463 material Substances 0.000 description 8
- 229910052759 nickel Inorganic materials 0.000 description 8
- 238000007747 plating Methods 0.000 description 8
- 238000001816 cooling Methods 0.000 description 6
- 229910052802 copper Inorganic materials 0.000 description 6
- 239000010949 copper Substances 0.000 description 6
- 229920005989 resin Polymers 0.000 description 6
- 239000011347 resin Substances 0.000 description 6
- 229910000521 B alloy Inorganic materials 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 229910001096 P alloy Inorganic materials 0.000 description 5
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 5
- 229910045601 alloy Inorganic materials 0.000 description 5
- 239000000956 alloy Substances 0.000 description 5
- QDWJUBJKEHXSMT-UHFFFAOYSA-N boranylidynenickel Chemical compound [Ni]#B QDWJUBJKEHXSMT-UHFFFAOYSA-N 0.000 description 5
- 238000005260 corrosion Methods 0.000 description 5
- 230000007797 corrosion Effects 0.000 description 5
- 238000009413 insulation Methods 0.000 description 5
- OFNHPGDEEMZPFG-UHFFFAOYSA-N phosphanylidynenickel Chemical compound [P].[Ni] OFNHPGDEEMZPFG-UHFFFAOYSA-N 0.000 description 5
- 238000007789 sealing Methods 0.000 description 5
- 229910052709 silver Inorganic materials 0.000 description 5
- 239000004332 silver Substances 0.000 description 5
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 239000000945 filler Substances 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- 239000000470 constituent Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000004519 grease Substances 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 229910044991 metal oxide Inorganic materials 0.000 description 2
- 150000004706 metal oxides Chemical class 0.000 description 2
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 2
- -1 polybutylene terephthalate Polymers 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 2
- 229910010271 silicon carbide Inorganic materials 0.000 description 2
- 239000004734 Polyphenylene sulfide Substances 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- XECAHXYUAAWDEL-UHFFFAOYSA-N acrylonitrile butadiene styrene Chemical compound C=CC=C.C=CC#N.C=CC1=CC=CC=C1 XECAHXYUAAWDEL-UHFFFAOYSA-N 0.000 description 1
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 1
- 239000004676 acrylonitrile butadiene styrene Substances 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000005669 field effect Effects 0.000 description 1
- 230000014509 gene expression Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 1
- 229920006122 polyamide resin Polymers 0.000 description 1
- 229920002961 polybutylene succinate Polymers 0.000 description 1
- 239000004631 polybutylene succinate Substances 0.000 description 1
- 229920001707 polybutylene terephthalate Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000069 polyphenylene sulfide Polymers 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical group N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 229910001928 zirconium oxide Inorganic materials 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49838—Geometry or layout
- H01L23/49844—Geometry or layout for devices being provided for in H01L29/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
- H01L23/5386—Geometry or layout of the interconnection structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
- H01L25/0655—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
- H01L25/072—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/18—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4801—Structure
- H01L2224/48011—Length
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
- H01L2224/48139—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate with an intermediate bond, e.g. continuous wire daisy chain
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/4901—Structure
- H01L2224/4903—Connectors having different sizes, e.g. different diameters
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
- H01L2224/49111—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting two common bonding areas, e.g. Litz or braid wires
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
- H01L2224/49113—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49175—Parallel arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/91—Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups H01L2224/80 - H01L2224/90
- H01L2224/92—Specific sequence of method steps
- H01L2224/922—Connecting different surfaces of the semiconductor or solid-state body with connectors of different types
- H01L2224/9222—Sequential connecting processes
- H01L2224/92242—Sequential connecting processes the first connecting process involving a layer connector
- H01L2224/92247—Sequential connecting processes the first connecting process involving a layer connector the second connecting process involving a wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/73—Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/91—Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups H01L24/80 - H01L24/90
- H01L24/92—Specific sequence of method steps
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/102—Material of the semiconductor or solid state bodies
- H01L2924/1025—Semiconducting materials
- H01L2924/10251—Elemental semiconductors, i.e. Group IV
- H01L2924/10253—Silicon [Si]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/102—Material of the semiconductor or solid state bodies
- H01L2924/1025—Semiconducting materials
- H01L2924/1026—Compound semiconductors
- H01L2924/1027—IV
- H01L2924/10272—Silicon Carbide [SiC]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1203—Rectifying Diode
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1305—Bipolar Junction Transistor [BJT]
- H01L2924/13055—Insulated gate bipolar transistor [IGBT]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19107—Disposition of discrete passive components off-chip wires
Description
以下、図面を参照して、第1の実施の形態の半導体装置について、図1~図3を用いて説明する。図1は、第1の実施の形態の半導体装置に含まれる半導体ユニットの平面図であり、図2は、第1の実施の形態の半導体装置に含まれる半導体ユニットの断面図である。また、図3は、第1の実施の形態の半導体装置に含まれる半導体ユニットの別の平面図である。なお、図2は、図1の一点鎖線X-Xにおける断面図である。
変形例1では、図4及び図5に示した半導体ユニット10a,10bをさらにもう一組接続させた場合について、図8を用いて説明する。図8は、第1の実施の形態の変形例1の半導体装置の平面図である。なお、図8の半導体装置1aに含まれる半導体ユニット10a,10bは、図1~図5で説明したものと同様であるため、符号の図示並びに詳細な説明については省略する。また、半導体装置1aの半導体ユニット10a,10bには、便宜的に、+Y方向に沿って、Y1~Y4を対応付けている。
変形例2では、図4及び図5に示した半導体ユニット10a,10bの外側に半導体ユニット10a,10bをそれぞれ接続させた場合について、図9を用いて説明する。図9は、第1の実施の形態の変形例2の半導体装置の平面図である。なお、図9の半導体装置1bに含まれる半導体ユニット10a,10bは、図1~図5で説明したものと同様であるため、符号の図示並びに詳細な説明については省略する。また、半導体装置1bの半導体ユニット10a,10bには、便宜的に、+Y方向に沿って、Y1~Y4を対応付けている。
変形例3では、図4及び図5に示した半導体ユニット10a,10bを縦方向(X方向)に配置させた場合について、図10及び図11を用いて説明する。図10及び図11は、第1の実施の形態の変形例3の半導体装置の平面図である。なお、図10の半導体装置1cに含まれる半導体ユニット10a,10bは、図1~図5で説明したものと同様であるため、符号の図示並びに詳細な説明については省略する。また、図11は、図10の半導体装置1cをY方向に複数配列させた場合を示している。また、図10の半導体装置1cの半導体ユニット10a,10bには、便宜的に、-X方向に沿って、X1,X2を対応付けている。また、図11の半導体装置1dの半導体ユニット10a,10bには、便宜的に、-X方向及び+Yに沿って、X11,X12,X21,X22を対応付けている。
変形例4では、図10に示した半導体装置1cにおいて、半導体ユニット10の配置方向を異ならせた場合について、図12及び図13を用いて説明する。図12及び図13は、第1の実施の形態の変形例4の半導体装置の平面図である。なお、図12の半導体装置1e1,1e2に含まれる半導体ユニット10a,10bは、図1~図5で説明したものと同様であるため、符号の図示並びに詳細な説明については省略する。また、図12では、バスバーの記載を省略している。また、図12(A)では、半導体ユニット10a,10bを、図12(B)では、半導体ユニット10b,10aを-X方向に沿って配置した場合をそれぞれ示している。また、それぞれに-X方向に沿って、X1,X2を対応付けている。また、図13の半導体装置1eの半導体ユニット10a,10bには、便宜的に、-X方向及び+Y方向に沿って、X11,X12,X21,X22を対応付けている。
変形例5では、図1に示した半導体ユニット10を同じ向きにしてY方向に複数に配置させた場合について、図14及び図15を用いて説明する。図14及び図15は、第1の実施の形態の変形例5の半導体装置の平面図である。なお、図14及び図15の半導体装置1f,1gに含まれる半導体ユニット10a,10bは、図1~図5で説明したものと同様であるため、符号の図示並びに詳細は説明については省略する。また、図14は、半導体装置1に含まれる主電流方向D1が同一の+X方向を向いた半導体ユニット10aを2組Y方向に配列させた場合を示している。また、図15は、半導体装置1に含まれる主電流方向D1が同一の-X方向を向いた半導体ユニット10bを2組Y方向に配列させた場合を示している。なお、半導体装置1f,1gに含まれる半導体ユニット10a,10a並びに半導体ユニット10b,10bには、便宜的に、+Y方向に沿って、Y1,Y2を対応付けている。
第2の実施の形態では、第1の実施の形態において半導体チップとしてRC-IGBTに代わり、スイッチング素子及びダイオード素子の2種の半導体チップを用いる場合について図16を用いて説明する。図16は、第2の実施の形態の半導体装置に含まれる半導体ユニットの平面図である。なお、第2の実施の形態の半導体ユニット11は、半導体チップ30a,30b以外は、半導体ユニット10と同様の構成を成している。このため、半導体ユニット11の構成部品で、半導体ユニット10と同様なものには同様に符合を付し、それらの説明は簡略化または省略する。なお、半導体ユニット11において、センス連結用の回路パターン23e及びゲート連結用の回路パターン23fがなくてもよい。こうすることで、さらに基板面積を縮小できる。
第3の実施の形態は、第1の実施の形態の半導体ユニット10と異なる回路パターンである場合について図17を用いて説明する。図17は、第3の実施の形態の半導体装置に含まれる半導体ユニットの平面図である。なお、第3の実施の形態の半導体ユニット12は、半導体ユニット10に対して、回路パターン23a,23cの形状を変えて、回路パターン23c,23dの配置位置を入れ替え、また、回路パターン23e,23fの配置位置を入れ替えている。また、半導体ユニット12の構成部品で、半導体ユニット10と同様なものには同様に符合を付し、それらの説明は省略し、半導体ユニット10に対して異なる構成部品について説明する。
10,10a,10b,11,12 半導体ユニット
20 セラミックス回路基板
21 セラミックス板
21a 第1辺
21b 第2辺
21c 第3辺
21d 第4辺
22 金属板
23a,23b,23c,23d,23e,23f 回路パターン
23a1 窪み部
23a2 入力端子領域
23a3 突出領域
23b2 出力端子領域
23c1 コンタクト領域
30,30a,30b 半導体チップ
31 制御電極
32 出力電極
41 主電流ワイヤ
42 制御ワイヤ
44a,44b 制御連結ワイヤ
45a,45b センス連結ワイヤ
46 センスワイヤ
50a,50b,50c,50c1,50c2 バスバー
51a,51b,51c,51c1,51c2 脚部
52a,52b,52c,52c1,52c2 配線部
Claims (22)
- おもて面に出力電極と制御電極が設けられ、裏面に入力電極が設けられた複数の半導体チップと、
平面視で、対向する第1辺及び第2辺と前記第1辺及び前記第2辺に直交して対向する第3辺及び第4辺とで囲まれた矩形状を成す絶縁板と、前記絶縁板のおもて面に形成された出力回路パターンと、前記絶縁板のおもて面に形成され前記複数の半導体チップの裏面が接合される入力回路パターンとを含む絶縁回路基板と、
を有し、
前記出力回路パターン及び前記入力回路パターンは、前記第3辺から前記第4辺に渡ってそれぞれ形成され、さらに、前記第1辺から前記第2辺に向かう主電流方向に前記入力回路パターン、前記出力回路パターンの順に並んで形成され、
前記入力回路パターンは、前記絶縁回路基板の中央において、前記第3辺から前記第4辺に渡って前記複数の半導体チップが並んで接合される領域を備える、
半導体ユニット。 - 前記出力電極と前記出力回路パターンとを前記主電流方向に沿って接続する出力配線部材をさらに有する、
請求項1に記載の半導体ユニット。 - 前記絶縁板のおもて面において、前記入力回路パターンに対して前記主電流方向の反対方向にて形成され、前記入力回路パターンに設けられた前記複数の半導体チップの前記制御電極に電気的に接続される第1制御回路パターンと、
前記絶縁板のおもて面において、前記出力回路パターンに対して前記主電流方向に形成され、前記入力回路パターンに設けられた前記複数の半導体チップの前記制御電極に電気的に接続されることがない第2制御回路パターンと、
をさらに有する、
請求項2に記載の半導体ユニット。 - 前記第1制御回路パターンは、前記入力回路パターンに隣接して形成されている、
請求項3に記載の半導体ユニット。 - 前記制御電極と前記第1制御回路パターンとを前記主電流方向に沿って接続する制御配線部材をさらに有する、
請求項3または4に記載の半導体ユニット。 - 前記絶縁板のおもて面において、前記入力回路パターンに対して前記主電流方向の反対方向にて形成され、前記入力回路パターンに設けられた前記複数の半導体チップの前記出力電極に電気的に接続される第1センス回路パターンと、
前記絶縁板のおもて面において、前記出力回路パターンに対して前記主電流方向に形成され、前記入力回路パターンに設けられた前記複数の半導体チップの前記制御電極に電気的に接続されることがない第2センス回路パターンと、
をさらに有する、
請求項3乃至5のいずれかに記載の半導体ユニット。 - 前記出力電極と前記第1センス回路パターンとを前記主電流方向に沿って接続するセンス配線部材をさらに有する、
請求項6に記載の半導体ユニット。 - 前記第1制御回路パターンと前記第2制御回路パターンとは、前記主電流方向に直交する中心線に対して線対称の位置に形成され、前記第1辺及び前記第2辺から等距離に形成されている、
請求項3乃至7のいずれかに記載の半導体ユニット。 - 前記第1センス回路パターンと前記第2センス回路パターンとは、前記主電流方向に直交する中心線から等距離に形成され、前記第1辺及び前記第2辺から等距離に形成されている、
請求項6または7に記載の半導体ユニット。 - 前記第1制御回路パターンは前記入力回路パターンに隣接して形成され、
前記第2制御回路パターンは前記出力回路パターンに隣接して形成されている、
請求項3乃至9のいずれかに記載の半導体ユニット。 - 前記第1センス回路パターンは前記第1制御回路パターンの外側に隣接して形成され、
前記第2センス回路パターンは前記第2制御回路パターンの外側に隣接して形成されている、
請求項6、7または9に記載の半導体ユニット。 - 前記第1制御回路パターンは、前記入力回路パターンの前記第3辺及び前記第4辺に平行な端部に渡って形成され、
前記第1センス回路パターンは、平面視でU字状を成し、前記第1制御回路パターンを囲んで、前記第3辺から前記第4辺に渡って形成されている、
請求項6、7または9に記載の半導体ユニット。 - 前記第2制御回路パターンと前記第2センス回路パターンとは、それぞれ、前記第3辺から前記第4辺に渡って形成されている、
請求項6、7または9に記載の半導体ユニット。 - 前記入力回路パターンに入力端子領域が設けられ、
前記出力回路パターンに出力端子領域が設けられ、
前記入力端子領域と前記出力端子領域とが、前記主電流方向に直交する中心線から等距離に設けられ、前記第1辺及び前記第2辺から略等距離にそれぞれ設けられている、
請求項1乃至13のいずれかに記載の半導体ユニット。 - 前記入力回路パターンの前記複数の半導体チップに対して前記主電流方向の反対方向に複数の入力端子領域が設けられ、
前記複数の入力端子領域は、前記反対方向に対して直交する方向に沿って一列に配置されている、
請求項1に記載の半導体ユニット。
- 前記複数の半導体チップは、前記制御電極が前記主電流方向に平行な中心線を向いて、または、前記中心線の外側を向いて前記入力回路パターンにそれぞれ接合されている、
請求項1に記載の半導体ユニット。 - 第1アーム部を構成する前記半導体ユニットと第2アーム部を構成する前記半導体ユニットとを含み、
前記第1アーム部を構成する前記半導体ユニットと前記第2アーム部を構成する前記半導体ユニットは、異なる絶縁回路基板で構成されており、
前記第1アーム部を構成する前記半導体ユニットの前記主電流方向と前記第2アーム部を構成する前記半導体ユニットの前記主電流方向とが、反対方向を向いた状態で備えられている、
請求項1乃至16のいずれかに記載の半導体ユニットを含む半導体装置。 - 前記第1アーム部と前記第2アーム部とはそれぞれの前記第3辺及び前記第4辺が対向して隣接している、
請求項17に記載の半導体装置。 - 前記第1アーム部は前記第2アーム部の反対側に、前記主電流方向に直交する方向に複数並んで配置され、
前記第2アーム部は前記第1アーム部の反対側に、前記主電流方向に直交する方向に複数並んで配置されている、
請求項18に記載の半導体装置。 - 前記第1アーム部と前記第2アーム部とが前記主電流方向に直交する方向に互い違いに複数並んで配置されている、
請求項17に記載の半導体装置。 - 前記半導体ユニットは、
前記絶縁板のおもて面において、前記入力回路パターンに対して前記主電流方向の反対方向にて形成された第1制御回路パターンと、
前記絶縁板のおもて面において、前記出力回路パターンに対して前記主電流方向に形成された、第2制御回路パターンと、
をさらに有し、
前記第1アーム部の前記第1制御回路パターンと前記第2アーム部の前記第2制御回路パターンとが電気的に接続されて、
前記第1アーム部の前記第2制御回路パターンと前記第2アーム部の前記第1制御回路パターンとが電気的に接続されている、
請求項17に記載の半導体装置。 - 前記第1アーム部と前記第2アーム部とは前記第1アーム部の前記第1辺と前記第2アーム部の前記第1辺とが対向し、または、前記第1アーム部の前記第2辺と前記第2アーム部の前記第2辺とが対向して隣接している、
請求項17に記載の半導体装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2024028773A JP2024051117A (ja) | 2020-12-21 | 2024-02-28 | 半導体ユニット及び半導体装置 |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2020210958 | 2020-12-21 | ||
JP2020210958 | 2020-12-21 | ||
PCT/JP2021/040283 WO2022137811A1 (ja) | 2020-12-21 | 2021-11-01 | 半導体ユニット及び半導体装置 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2024028773A Division JP2024051117A (ja) | 2020-12-21 | 2024-02-28 | 半導体ユニット及び半導体装置 |
Publications (3)
Publication Number | Publication Date |
---|---|
JPWO2022137811A1 JPWO2022137811A1 (ja) | 2022-06-30 |
JPWO2022137811A5 JPWO2022137811A5 (ja) | 2023-02-27 |
JP7448038B2 true JP7448038B2 (ja) | 2024-03-12 |
Family
ID=82159064
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2022571927A Active JP7448038B2 (ja) | 2020-12-21 | 2021-11-01 | 半導体ユニット及び半導体装置 |
JP2024028773A Pending JP2024051117A (ja) | 2020-12-21 | 2024-02-28 | 半導体ユニット及び半導体装置 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2024028773A Pending JP2024051117A (ja) | 2020-12-21 | 2024-02-28 | 半導体ユニット及び半導体装置 |
Country Status (5)
Country | Link |
---|---|
US (1) | US20230087499A1 (ja) |
JP (2) | JP7448038B2 (ja) |
CN (1) | CN115699308A (ja) |
DE (1) | DE112021001990T5 (ja) |
WO (1) | WO2022137811A1 (ja) |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003142689A (ja) | 2001-11-01 | 2003-05-16 | Mitsubishi Electric Corp | 半導体装置 |
JP2009284604A (ja) | 2008-05-20 | 2009-12-03 | Toyota Industries Corp | 電力変換装置 |
JP2012186910A (ja) | 2011-03-04 | 2012-09-27 | Toyota Central R&D Labs Inc | 電力変換用モジュール |
WO2013002249A1 (ja) | 2011-06-27 | 2013-01-03 | ローム株式会社 | 半導体モジュール |
WO2018056213A1 (ja) | 2016-09-23 | 2018-03-29 | 三菱電機株式会社 | 電力用半導体モジュール及び電力用半導体装置 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3228839B2 (ja) * | 1994-09-07 | 2001-11-12 | 株式会社日立製作所 | 電力用半導体装置 |
CN106415834B (zh) | 2014-11-28 | 2019-09-13 | 富士电机株式会社 | 半导体装置 |
JP7198168B2 (ja) * | 2019-07-19 | 2022-12-28 | 株式会社 日立パワーデバイス | パワー半導体モジュール |
-
2021
- 2021-11-01 WO PCT/JP2021/040283 patent/WO2022137811A1/ja active Application Filing
- 2021-11-01 CN CN202180039127.2A patent/CN115699308A/zh active Pending
- 2021-11-01 JP JP2022571927A patent/JP7448038B2/ja active Active
- 2021-11-01 DE DE112021001990.2T patent/DE112021001990T5/de active Pending
-
2022
- 2022-11-25 US US17/994,116 patent/US20230087499A1/en active Pending
-
2024
- 2024-02-28 JP JP2024028773A patent/JP2024051117A/ja active Pending
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003142689A (ja) | 2001-11-01 | 2003-05-16 | Mitsubishi Electric Corp | 半導体装置 |
JP2009284604A (ja) | 2008-05-20 | 2009-12-03 | Toyota Industries Corp | 電力変換装置 |
JP2012186910A (ja) | 2011-03-04 | 2012-09-27 | Toyota Central R&D Labs Inc | 電力変換用モジュール |
WO2013002249A1 (ja) | 2011-06-27 | 2013-01-03 | ローム株式会社 | 半導体モジュール |
WO2018056213A1 (ja) | 2016-09-23 | 2018-03-29 | 三菱電機株式会社 | 電力用半導体モジュール及び電力用半導体装置 |
Also Published As
Publication number | Publication date |
---|---|
CN115699308A (zh) | 2023-02-03 |
WO2022137811A1 (ja) | 2022-06-30 |
JPWO2022137811A1 (ja) | 2022-06-30 |
JP2024051117A (ja) | 2024-04-10 |
DE112021001990T5 (de) | 2023-01-19 |
US20230087499A1 (en) | 2023-03-23 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US10070528B2 (en) | Semiconductor device wiring pattern and connections | |
KR101926854B1 (ko) | 반도체 장치 | |
JP7060104B2 (ja) | 半導体装置 | |
JP2022179649A (ja) | 半導体装置及びその製造方法 | |
JP7201066B2 (ja) | 半導体装置 | |
JP2020009834A (ja) | 半導体装置 | |
US20230282622A1 (en) | Semiconductor device | |
JP7448038B2 (ja) | 半導体ユニット及び半導体装置 | |
WO2022059251A1 (ja) | 半導体装置 | |
JP7413720B2 (ja) | 半導体モジュール | |
JP7459465B2 (ja) | 半導体装置及び半導体装置の製造方法 | |
CN110943062A (zh) | 半导体装置 | |
WO2022259824A1 (ja) | 接合構造および半導体装置 | |
US20220330429A1 (en) | Semiconductor device and method of manufacturing the same | |
US20240047433A1 (en) | Semiconductor device | |
JP7192886B2 (ja) | 半導体装置 | |
US20230345637A1 (en) | Semiconductor device | |
JP2023128114A (ja) | 半導体装置 | |
JP2024013924A (ja) | 半導体モジュール | |
JP2022077747A (ja) | 半導体装置 | |
JP2024019932A (ja) | 半導体装置 | |
CN116913904A (zh) | 半导体模块 | |
JP2022188893A (ja) | 半導体装置 | |
JP2020107654A (ja) | 半導体装置 | |
JP2022190215A (ja) | 半導体装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A524 | Written submission of copy of amendment under article 19 pct |
Free format text: JAPANESE INTERMEDIATE CODE: A527 Effective date: 20221201 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20221209 |
|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20221209 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20230912 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20231109 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20240130 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20240212 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 7448038 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |